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1.SILICON-CONTAINING CURABLE COMPOSITION, CURED PRODUCT OF THE SILICON-CONTAINING CURABLE COMPOSITION AND LEAD FRAME SUBSTRATE FORMED OF THE SILICON-CONTAINING CURABLE COMPOSITION 审中-公开
Title translation: 含硅固化组合物,固化物从含硅固化性成分及含硅固化性组合物进行成型板基材公开(公告)号:EP2581417A4
公开(公告)日:2015-06-24
申请号:EP11792416
申请日:2011-06-06
Applicant: ADEKA CORP
Inventor: SAITO MASAKO , HIRATSUKA ICHIRO , WADA MASAHIRO , CHIBA RYOTA , KANAZAWA TAKUYA , YOSHIOKA OSAMU , TSUKAMOTO TAKEHITO , TODA JUNKO
CPC classification number: C08L83/06 , C08G77/12 , C08G77/20 , C08K5/0025 , C08K5/14 , C08K5/5425 , C08K5/549 , C08L83/04 , H01L23/057 , H01L23/49861 , H01L33/56 , H01L2224/45144 , H01L2224/48091 , H01L2224/73265 , H01L2924/00014 , H01L2924/00