公开(公告)号：EP2485256A2

公开(公告)日：2012-08-08

申请号：EP11163114.9

申请日：2011-04-20

Applicant: ABB Research Ltd.

Inventor： Kicin, Slavo ,  Schulz, Nicola ,  Rahimo, Munaf ,  Schnell, Raffael

IPC: H01L23/367 ,  H01L25/065

CPC classification number: H01L23/367 ,  H01L24/48 ,  H01L25/0655 ,  H01L25/072 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: The invention relates to a semiconductor device (1). In order to obtain a small and simple semiconductor device with efficient cooling, a first electrically conducting cooling element (2) is in contact with the first electrodes (8) of the semiconductor elements (4) for forwarding a heat load from the semiconductor elements (4) and for electrically connecting the first electrodes (8) of the semiconductor elements to an external apparatus. A second electrically conducting cooling element (3) is in contact with the second electrodes (13) of the semiconductor elements (4) for forwarding a heat load from the semiconductor elements (4) and for electrically connecting the second electrodes of the semiconductor elements (4) to an external apparatus. The semiconductor device (1) comprises an interface (12) which is electrically connected to gates of the semiconductor elements (4) for external control of the state of the semiconductor elements.

Abstract translation: 本发明涉及半导体器件（1）。 为了获得具有有效冷却的小而简单的半导体器件，第一导电冷却元件（2）与半导体元件（4）的第一电极（8）接触，用于转发来自半导体元件的热负荷（ 并且用于将半导体元件的第一电极（8）电连接到外部设备。 第二导电冷却元件（3）与半导体元件（4）的第二电极（13）接触，用于从半导体元件（4）传递热负载并用于电连接半导体元件的第二电极（ 4）到外部设备。 半导体器件（1）包括与半导体元件（4）的栅极电连接的接口（12），用于外部控制半导体元件的状态。

公开(公告)号：EP2485256A3

公开(公告)日：2018-01-03

申请号：EP11163114.9

申请日：2011-04-20

Applicant: ABB Research Ltd.

Inventor： Kicin, Slavo ,  Schulz, Nicola ,  Rahimo, Munaf ,  Schnell, Raffael

IPC: H01L23/367 ,  H01L25/065

CPC classification number: H01L23/367 ,  H01L24/48 ,  H01L25/0655 ,  H01L25/072 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: The invention relates to a semiconductor device (1). In order to obtain a small and simple semiconductor device with efficient cooling, a first electrically conducting cooling element (2) is in contact with the first electrodes (8) of the semiconductor elements (4) for forwarding a heat load from the semiconductor elements (4) and for electrically connecting the first electrodes (8) of the semiconductor elements to an external apparatus. A second electrically conducting cooling element (3) is in contact with the second electrodes (13) of the semiconductor elements (4) for forwarding a heat load from the semiconductor elements (4) and for electrically connecting the second electrodes of the semiconductor elements (4) to an external apparatus. The semiconductor device (1) comprises an interface (12) which is electrically connected to gates of the semiconductor elements (4) for external control of the state of the semiconductor elements.

Abstract translation: 本发明涉及一种半导体器件（1）。 为了获得具有高效冷却的小而简单的半导体器件，第一导电冷却元件（2）与半导体元件（4）的第一电极（8）接触，用于从半导体元件（ 4）并且用于将半导体元件的第一电极（8）电连接到外部装置。 第二导电冷却元件（3）与半导体元件（4）的第二电极（13）接触，用于传递来自半导体元件（4）的热负载并用于电连接半导体元件（4）的第二电极 4）到外部设备。 半导体器件（1）包括与半导体元件（4）的栅极电连接的接口（12），用于外部控制半导体元件的状态。