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    System for monitoring a device
    1.
    发明授权
    System for monitoring a device 有权

    公开(公告)号：US12044576B2

    公开(公告)日：2024-07-23

    申请号：US17721496

    申请日：2022-04-15

    Applicant: ABB Schweiz AG

    Inventor： Ralf Gitzel ,  Joerg Gebhardt ,  Joerg Ostrowski ,  Maciej Mruczek ,  Anastasios Papageorgiou

    IPC: G01J5/00 ,  G01J5/02 ,  H04N5/33

    CPC classification number: G01J5/0066 ,  G01J5/027 ,  H04N5/33 ,  G01J2005/0077

    Abstract: A system and method includes an infrared camera; a processing unit; and an output unit. The infrared camera is configured to acquire a plurality of infrared images of the device, wherein the plurality of infrared images comprises a first infrared image and a second infrared image acquired a time period after the first infrared image. The processing unit is configured to determine a pixel in the first infrared image with a hottest temperature and determine a pixel in the second infrared image with a hottest temperature. The processing unit is configured to determine a first number of pixels in the first infrared image that have a temperature within a threshold temperature of the hottest temperature of the first infrared image and determine a second number of pixels in the second infrared image that have a temperature within the threshold temperature of the hottest temperature of the second infrared image.

    System for Monitoring a Device
    2.
    发明申请
    System for Monitoring a Device 有权

    公开(公告)号：US20230026139A1

    公开(公告)日：2023-01-26

    申请号：US17868975

    申请日：2022-07-20

    Applicant: ABB Schweiz AG

    Inventor： Joerg Ostrowski ,  Stephan Wildermuth ,  Ralf Gitzel ,  Patrik Reto Kaufmann ,  Joerg Gebhardt ,  Kai Koenig ,  Boguslaw Samul

    IPC: G01J5/80

    Abstract: A system and method includes at least one temperature sensor, a processing unit, and an output unit. The temperature sensor acquires a temperature measurement at a first location of an operational device, which first location is in thermal contact with a second location of the operational device. The processing unit selects a simulated temperature distribution of the first location of a simulated device from a plurality of simulated temperature distributions of the first location and compares the temperature measurement with simulated temperature distributions of the first location, and determines whether a hot spot exists or is developing at the second location. The determination comprises utilization of a correlation between the simulated temperature distribution of the first location and the second location for the selected simulated temperature distribution of the first location of the simulated device.

    Fault detection system
    3.
    发明授权
    Fault detection system 有权

    公开(公告)号：US12034281B2

    公开(公告)日：2024-07-09

    申请号：US17720756

    申请日：2022-04-14

    Applicant: ABB Schweiz AG

    Inventor： Joerg Ostrowski ,  Kai Hencken ,  Ralf Gitzel ,  Joerg Gebhardt ,  Oliver Becker ,  Maciej Mruczek ,  Tomas Kozel ,  Anastasios Papageorgiou

    IPC: H02B13/065 ,  G01J5/00

    CPC classification number: H02B13/065 ,  G01J5/0096

    Abstract: A fault detection system and method includes a sensor; a processing unit; and an output unit. The sensor is configured to acquire temperature data at a sensor location of a device, wherein the temperature data comprises first temperature data and second temperature data acquired a first time period after the first temperature data. The processing unit determines a temperature magnitude comprising utilization of the first temperature data and/or the second temperature data, and determines a rate of change of temperature. The processing unit predicts a temperature at a location of the device using the temperature magnitude, the rate of change of temperature, and a correlation, wherein the correlation is a correlation of a plurality of temperature magnitudes and a plurality of rate of change of temperatures at the sensor location with a plurality of hotspot temperatures at the location.

    Fault Detection System
    5.
    发明申请
    Fault Detection System 有权

    公开(公告)号：US20220337037A1

    公开(公告)日：2022-10-20

    申请号：US17720756

    申请日：2022-04-14

    Applicant: ABB Schweiz AG

    Inventor： Joerg Ostrowski ,  Kai Hencken ,  Ralf Gitzel ,  Joerg Gebhardt ,  Oliver Becker ,  Maciej Mruczek ,  Tomas Kozel ,  Anastasios Papageorgiou

    IPC: H02B13/065 ,  G01J5/00

    Abstract: A fault detection system and method includes a sensor; a processing unit; and an output unit. The sensor is configured to acquire temperature data at a sensor location of a device, wherein the temperature data comprises first temperature data and second temperature data acquired a first time period after the first temperature data. The processing unit determines a temperature magnitude comprising utilization of the first temperature data and/or the second temperature data, and determines a rate of change of temperature. The processing unit predicts a temperature at a location of the device using the temperature magnitude, the rate of change of temperature, and a correlation, wherein the correlation is a correlation of a plurality of temperature magnitudes and a plurality of rate of change of temperatures at the sensor location with a plurality of hotspot temperatures at the location.

    System for Monitoring a Device
    6.
    发明申请
    System for Monitoring a Device 有权

    公开(公告)号：US20220333992A1

    公开(公告)日：2022-10-20

    申请号：US17721496

    申请日：2022-04-15

    Applicant: ABB Schweiz AG

    Inventor： Ralf Gitzel ,  Joerg Gebhardt ,  Joerg Ostrowski ,  Maciej Mruczek ,  Anastasios Papageorgiou

    IPC: G01J5/00 ,  H04N5/33 ,  G01J5/02

    Abstract: A system and method includes an infrared camera; a processing unit; and an output unit. The infrared camera is configured to acquire a plurality of infrared images of the device, wherein the plurality of infrared images comprises a first infrared image and a second infrared image acquired a time period after the first infrared image. The processing unit is configured to determine a pixel in the first infrared image with a hottest temperature and determine a pixel in the second infrared image with a hottest temperature. The processing unit is configured to determine a first number of pixels in the first infrared image that have a temperature within a threshold temperature of the hottest temperature of the first infrared image and determine a second number of pixels in the second infrared image that have a temperature within the threshold temperature of the hottest temperature of the second infrared image.

    SYSTEM FOR MONITORING A SWITCHGEAR
    7.
    发明申请
    SYSTEM FOR MONITORING A SWITCHGEAR 有权

    公开(公告)号：US20210065357A1

    公开(公告)日：2021-03-04

    申请号：US17005326

    申请日：2020-08-28

    Applicant: ABB Schweiz AG

    Inventor： Ralf Gitzel ,  Stephan Wildermuth ,  Joerg Gebhardt ,  Joerg Ostrowski ,  Patrik Kaufmann

    IPC: G06T7/00 ,  H04N5/33 ,  H04N7/18

    Abstract: A system for monitoring a switchgear includes: an infrared camera for acquiring at least one infrared image of the switchgear; a processing unit for determining a pixel in the at least one infrared image associated with a hottest temperature, determining e pixels in the at least one infrared image associated with a temperature that is within a threshold temperature of the hottest temperature, and determining that a hot spot exists in the switchgear as a determination, the determination being a utilization of the determined pixels in the at least one infrared image; and an output unit for outputting an indication of a fault in the switchgear based on the determined hot spot.

    Fault State Detection Apparatus
    10.
    发明申请
    Fault State Detection Apparatus 有权

    公开(公告)号：US20230043212A1

    公开(公告)日：2023-02-09

    申请号：US17970797

    申请日：2022-10-21

    Applicant: ABB Schweiz AG

    Inventor： Ralf Gitzel ,  Stephan Wildermuth ,  Joerg Gebhardt ,  Joerg Ostrowski ,  Patrik Reto Kaufmann

    IPC: G01N29/12 ,  G01J5/10 ,  G06T7/00

    Abstract: A fault state detection apparatus includes an input unit and a processing unit. The input unit receives condition monitoring data. The processing unit implements a trained machine learning algorithm to analyze the received condition monitoring data to determine if the received condition monitoring data is associated with a fault state. The trained machine learning algorithm was trained on the basis of a plurality of non-fault state condition monitoring data and associated ground truth information and on the basis of a plurality of fault state condition monitoring data and associated ground truth information. A subset of the plurality of fault state condition monitoring data was generated from one or more non-fault state condition monitoring data. Generation of fault state conditioning monitoring data in the subset of the plurality of fault state condition monitoring data comprises a transformation of non-fault state condition monitoring data to fault state condition monitoring data.

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