公开(公告)号：WO2006066138A2

公开(公告)日：2006-06-22

申请号：PCT/US2005045785

申请日：2005-12-17

Applicant: ADE CORP

Inventor： BARAN BRUCE ,  GAO SONGPING ,  BILLS RICHARD EARL ,  MURPHREE MICHAEL ,  KOLIOPOULOS CHRIS L

IPC: A61M25/00

CPC classification number: G01N21/9501 ,  G01N21/21 ,  G01N21/47 ,  G01N21/4738 ,  G01N21/474 ,  G01N21/55 ,  G01N21/88 ,  G01N21/8806 ,  G01N21/95 ,  G01N21/956 ,  G01N2021/4707 ,  G01N2021/4711 ,  G01N2021/4792 ,  G01N2021/556 ,  G01N2021/8809 ,  G01N2021/8848 ,  G01N2021/8864 ,  G01N2021/8877 ,  G01N2021/8896 ,  G01N2201/0612 ,  G01N2201/105 ,  G06T7/0004 ,  G06T2207/30148 ,  Y10T29/49826

Abstract: A surface inspection system, as well as related components and methods, are provided. The surface inspection system includes a beam source subsystem, a beam scanning subsystem, a workpiece movement subsystem, an optical collection and detection subsystem, and a processing subsystem. The system features a variable scan speed beam scanning subsystem, preferably using an acousto-optic deflector, with beam compensation, so that variable scanning speeds can be achieved. Also included are methods and systems for improving the signal to noise ratio by use of scatter reducing complements, and a system and method for selectively and repeatedly scanning a region of interest on the surface in order to provide additional observations of the region of interest.

Abstract translation: 提供了表面检查系统，以及相关的部件和方法。 表面检查系统包括光束源子系统，光束扫描子系统，工件移动子系统，光学收集和检测子系统以及处理子系统。 该系统具有可变扫描速度波束扫描子系统，优选地使用声光偏转器，具有光束补偿，使得可以实现可变的扫描速度。 还包括用于通过使用散射减少补充来提高信噪比的方法和系统，以及用于选择性地和重复地扫描表面上的感兴趣区域以便提供感兴趣区域的附加观察的系统和方法。

公开(公告)号：JP2005208042A

公开(公告)日：2005-08-04

申请号：JP2004308470

申请日：2004-10-22

Applicant: Ade Corp ,  エーディーイー コーポレーション

Inventor： JUDELL NEIL ,  MURPHREE MICHAEL

IPC: G01B11/02 ,  G01N21/95 ,  G01N21/956 ,  H01L21/66

CPC classification number: G01N21/9501

Abstract: PROBLEM TO BE SOLVED: To provide a system and method of inspecting semiconductor wafers capable of determining the height of a defect on a wafer surface whether or not the scattering power associated with the defect exceeds the dynamic range of the system.
SOLUTION: In the wafer defect inspection system, when the defect on the wafer surface is detected, the three-dimensional shape of the defect is regarded as a Gaussian shape. A plurality of cross-sectional areas of the Gaussian shape are defined, a respective value of each cross-sectional area is determined, and a respective value of the natural logarithm of intermediate heights of the Gaussian shape corresponding to the cross-sectional areas is determined. The cross-sectional area values are plotted as a function of the natural logarithm of the intermediate height values to form a substantially linear plot, a natural logarithm of the height value corresponding to a zero area value based on the substantially linear plot is determined, and the inverse natural logarithm of the value is determined to obtain the height of the Gaussian shape.
COPYRIGHT: (C)2005,JPO&NCIPI

Abstract translation: 要解决的问题：提供一种检查能够确定晶片表面上的缺陷的高度的半导体晶片的系统和方法，无论与缺陷相关联的散射功率是否超过系统的动态范围。 解决方案：在晶片缺陷检查系统中，当检测到晶片表面上的缺陷时，缺陷的三维形状被认为是高斯形状。 定义高斯形状的多个横截面面积，确定每个横截面积的相应值，并且确定与横截面积对应的高斯形状的中间高度的自然对数的相应值 。 将横截面积值绘制为中间高度值的自然对数的函数以形成基本上线性的图，确定基于基本上线性的绘图对应于零面积值的高度值的自然对数，以及 确定该值的反自然对数以获得高斯形状的高度。 版权所有（C）2005，JPO＆NCIPI

公开(公告)号：DE102004051842B4

公开(公告)日：2007-01-04

申请号：DE102004051842

申请日：2004-10-25

Applicant: ADE CORP

Inventor： JUDELL NEIL ,  MURPHREE MICHAEL

IPC: G01B11/02 ,  G01N21/95 ,  G01N21/956 ,  H01L21/66

Abstract: A system for inspecting semiconductor wafers capable of determining a scattering power associated with a wafer surface detect whether or not the scattering power exceeds the dynamic range of the system. The scattering power is obtained by determining the height of a Gaussian shape representing data collected by the system. The height is determined by defining a plurality of cross-sectional areas of the Gaussian shape, determining a value of each area, determining a value of the natural logarithm of intermediate heights of the Gaussian shape corresponding to the cross-sectional areas, plotting the area values as function of the natural logarithm of the intermediate height values to form a linear plot, determining a natural logarithm of the height value corresponding to a zero area value based on the linear plot, and determining the inverse natural logarithm of the value to obtain the height of the Gaussian shape.

公开(公告)号：DE102004051842A1

公开(公告)日：2005-12-08

申请号：DE102004051842

申请日：2004-10-25

Applicant: ADE CORP

Inventor： JUDELL NEIL ,  MURPHREE MICHAEL

IPC: G01B11/02 ,  G01N21/95 ,  G01N21/956 ,  H01L21/66

Abstract: A system for inspecting semiconductor wafers capable of determining a scattering power associated with a wafer surface detect whether or not the scattering power exceeds the dynamic range of the system. The scattering power is obtained by determining the height of a Gaussian shape representing data collected by the system. The height is determined by defining a plurality of cross-sectional areas of the Gaussian shape, determining a value of each area, determining a value of the natural logarithm of intermediate heights of the Gaussian shape corresponding to the cross-sectional areas, plotting the area values as function of the natural logarithm of the intermediate height values to form a linear plot, determining a natural logarithm of the height value corresponding to a zero area value based on the linear plot, and determining the inverse natural logarithm of the value to obtain the height of the Gaussian shape.