公开(公告)号：KR20180072688A

公开(公告)日：2018-06-29

申请号：KR20187010763

申请日：2016-08-22

Applicant: ADEKA CORP

Inventor： MASAMOTO YUJI ,  SAIO YOSHIHIDE ,  AOKI TAMAMI

IPC: C09K13/06 ,  C23F1/18 ,  H01L21/306

CPC classification number: C23F1/18 ,  H01L21/306 ,  H01L21/308 ,  H05K3/06

Abstract: 본발명은식각액조성물에관한것이고, 구리기반층을포함하는코팅필름의시각에사용된다. 본식각액조성물은 (A) 철이온(ferric ions) 및구리이온(cupric ion) 중으로부터선택된적어도하나의타입산화제0.1 내지 30 질량%; (B) 염화수소(hydrogen chloride) 0.1 내지 20 질량%; 및(C) 1,3-디히드록시벤젠(1,3-dihydroxybenzene) 0.01 내지 25 질량%;을포함하는수용액(aqueous solution)으로구성된다. 본발명의식각방법에서, 기판상에형성되고, 구리기반층을포함하는코팅필름은식각액조성물을사용하여식각된다. 본발명에따른식각액조성물및 식각방법은바람직한치수정확성을갖는배선패턴을형성하고, 또한높은안정성및 석출물생성의억제를제공한다.

公开(公告)号：JP2017084873A

公开(公告)日：2017-05-18

申请号：JP2015209028

申请日：2015-10-23

Applicant: 株式会社Adeka ,  Adeka Corp ,  株式会社Adeka

Inventor： MASAMOTO YUJI ,  SAIBI YOSHIHIDE ,  AOKI TAMAMI

IPC: H01L21/308 ,  C23F1/18 ,  H01L21/306

CPC classification number: C23F1/18 ,  H01L21/306 ,  H01L21/308 ,  H05K3/06

Abstract: 【課題】安定性が高く、沈殿物が発生し難いと共に、所望の寸法精度を有する配線パターンを形成することが可能なエッチング液組成物及びエッチング方法を提供する。【解決手段】本発明のエッチング液組成物は、銅系層を含む被膜のエッチングに用いられる。このエッチング液組成物は、(A)第二鉄イオン及び第二銅イオンから選ばれる少なくとも1種の酸化剤0.1〜30質量%;(B)塩化水素0.1〜20質量%;及び(C)1,3−ジヒドロキシベンゼン0.01〜25質量%を含む水溶液からなる。また、本発明のエッチング方法は、このエッチング液組成物を用いて、基体上に形成された銅系層を含む被膜をエッチングする。【選択図】なし

公开(公告)号：JP2014189834A

公开(公告)日：2014-10-06

申请号：JP2013066282

申请日：2013-03-27

Applicant: Adeka Corp ,  株式会社Adeka

Inventor： MASAMOTO YUJI ,  KISHI YUICHIRO

IPC: C23F1/16

Abstract: PROBLEM TO BE SOLVED: To provide an etchant composition with which, when collectively etching a laminate film consisting of an indium oxide-based coating film and a metal-based coating film, a reduction in a width of a formed fine line consisting of the indium oxide-based coating film and the metal-based coating film is small and mouse bites of the fine line are not caused.SOLUTION: An etchant composition for collectively etching a laminate layer consisting of an indium oxide-based coating film and a metal-based coating film consists of an aqueous solution containing (A) at least one or more kinds of oxidant components selected from ferric ion and cupric ion, (B) hydrochloric acid component, (C) at least one or more kinds of compound components selected from a group of compounds represented by following general formula (1) and straight or branched alcohols having 1 to 4 carbon atoms, and (D) at least one or more kinds of acid components selected from sulfuric acids or phosphoric acids. In the general formula (1), Rand Rare each independently hydrogen, or a straight or branched alkyl group having 1 to 4 carbon atoms, Ris a straight or branched alkylene group having 1 to 4 carbon atoms, and n is the number of 1 to 3.

Abstract translation: 要解决的问题：提供一种蚀刻剂组合物，当共同蚀刻由氧化铟基涂膜和金属基涂膜组成的层叠膜时，由铟构成的形成的细线的宽度减小 氧化物系涂膜和金属基涂膜小，并且不会引起细线的小鼠咬伤。溶解性：用于共同蚀刻由氧化铟基涂膜和金属基涂层组成的层压层的蚀刻剂组合物 涂膜由含有（A）至少一种或多种选自铁离子和铜离子的氧化剂成分的水溶液，（B）盐酸组分，（C）至少一种或多种选自以下的化合物组分的水溶液组成： 由以下通式（1）表示的化合物和具有1至4个碳原子的直链或支链醇，和（D）至少一种或多种选自硫酸或磷酸的酸组分。 在通式（1）中，兰德尔芳基各自独立地为氢，或具有1至4个碳原子的直链或支链烷基，R为具有1至4个碳原子的直链或支链亚烷基，n为1至 3。

公开(公告)号：JP2011017053A

公开(公告)日：2011-01-27

申请号：JP2009162717

申请日：2009-07-09

Applicant: Adeka Corp ,  株式会社Adeka

Inventor： MASAMOTO YUJI ,  SHIMOZAWA MASAKAZU

IPC: C23F1/18 ,  C23F1/02 ,  H05K3/06

Abstract: PROBLEM TO BE SOLVED: To provide an etchant composition for a copper-containing material, which can form a fine pattern without causing a failure in the shape.SOLUTION: The etchant composition for the copper-containing material is formed of an aqueous solution which includes: (A) 0.1-15 mass% of at least one oxidizing agent component selected from a cupric ion and a ferric ion; (B) 0.1-20 mass% of hydrogen chloride; and (C) 0.001-5 mass% of a nonionic surface active agent which is expressed by formula (1): R-O-X-H (wherein R represents a 8-18 C alkyl group; and X represents a polyalkylene oxide group in which an ethylene oxide unit and a propylene oxide unit are polymerized in a random or block form), and has a number average molecular weight of 500-1,500.

Abstract translation: 要解决的问题：提供一种含铜材料的蚀刻剂组合物，其可以形成精细图案而不会导致形状不良。解决方案：含铜材料的蚀刻剂组合物由水溶液形成，该水溶液包括 ：（A）0.1-15质量％的选自铜离子和铁离子的至少一种氧化剂组分; （B）0.1-20质量％的氯化氢; 和（C）0.001-5质量％的由式（1）表示的非离子表面活性剂：ROXH（其中R表示8-18烷基; X表示环氧乙烷单元的聚环氧烷基 环氧丙烷单元以无规或嵌段的形式聚合），数均分子量为500〜1500。

公开(公告)号：JP2009167459A

公开(公告)日：2009-07-30

申请号：JP2008005517

申请日：2008-01-15

Applicant: Adeka Corp ,  株式会社Adeka

Inventor： IKEDA KIMIHIKO ,  NAKAMURA YUSUKE ,  MASAMOTO YUJI ,  SHIMOZAWA MASAKAZU

IPC: C23F1/18 ,  H05K3/06

CPC classification number: C23F1/18

Abstract: PROBLEM TO BE SOLVED: To provide an etchant composition for a copper-containing material, which prevents a shape failure of a wire in a circuit with a fine pattern and can manufacture a printed wiring board (or film) that does not cause a short circuit. SOLUTION: The etchant composition for the copper-containing material is formed of an aqueous solution including: (A) 0.1 to 15 mass% of at least one oxidizing agent component selected from a cupric ion and a ferric ion; (B) 0.001 to 5 mass% of a glycol ether compound having one hydroxyl group; (C) 0.001 to 5 mass% of a compound containing at least one of ethylene oxide and propylene oxide added to active hydrogen of a (poly)amine compound; (D) 0.1 to 5 mass% of at least one phosphoric component selected from phosphoric acid and a phosphate; and (E) 0.1 to 10 mass% of at least one inorganic acid selected from hydrochloric acid and sulfuric acid, as indispensable components. COPYRIGHT: (C)2009,JPO&INPIT

Abstract translation: 要解决的问题：为了提供含铜材料的蚀刻剂组合物，其防止具有精细图案的电路中的导线的形状故障，并且可以制造不引起的印刷线路板（或膜） 短路。 含铜材料的蚀刻剂组成由以下水溶液形成：（A）0.1〜15质量％的选自铜离子和铁离子的至少一种氧化剂成分; （B）0.001〜5质量％的具有一个羟基的二醇醚化合物; （C）向（多）胺化合物的活性氢中添加含有环氧乙烷和环氧丙烷中的至少一种的化合物的0.001〜5质量％ （D）0.1〜5质量％的选自磷酸和磷酸盐的至少一种磷成分; 和（E）0.1〜10质量％的选自盐酸和硫酸的至少一种无机酸作为不可或缺的成分。 版权所有（C）2009，JPO＆INPIT