公开(公告)号：EP2587906B1

公开(公告)日：2019-10-09

申请号：EP12188559.4

申请日：2012-10-15

Applicant: ABB Schweiz AG

Inventor： Cottet, Didier ,  Agostini, Francesco ,  Gradinger, Thomas ,  Vögeli, Andreas

IPC: H05K7/20

公开(公告)号：EP2682957B1

公开(公告)日：2019-05-15

申请号：EP12174974.1

申请日：2012-07-04

Applicant: ABB Schweiz AG

Inventor： Agostini, Bruno ,  Kearney, Daniel ,  Agostini, Francesco ,  Habert, Mathieu

IPC: H01F27/18 ,  H01F27/08 ,  H01F27/24

公开(公告)号：EP3115728B1

公开(公告)日：2019-05-01

申请号：EP16175004.7

申请日：2016-06-17

Applicant: ABB Schweiz AG

Inventor： Agostini, Bruno ,  Torresin, Daniele ,  Agostini, Francesco ,  Riedel, Gernot ,  Habert, Mathieu

IPC: F28D15/02 ,  F28D15/04 ,  H01L23/427 ,  H05K7/20

公开(公告)号：EP3232470A1

公开(公告)日：2017-10-18

申请号：EP16165167.4

申请日：2016-04-13

Applicant: ABB Schweiz AG

Inventor： Agostini, Bruno ,  Torresin, Daniele ,  Agostini, Francesco ,  Habert, Mathieu ,  Rahimo, Munaf

IPC: H01L23/427 ,  H01L23/473 ,  F25B25/00 ,  H01L29/16 ,  H01L29/20 ,  H01L29/22

CPC classification number: H01L23/427 ,  F25B25/005 ,  H01L23/473 ,  H01L29/1608 ,  H01L29/2003 ,  H01L29/22 ,  H01L29/7393 ,  H01L29/78 ,  H05K7/20936

Abstract: A power device (10) comprises at least one power semiconductor module (12) comprising a wide bandgap semiconductor element (18); and a cooling system (16) for actively cooling the wide bandgap semiconductor element (18) with a cooling medium, wherein the cooling system (16) comprises a refrigeration device (40) for lowering a temperature of the cooling medium below an ambient temperature of the power device (10); wherein the cooling system (16) is adapted for lowering the temperature of the cooling medium in such a way that a temperature of the wide bandgap semiconductor (18) element is below 100° C.

Abstract translation: 功率器件（10）包括至少一个功率半导体模块（12），该功率半导体模块（12）包括宽带隙半导体元件（18）; 以及用冷却介质主动冷却宽带隙半导体元件（18）的冷却系统（16），其中冷却系统（16）包括用于将冷却介质的温度降低至低于环境温度的制冷设备（40） 该功率装置​​（10）; 其中所述冷却系统（16）适于以这样的方式降低所述冷却介质的温度，使得所述宽带隙半导体（18）元件的温度低于100℃

公开(公告)号：EP3203512B1

公开(公告)日：2019-05-08

申请号：EP16154626.2

申请日：2016-02-08

Applicant: ABB Schweiz AG

Inventor： Agostini, Bruno ,  Kearney, Daniel ,  Torresin, Daniele ,  Agostini, Francesco ,  Habert, Mathieu

IPC: H01L23/36 ,  H01L23/46 ,  H01L23/473 ,  H01L23/427

公开(公告)号：EP2677261B1

公开(公告)日：2018-10-10

申请号：EP12172752.3

申请日：2012-06-20

Applicant: ABB Schweiz AG

Inventor： Agostini, Francesco ,  Fabbri, Matteo ,  Gradinger, Thomas

IPC: F28D15/02 ,  F28F3/14 ,  H01L23/427 ,  H05K7/20

CPC classification number: H05K7/20309 ,  F28D15/0266 ,  F28D15/0275 ,  F28F3/14 ,  H01L23/3672 ,  H01L23/427 ,  H01L2924/0002 ,  H05K7/20318 ,  H05K7/20936 ,  H01L2924/00

Abstract: A two-phase heat exchanger for cooling at least one electronic and/or electric component with an evaporator and a condenser is provided. The evaporator is adapted to transfer heat from the electronic and/or electric component to a working fluid. The condenser comprises a roll-bonded panel, which has a first channel which has a first connection port and a second connection port. The evaporator has a second channel and first connection openings and second connection openings. The first connection port of the first channel is connected to one first connection opening of the evaporator and the second connection port of the first channel is connected to one second connection opening of the evaporator and the working fluid is provided in order to convey heat by means of convection from the evaporator to the condenser by flowing from the second channel through the first connection opening or the second connection opening of the evaporator towards the first channel.

公开(公告)号：EP3196586A1

公开(公告)日：2017-07-26

申请号：EP17150422.8

申请日：2017-01-05

Applicant: ABB Schweiz AG

Inventor： Gradinger, Thomas ,  Agostini, Bruno ,  Agostini, Francesco ,  Habert, Mathieu ,  Torresin, Daniele

IPC: F28F13/06 ,  F28D15/02 ,  F28F1/02 ,  H05K7/20

CPC classification number: F28F13/06 ,  F28D15/0233 ,  F28D15/0266 ,  F28D15/0275 ,  F28F1/022 ,  H05K7/20145 ,  H05K7/20936

Abstract: It is proposed a cooling unit (100) for a power electronic module arrangement. The cooling unit includes a two-phase heat exchanger (101) including a plurality of tube elements (120), each of which having at least one tube extending in a width direction (301) of the cooling unit, within and communicating between an evaporator portion (121) and a condenser portion (122) of the cooling unit (100). The tube elements are arranged in a spaced-apart manner along a depth direction (303) of the cooling unit forming cooling paths (213) for allowing an external cooling medium (130) to flow through the cooling paths, the cooling paths traversing the condenser portion in a length direction (302) of the cooling unit (100). The cooling unit further includes flow guides (141; 142) for forcing an external cooling medium (130) arriving at the heat exchanger through the cooling paths and then away from the cooling unit.

Abstract translation: 提出了用于功率电子模块装置的冷却单元（100）。 该冷却单元包括两相热交换器（101），该两相热交换器包括多个管元件（120），每个管元件具有沿冷却单元的宽度方向（301）延伸的至少一个管，并且在蒸发器 部分（121）和冷却单元（100）的冷凝器部分（122）。 管元件沿着形成冷却路径（213）的冷却单元的深度方向（303）以隔开的方式布置，以允许外部冷却介质（130）流过冷却路径，冷却路径横穿冷凝器 部分在冷却单元（100）的长度方向（302）上。 冷却单元还包括用于迫使外部冷却介质（130）通过冷却路径到达热交换器并且然后远离冷却单元的流动引导件（141; 142）。

公开(公告)号：EP3190371A1

公开(公告)日：2017-07-12

申请号：EP16150431.1

申请日：2016-01-07

Applicant: ABB Schweiz AG

Inventor： Torresin, Daniele ,  Agostini, Bruno ,  Agostini, Francesco ,  Gradinger, Thomas ,  Habert, Mathieu

IPC: F28D15/02 ,  F28F13/00 ,  F28F1/02 ,  H05K7/20

CPC classification number: H05K7/20309 ,  F28D15/0233 ,  F28D15/0266 ,  F28D15/0275 ,  F28F1/022 ,  F28F13/00 ,  F28F2270/00 ,  F28F2275/02 ,  H05K7/20318 ,  H05K7/20327 ,  H05K7/20336 ,  H05K7/20936

Abstract: It is proposed a two-phase heat exchanger device (100) for a power-electronic module arrangement having a semiconductor module. The two-phase heat exchanger device includes a base plate (110) configured for being in contact with a first semiconductor module (201) at a first side (123) of the base plate; and at least one tube element (120) for a first cooling medium (131) including a first portion (121) having at least one evaporator channel and a second portion (122) having at least one condenser channel. The base plate has a groove (111; 112) containing the tube element, wherein the groove is dimensioned for enabling thermal contact between the base plate and the first portion of the tube element and dimensioned to form a gap (113) between the base plate and the second portion of the tube element for thermal separation of the base plate and the second portion of the tube element.

Abstract translation: 提出了一种用于具有半导体模块的功率电子模块装置的两相热交换器装置（100）。 该两相热交换器装置包括基板（110），该基板构造成在基板的第一侧（123）处与第一半导体模块（201）接触; 和用于第一冷却介质（131）的至少一个管元件（120），所述第一冷却介质包括具有至少一个蒸发器通道的第一部分（121）和具有至少一个冷凝器通道的第二部分（122）。 基板具有容纳管元件的凹槽（111; 112），其中凹槽的尺寸设定为能够实现基板与管元件的第一部分之间的热接触，并且其尺寸被设计为在基板与基板之间形成间隙（113） 以及管件的第二部分，用于热分离底板和管件的第二部分。

公开(公告)号：EP3147621A1

公开(公告)日：2017-03-29

申请号：EP15186625.8

申请日：2015-09-24

Applicant: ABB Schweiz AG

Inventor： Agostini, Francesco ,  Torresin, Daniele ,  Habert, Mathieu ,  Agostini, Bruno

IPC: F28F9/02 ,  F28D15/02

CPC classification number: H05K7/20936 ,  F28D15/025 ,  F28D15/0266 ,  F28D15/0275 ,  F28F9/0278 ,  F28F13/10 ,  H05K7/209

Abstract: A cooling device for cooling at least two power electronic devices (4) by a working fluid (61). The cooling device has a heat receiver portion of the Pulsating Heat Pipe circuit system (60) and a pair of thermo-conducting walls provided on mutually opposite sides of the heat receiver arrangement (20) and sandwiching the heat receiver portion between them. These walls are adapted for being thermally connected to a respective one of the power electronic devices. The cooling device further has a heat dissipator arrangement (40) with a heat dissipator portion of the Pulsating Heat Pipe circuit system (60) and a plurality of fins (42) thermally coupled to the heat dissipator portion for transferring heat from the heat dissipator portion to an external cooling fluid for cooling the working fluid in the heat dissipator portion. The Pulsating Heat Pipe circuit system (60) connects the heat receiver portion with the heat dissipator portion for transferring heat from the heat receiver portion to the heat dissipator portion by the Pulsating Heat Pipe action of the working fluid.

Abstract translation: 用于由工作流体（61）的冷却的至少两个电力电子器件（4）的冷却装置。 所述冷却装置具有脉动热管电路系统（60）和设置在所述热接收器装置（20）和夹持在它们之间的热接收器部分的彼此相对的两侧的一对热传导壁的热接收器部分。 这些壁angepasst用于连接到一个热respectivement电力电子器件中的一个。 所述冷却装置还具有热从所述散热器的部分耦合到用于传递环热散热器部分的散热器装置（40）与所述脉动热管电路系统（60）的部分的散热器和散热片的多个（42） 到用于冷却所述工作流体在所述散热器中的部分的外部冷却流体。 脉动热管电路系统（60）与从所述工作流体的脉动热管作用在部分热接收器部分，以所述散热器的散热部用于传递环的热的接收器部分连接。

公开(公告)号：EP3144625A1

公开(公告)日：2017-03-22

申请号：EP15186080.6

申请日：2015-09-21

Applicant: ABB Schweiz AG

Inventor： Agostini, Bruno ,  Torresin, Daniele ,  Agostini, Francesco ,  Habert, Mathieu ,  Koivuluoma, Timo

IPC: F28F3/02 ,  F28D15/02 ,  F28D15/04 ,  H01L23/427 ,  H01L23/467

CPC classification number: F28D15/046 ,  F28D15/0233 ,  F28D15/0266 ,  F28D15/0275 ,  F28D15/0283 ,  F28D15/04 ,  F28D2021/0029 ,  F28F3/02 ,  F28F3/025 ,  F28F13/10 ,  F28F2215/06 ,  H01L23/427 ,  H01L23/467

Abstract: A cooling assembly comprising a plurality of fin elements (2) stacked in a stack direction (101), a plurality of coolant channels (4) each located between adjacent fin elements (2) and extending in a coolant channel direction (102) perpendicular to the stack direction (101), a first heat transfer surface (10) adapted to be in contact with a heat generating element (19), and a second heat transfer surface (20) spaced apart from the first heat transfer surface (10), the plurality of fin elements (2) and the plurality of coolant channels (4) being located between the first heat transfer surface (10) and the second heat transfer surface (20). Each of the fin elements (2) comprises a pulsating heat pipe (6) embedded therein, a main pulsating direction of each of the pulsating heat pipes (6) being substantially parallel to a normal of the first heat transfer surface (10).

Abstract translation: 一种冷却组件，包括沿堆叠方向（101）堆叠的多个翅片元件（2），多个冷却剂通道（4），每个冷却剂通道（4）各自位于相邻的翅片元件（2）之间并且沿着与冷却剂通道方向（102）垂直的方式延伸 堆叠方向（101），适于与发热元件（19）接触的第一传热表面（10）和与第一传热表面（10）间隔开的第二传热表面（20） 多个翅片元件（2）和多个冷却剂通道（4）位于第一传热表面（10）和第二传热表面（20）之间。 每个翅片元件（2）包括嵌入其中的脉动热管（6），每个脉动热管（6）的主脉动方向基本上平行于第一传热表面（10）的法线。