公开(公告)号：DE59802689D1

公开(公告)日：2002-02-21

申请号：DE59802689

申请日：1998-07-20

Applicant: ABB RESEARCH LTD

Inventor： ETTER PETER ,  STUCK DR ,  ZEHRINGER DR

IPC: H01L23/36 ,  H01L23/367 ,  H01L23/473 ,  H01L25/07 ,  H01L25/18

Abstract: The module (1) has a number of sub-modules (2) with at least one semiconducting chip (3) attached to the top of an electrically insulating, heat conducting substrate (6) with a thermal expansion coefficient matching that of the chip. One sub-module (2) directly in the substrate has a cooler (7) of a good thermal conductor. The cooler is embedded in the underside (6b) of the substrate.