Abstract:
THE PRESENT INVENTION PROVIDES A SILICON-CONTAINING CURABLE COMPOSITION WHICH CONTAINS: A SPECIFIC AMOUNT OF A SILICON-CONTAINING POLYMER THAT IS OBTAINED BY THE HYDROLYSIS-CONDENSATION OF AN ORGANOSILANE MIXTURE CONTAINING SPECIFIC AMOUNTS OF ORGANOSILOXANES REPRESENTED BY FORMULA (1-1) TO FORMULA (1-5) AND THAT HAS AN MW OF 300-100,000; A SPECIFIC AMOUNT OF A PREPOLYMER THAT IS OBTAINED BY HYDROSILYLATING A CYCLIC SILOXANE COMPOUND REPRESENTED BY FORMULA (2) AND A COMPOUND REPRESENTED BY FORMULA (3-1), (3-2) OR (3-3) AND THAT HAS TWO OR MORE SI-H GROUPS IN EACH MOLECULE; A SPECIFIC AMOUNT OF A LINEAR SILOXANE COMPOUND THAT HAS TWO OR MORE CARBON-CARBON DOUBLE BONDS, EACH OF WHICH IS REACTIVE WITH AN SI-H GROUP, IN EACH MOLECULE; A SPECIFIC AMOUNT OF AN ORGANIC PEROXIDE AND A SPECIFIC AMOUNT OF A METAL CATALYST; AND A SPECIFIC AMOUNT OF A FILLER. IN THIS CONNECTION, FORMULA (1-1) TO FORMULA (1-5), FORMULA (2), AND FORMULA (3-1) TO FORMULA (3-3) ARE AS SPECIFICALLY DEFINED IN THE DESCRIPTION.
Abstract:
A silicon-containing curing composition comprising a specific amount of a silicon-containing polymer having an Mw of 300 to 100,000 obtained by hydrolysis and condensation of an organosilane mixture containing specific amounts of organosiloxanes of formulae (1-1) through (1-5); a specific amount of a prepolymer containing at least two Si-H groups per molecule obtained by hydrosilylation between a cyclic siloxane compound of formula (2) and a compound of formula (3-1), (3-2), or (3-3); a specific amount of a linear siloxane compound containing more than one carbon-carbon double bond reactive with Si-H or Si-CH 3 per molecule; specific amounts of an organic peroxide and a metal catalyst; and a specific amount of a filler. The details for the formulae (1-1) to (1-5), (2), (3-1) to (3-3) are as described in the specification.
Abstract:
PROBLEM TO BE SOLVED: To provide a resin composition which can easily form thin resin films capable of sufficiently satisfying a gas barrier property and impact resistance, even after passing through a thermally drying process.SOLUTION: The resin composition contains (A) a compound represented by general formula (I) (wherein, X, Xand Xare each a 3-20C cycloalkyl; n, m and l are each 0-6), (B) a resin, (C) a charge transfer substance and (D) a solvent.
Abstract:
PROBLEM TO BE SOLVED: To provide a resin composition which can form a coating film having sufficient gas barrier property and wear resistance.SOLUTION: The resin composition includes: a compound (A) expressed by general formula (I); a resin (B); a charge transporting substance (C); and a solvent (D). In general formula (I), Xand Xeach represent a cycloalkyl group having 3 to 20 carbon atoms; n and m each represent an integer of 0 to 6; and Xand Xeach preferably represent a cyclohexyl group which may be substituted with an alkyl group having 1 to 3 carbon atoms.