公开(公告)号：US12044576B2

公开(公告)日：2024-07-23

申请号：US17721496

申请日：2022-04-15

Applicant: ABB Schweiz AG

Inventor： Ralf Gitzel ,  Joerg Gebhardt ,  Joerg Ostrowski ,  Maciej Mruczek ,  Anastasios Papageorgiou

IPC: G01J5/00 ,  G01J5/02 ,  H04N5/33

CPC classification number: G01J5/0066 ,  G01J5/027 ,  H04N5/33 ,  G01J2005/0077

Abstract: A system and method includes an infrared camera; a processing unit; and an output unit. The infrared camera is configured to acquire a plurality of infrared images of the device, wherein the plurality of infrared images comprises a first infrared image and a second infrared image acquired a time period after the first infrared image. The processing unit is configured to determine a pixel in the first infrared image with a hottest temperature and determine a pixel in the second infrared image with a hottest temperature. The processing unit is configured to determine a first number of pixels in the first infrared image that have a temperature within a threshold temperature of the hottest temperature of the first infrared image and determine a second number of pixels in the second infrared image that have a temperature within the threshold temperature of the hottest temperature of the second infrared image.

公开(公告)号：US12034281B2

公开(公告)日：2024-07-09

申请号：US17720756

申请日：2022-04-14

Applicant: ABB Schweiz AG

Inventor： Joerg Ostrowski ,  Kai Hencken ,  Ralf Gitzel ,  Joerg Gebhardt ,  Oliver Becker ,  Maciej Mruczek ,  Tomas Kozel ,  Anastasios Papageorgiou

IPC: H02B13/065 ,  G01J5/00

CPC classification number: H02B13/065 ,  G01J5/0096

Abstract: A fault detection system and method includes a sensor; a processing unit; and an output unit. The sensor is configured to acquire temperature data at a sensor location of a device, wherein the temperature data comprises first temperature data and second temperature data acquired a first time period after the first temperature data. The processing unit determines a temperature magnitude comprising utilization of the first temperature data and/or the second temperature data, and determines a rate of change of temperature. The processing unit predicts a temperature at a location of the device using the temperature magnitude, the rate of change of temperature, and a correlation, wherein the correlation is a correlation of a plurality of temperature magnitudes and a plurality of rate of change of temperatures at the sensor location with a plurality of hotspot temperatures at the location.

公开(公告)号：US20220337037A1

公开(公告)日：2022-10-20

申请号：US17720756

申请日：2022-04-14

Applicant: ABB Schweiz AG

Inventor： Joerg Ostrowski ,  Kai Hencken ,  Ralf Gitzel ,  Joerg Gebhardt ,  Oliver Becker ,  Maciej Mruczek ,  Tomas Kozel ,  Anastasios Papageorgiou

IPC: H02B13/065 ,  G01J5/00

Abstract: A fault detection system and method includes a sensor; a processing unit; and an output unit. The sensor is configured to acquire temperature data at a sensor location of a device, wherein the temperature data comprises first temperature data and second temperature data acquired a first time period after the first temperature data. The processing unit determines a temperature magnitude comprising utilization of the first temperature data and/or the second temperature data, and determines a rate of change of temperature. The processing unit predicts a temperature at a location of the device using the temperature magnitude, the rate of change of temperature, and a correlation, wherein the correlation is a correlation of a plurality of temperature magnitudes and a plurality of rate of change of temperatures at the sensor location with a plurality of hotspot temperatures at the location.

公开(公告)号：US20220333992A1

公开(公告)日：2022-10-20

申请号：US17721496

申请日：2022-04-15

Applicant: ABB Schweiz AG

Inventor： Ralf Gitzel ,  Joerg Gebhardt ,  Joerg Ostrowski ,  Maciej Mruczek ,  Anastasios Papageorgiou

IPC: G01J5/00 ,  H04N5/33 ,  G01J5/02

Abstract: A system and method includes an infrared camera; a processing unit; and an output unit. The infrared camera is configured to acquire a plurality of infrared images of the device, wherein the plurality of infrared images comprises a first infrared image and a second infrared image acquired a time period after the first infrared image. The processing unit is configured to determine a pixel in the first infrared image with a hottest temperature and determine a pixel in the second infrared image with a hottest temperature. The processing unit is configured to determine a first number of pixels in the first infrared image that have a temperature within a threshold temperature of the hottest temperature of the first infrared image and determine a second number of pixels in the second infrared image that have a temperature within the threshold temperature of the hottest temperature of the second infrared image.