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    SILICON-CONTAINING CURING COMPOSITION AND CURED PRODUCT THEREOF
    1.
    发明专利
    SILICON-CONTAINING CURING COMPOSITION AND CURED PRODUCT THEREOF 未知

    公开(公告)号：MY163345A

    公开(公告)日：2017-09-15

    申请号：MYPI2014000190

    申请日：2012-06-05

    Applicant: ADEKA CORP

    Inventor： SAITO MASAKO ,  CHIBA RYOTA ,  KANAZAWA TAKUYA ,  HIRATSUKA ICHIRO ,  KANBAYASHI TAKAAKI

    IPC: C08L83/07 ,  C08K3/00 ,  C08K5/04 ,  C08K5/14 ,  C08L83/05 ,  H01L33/56

    Abstract: THE PRESENT INVENTION PROVIDES A SILICON-CONTAINING CURABLE COMPOSITION WHICH CONTAINS: A SPECIFIC AMOUNT OF A SILICON-CONTAINING POLYMER THAT IS OBTAINED BY THE HYDROLYSIS-CONDENSATION OF AN ORGANOSILANE MIXTURE CONTAINING SPECIFIC AMOUNTS OF ORGANOSILOXANES REPRESENTED BY FORMULA (1-1) TO FORMULA (1-5) AND THAT HAS AN MW OF 300-100,000; A SPECIFIC AMOUNT OF A PREPOLYMER THAT IS OBTAINED BY HYDROSILYLATING A CYCLIC SILOXANE COMPOUND REPRESENTED BY FORMULA (2) AND A COMPOUND REPRESENTED BY FORMULA (3-1), (3-2) OR (3-3) AND THAT HAS TWO OR MORE SI-H GROUPS IN EACH MOLECULE; A SPECIFIC AMOUNT OF A LINEAR SILOXANE COMPOUND THAT HAS TWO OR MORE CARBON-CARBON DOUBLE BONDS, EACH OF WHICH IS REACTIVE WITH AN SI-H GROUP, IN EACH MOLECULE; A SPECIFIC AMOUNT OF AN ORGANIC PEROXIDE AND A SPECIFIC AMOUNT OF A METAL CATALYST; AND A SPECIFIC AMOUNT OF A FILLER. IN THIS CONNECTION, FORMULA (1-1) TO FORMULA (1-5), FORMULA (2), AND FORMULA (3-1) TO FORMULA (3-3) ARE AS SPECIFICALLY DEFINED IN THE DESCRIPTION.

    Silicon-containing curable white resin composition, cured product thereof, and optical semiconductor package and reflecting material using the cured product
    5.
    发明专利
    Silicon-containing curable white resin composition, cured product thereof, and optical semiconductor package and reflecting material using the cured product 审中-公开
    含硅的可固化白色树脂组合物，其固化产品和光学半导体封装和使用固化产品的反射材料

    公开(公告)号：JP2013159776A

    公开(公告)日：2013-08-19

    申请号：JP2012025797

    申请日：2012-02-09

    Applicant: Adeka Corp ,  株式会社Adeka

    Inventor： SAITO MASAKO ,  CHIBA RYOTA ,  KANBAYASHI TAKAAKI

    IPC: C08L83/07 ,  C08K3/00 ,  C08K3/22 ,  C08K5/5425 ,  H01L33/60

    Abstract: PROBLEM TO BE SOLVED: To provide a silicon-containing curable white resin composition which is excellent in heat resistance, light resistance, cracking resistance and various mechanical and physical properties such as warpage and is useful as an optical semiconductor material or the like and to provide a cured product obtained by curing the silicon-containing curable white resin composition, and an optical semiconductor package and a reflecting material which are obtained by using the cured product.SOLUTION: A silicon-containing curable white resin composition contains: a polymer containing specific silicon; a prepolymer containing two or more Si-H groups in one molecule thereof; a linear siloxane compound containing two or more carbon-carbon double bonds, each of which has reactivity with the Si-H group or a Si-CH, in one molecule thereof; an organic peroxide; a metallic catalyst; and a filler or white pigment having specific particle size.

    Abstract translation: 要解决的问题：提供耐热性，耐光性，耐龟裂性以及翘曲等各种机械物理性质优异的含硅可固化白色树脂组合物，可用作光学半导体材料等，并提供 通过固化含硅可固化白色树脂组合物获得的固化产物，以及通过使用固化产物获得的光学半导体封装和反射材料。溶液：含硅可固化白色树脂组合物包含：含有特定硅的聚合物 ; 在其一个分子中含有两个或更多个Si-H基团的预聚物; 在其一个分子中含有两个以上的碳 - 碳双键的线性硅氧烷化合物，其各自与Si-H基或Si-CH具有反应性; 有机过氧化物; 金属催化剂; 和具有特定粒度的填料或白色颜料。

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