公开(公告)号：DE59611245D1

公开(公告)日：2005-08-18

申请号：DE59611245

申请日：1996-07-26

Applicant: ABB RESEARCH LTD

Inventor： FALLER KURT ,  FREY DR ,  KESER HELMUT ,  STEINRUCK FERDINAND ,  ZEHRINGER DR

IPC: H01L23/48 ,  H01L23/49 ,  H01L25/07 ,  H01L25/18

Abstract: The module includes at least one semiconductor chip (2) provided with its respective main electrode pair (2,4). One electrode is provided on a ground plate (5) and the other is in contact with a plunger (8). Also provided are two main connectors (6,7) with the ground plate electrically connected to one of the connectors (6) and the plunger in contact with the other (7). The position of each plunger corresponds to the distance between the contacting electrode of each chip to the corresponding main connector. The plungers are installed between the electrode and connector and are held there by two solder layers (9,10).

公开(公告)号：DE59802689D1

公开(公告)日：2002-02-21

申请号：DE59802689

申请日：1998-07-20

Applicant: ABB RESEARCH LTD

Inventor： ETTER PETER ,  STUCK DR ,  ZEHRINGER DR

IPC: H01L23/36 ,  H01L23/367 ,  H01L23/473 ,  H01L25/07 ,  H01L25/18

Abstract: The module (1) has a number of sub-modules (2) with at least one semiconducting chip (3) attached to the top of an electrically insulating, heat conducting substrate (6) with a thermal expansion coefficient matching that of the chip. One sub-module (2) directly in the substrate has a cooler (7) of a good thermal conductor. The cooler is embedded in the underside (6b) of the substrate.