Diluent free epoxy resin formulation
    2.
    发明公开
    Diluent free epoxy resin formulation 审中-公开
    VerdünnerfreieEpoxidharzformulierung

    公开(公告)号:EP1881033A1

    公开(公告)日:2008-01-23

    申请号:EP06405315.0

    申请日:2006-07-20

    Abstract: A diluent free epoxy resin formulation, which is suitable for the use as coil insulation material, wherein said formulation comprises (a) a purified grade of at least one diglycidyl ether of a bisphenol compound or at least one cycloaliphatic diglycidyl ether compound or a mixture of such compounds, wherein said compounds have an epoxy equivalent weight not exceeding 10% of the minimum epoxy equivalent weight calculated for each compound; and (b) that said formulation optionally further comprises up to 50% by weight of a diglycidyl ether of a bisphenol compound or of a cycloaliphatic diglycidyl ether compound or a novolac epoxy or a mixture of such compounds, wherein said compounds have an epoxy equivalent weight exceeding 10% of the minimum epoxy equivalent weight calculated for each compound; and (c) a polymerization catalyst; an electric conductor carrying an impregnated insulation layer insulated with a diluent free epoxy resin formulation as coil insulation material according to the invention.

    Abstract translation: 一种适用于线圈绝缘材料的无稀释剂环氧树脂配方,其中所述制剂包含(a)纯化级别的至少一种双酚化合物的二缩水甘油醚或至少一种脂环族二缩水甘油醚化合物或 这些化合物,其中所述化合物具有不超过为每种化合物计算的最小环氧当量的10%的环氧当量; 和(b)所述制剂任选地还包含至多50重量%的双酚化合物或脂环族二缩水甘油醚化合物或酚醛清漆环氧树脂的二缩水甘油醚或这些化合物的混合物,其中所述化合物具有环氧当量 超过每种化合物计算的最小环氧当量重量的10% 和(c)聚合催化剂; 承载用根据本发明的线圈绝缘材料的无稀释剂环氧树脂制剂绝缘的浸渍绝缘层的电导体。

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