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    HEAT SPREADER AND POWER MODULE
    6.
    发明公开
    HEAT SPREADER AND POWER MODULE 审中-公开
    散热器和功率模块

    公开(公告)号：EP3203512A1

    公开(公告)日：2017-08-09

    申请号：EP16154626.2

    申请日：2016-02-08

    Applicant: ABB Schweiz AG

    Inventor： Agostini, Bruno ,  Kearney, Daniel ,  Torresin, Daniele ,  Agostini, Francesco ,  Habert, Mathieu

    IPC: H01L23/36 ,  H01L23/46 ,  H01L23/473 ,  H01L23/427

    CPC classification number: H01L23/427

    Abstract: The invention relates to a heat spreader (1) comprising a base plate (2) for receiving a heat load from at least one electric component (3), the base plate including pulsating heat pipes (4) for fluid flow arranged therein, wherein the base plate (2) has a first side (A), and a second side (B) which is opposite to the first side (A); the pulsating heat pipes comprise a plurality of multichannel heat tubes (4) which are embedded side by side on the first side of the base plate (A); and the second side of the base plate (2) is provided for attaching the electric components (3). The invitation provides also a power module comprising the heat spreader.

    Abstract translation: 本发明涉及一种散热器（1），其包括用于接收来自至少一个电气部件（3）的热负载的基板（2），该基板包括布置在其中的用于流体流动的脉动热管（4），其中， （2）具有第一侧面（A）和与第一侧面（A）相对的第二侧面（B）。 所述脉动热管包括多个多通道热管（4），所述多个热管（4）并排埋置在所述基板（A）的所述第一侧上; 并且底板（2）的第二侧设置用于附接电气部件（3）。 邀请函还提供了一个由散热器组成的电源模块。

    TWO-PHASE COOLING DEVICE FOR COOLING AN ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE TWO-PHASE COOLING DEVICE
    7.
    发明公开
    TWO-PHASE COOLING DEVICE FOR COOLING AN ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE TWO-PHASE COOLING DEVICE 审中-公开

    公开(公告)号：EP4117402A1

    公开(公告)日：2023-01-11

    申请号：EP21183753.9

    申请日：2021-07-05

    Applicant: ABB SCHWEIZ AG

    Inventor： Petrov, Andrey ,  Sologubenko, Oleksandr ,  Torresin, Daniele ,  Agostini, Bruno

    IPC: H05K7/20 ,  F28D15/02

    Abstract: A two-phase cooling device (20) for cooling an electronic component is provided. The two-phase cooling device (20) comprises: a housing (22) surrounding a cavity (24), which has a top region (28) and a bottom region (30), with the bottom region (30) having a lower part (48) and an upper part (46); and a cooling medium (32) within the cavity (24) for cooling the electronic component by a phase transition from a liquid state to a gaseous state, wherein, when the cooling medium (32) is solely in the liquid state, the bottom region (30) is completely filled with the cooling medium (32) and the top region (28) is free from the cooling medium (32); wherein at least the lower part (48) of the bottom region (30) of the housing (22) is formed such that, if the cooling medium (32) freezes, the last part of the cooling medium (32) to freeze is an upper surface (38) of the cooling medium (32).

    METHOD OF FORMING A 3D-VAPOR CHAMBER
    9.
    发明公开
    METHOD OF FORMING A 3D-VAPOR CHAMBER 审中-公开

    公开(公告)号：EP3715766A1

    公开(公告)日：2020-09-30

    申请号：EP19165849.1

    申请日：2019-03-28

    Applicant: ABB Schweiz AG

    Inventor： Agostini, Bruno ,  Torresin, Daniele ,  Bortolato, Matteo

    IPC: F28D15/02

    Abstract: The invention relates to a method which is suited for manufacturing a 3D-vapor chamber (10) in a defined and efficient manner. Especially, the present method provides a solution for providing a vapor chamber (10) having an evaporator and a condenser made from a first part (12) and a second part (14), wherein continuity of internal structures is given which in turn provides an efficient working behaviour of the vapor chamber (10).

    POWER-ELECTRONIC MODULE ARRANGEMENT
    10.
    发明公开
    POWER-ELECTRONIC MODULE ARRANGEMENT 审中-公开
    电力电子模块布置

    公开(公告)号：EP3196586A1

    公开(公告)日：2017-07-26

    申请号：EP17150422.8

    申请日：2017-01-05

    Applicant: ABB Schweiz AG

    Inventor： Gradinger, Thomas ,  Agostini, Bruno ,  Agostini, Francesco ,  Habert, Mathieu ,  Torresin, Daniele

    IPC: F28F13/06 ,  F28D15/02 ,  F28F1/02 ,  H05K7/20

    CPC classification number: F28F13/06 ,  F28D15/0233 ,  F28D15/0266 ,  F28D15/0275 ,  F28F1/022 ,  H05K7/20145 ,  H05K7/20936

    Abstract: It is proposed a cooling unit (100) for a power electronic module arrangement. The cooling unit includes a two-phase heat exchanger (101) including a plurality of tube elements (120), each of which having at least one tube extending in a width direction (301) of the cooling unit, within and communicating between an evaporator portion (121) and a condenser portion (122) of the cooling unit (100). The tube elements are arranged in a spaced-apart manner along a depth direction (303) of the cooling unit forming cooling paths (213) for allowing an external cooling medium (130) to flow through the cooling paths, the cooling paths traversing the condenser portion in a length direction (302) of the cooling unit (100). The cooling unit further includes flow guides (141; 142) for forcing an external cooling medium (130) arriving at the heat exchanger through the cooling paths and then away from the cooling unit.

    Abstract translation: 提出了用于功率电子模块装置的冷却单元（100）。 该冷却单元包括两相热交换器（101），该两相热交换器包括多个管元件（120），每个管元件具有沿冷却单元的宽度方向（301）延伸的至少一个管，并且在蒸发器 部分（121）和冷却单元（100）的冷凝器部分（122）。 管元件沿着形成冷却路径（213）的冷却单元的深度方向（303）以隔开的方式布置，以允许外部冷却介质（130）流过冷却路径，冷却路径横穿冷凝器 部分在冷却单元（100）的长度方向（302）上。 冷却单元还包括用于迫使外部冷却介质（130）通过冷却路径到达热交换器并且然后远离冷却单元的流动引导件（141; 142）。

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