SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SUCH A SEMICONDUCTOR DEVICE
    1.
    发明公开
    SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SUCH A SEMICONDUCTOR DEVICE 审中-公开
    半导体器件和用于制造这种半导体器件的方法

    公开(公告)号:EP3176812A1

    公开(公告)日:2017-06-07

    申请号:EP15197558.8

    申请日:2015-12-02

    Applicant: ABB Schweiz AG

    Abstract: A wide bandgap semiconductor device is provided comprising an (n-) doped drift layer between a first main side (20) and a second main side (22). On the first main side (20), two n doped source regions (3, 3') which are laterally surrounded by p doped channel layers (4, 4') having a channel layer depth (40). A p+ doped well layer (5) having a well layer depth (50), which is at least as large as the channel layer depth (40) is arranged at the bottom of the source regions 3, 3'. A p++ doped plug (6) having a plug depth (60), which is as least as great as the well layer depth (50), and having a higher doping concentration than the well layer (5), is arranged between the two source regions (3, 3'). On the first side (12), a first main electrode (9) contacts as an ohmic contact at least the two source regions (3, 3') and the plug (6).

    Abstract translation: 提供宽带隙半导体器件,其包括在第一主侧(20)和第二主侧(22)之间的(n-)掺杂漂移层。 在第一主侧(20)上,由p沟道层深度(40)的p掺杂沟道层(4,4')横向围绕的两个n掺杂源极区(3,3')。 具有至少与沟道层深度(40)一样大的阱层深度(50)的p +掺杂阱层(5)被布置在源极区域3,3'的底部。 具有至少与阱层深度(50)一样大的插塞深度(60)并且具有比阱层(5)更高的掺杂浓度的p ++掺杂插塞(6)被布置在两个源极 区域(3,3')。 在第一侧(12)上,第一主电极(9)至少作为欧姆接触接触至少两个源区(3,3')和插塞(6)。

Patent Agency Ranking