中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

5 records (took 0.021 seconds)

    OPTICAL FILTER
    1.
    发明公开
    OPTICAL FILTER 审中-公开
    光学过滤器

    公开(公告)号：KR20070101792A

    公开(公告)日：2007-10-17

    申请号：KR20070035891

    申请日：2007-04-12

    Applicant: ADEKA CORP

    Inventor： TOMINAGA NOBUHIDE ,  TOMITA ATSUO

    IPC: C08J5/18 ,  G02B5/20

    Abstract: An optical filter is provided to reduce a half-width and to use the optical filter as an optical element to the light having of a wavelength of 380-500 nm. An optical filter comprises at least one kind of compound represented by the formula I, wherein R1, R2, R3, R4 and R5 are independently H, a C1-C8 alkyl group, an amino group, or a hydroxyl group; R1 and R2, R2 and R3, R3 and R4, and R4 and R5 can be connected to form a ring; R6 is a cyano group, -COOR, -OCOR, -CONHR, -NHCOR, -COONHR, -NHCOOR, -COR, -SO2R, -SOR, -SONRR', a halogen atom, a nitro group, or a phosphono group; R and R' are independently H, a C1-C8 alkyl group, a C6-C20 aryl group, or a C7-C20 arylalkyl group; and the methylene group of the C1-C8 alkyl group can be substituted with -O-, -S-, -COO-, -OCO-, or -CH=CH-.

    Abstract translation: 提供了一种滤光器，以减小半波长，并将光学滤波器用作具有380-500nm波长的光的光学元件。 光学滤波器包括至少一种由式I表示的化合物，其中R 1，R 2，R 3，R 4和R 5独立地为H，C 1 -C 8烷基，氨基或羟基; R1和R2，R2和R3，R3和R4，R4和R5可以连接形成环; R6是氰基，-COOR，-OCOR，-CONHR，-NHCOR，-COONHR，-NHCOOR，-COR，-SO2R，-SOR，-SONRR'，卤素原子，硝基或膦酰基; R和R'独立地为H，C 1 -C 8烷基，C 6 -C 20芳基或C 7 -C 20芳烷基; 并且C 1 -C 8烷基的亚甲基可以被-O - ， - S - ， - COO - ， - OCO-或-CH = CH-取代。

    CURABLE COMPOSITION AND CURED ARTICLE
    5.
    发明公开
    CURABLE COMPOSITION AND CURED ARTICLE 审中-公开
    赫尔辛特艺术家HÄRTBAREZUSAMMENSETZUNG

    公开(公告)号：EP2749581A4

    公开(公告)日：2015-04-08

    申请号：EP12827045

    申请日：2012-08-24

    Applicant: ADEKA CORP

    Inventor： HIWATARI KENICHIRO ,  TOMITA ATSUO ,  SAIKI TOMOAKI ,  MURATA KIYOSHI

    IPC: C08F12/34 ,  C08F12/22 ,  C09D125/18 ,  H01L29/16

    CPC classification number: C08F112/34 ,  C08F12/22 ,  C08F228/04 ,  C08K7/18 ,  C09D125/18 ,  H01L29/1608 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: Provided are: a curable composition from which a cured article having excellent molding processability and high heat resistance as well as such a high Tg that it can be used as a molding resin for a SiC power semiconductor can be obtained; and a cured article thereof. The curable composition comprises: 100 parts by mass of a compound having at least two partial structures represented by the following Formula (1) in the molecule as a component (A); 0.5 to 3 parts by mass of a thermal radical generator as a component (B); and 0 to 50 parts by mass of other radical-reactive compound as a component (C): (wherein, ring A represents a benzene ring or a cyclohexyl ring; R 1 represents an alkylene group having 1 to 6 carbon atoms; R 2 represents an alkyl group having 1 to 4 carbon atoms; a represents a number of 0 or 1; b represents an integer of 0 to 3; and c represents a number of 1 or 2).

    Abstract translation: 提供：可以得到固化物，其具有优异的成型加工性和高耐热性的固化物，以及可以用作SiC功率半导体的模塑树脂的Tg高; 及其固化物。 可固化组合物包含：作为组分（A）的100质量份在分子中具有至少两个由下式（1）表示的部分结构的化合物; 0.5〜3质量份作为（B）成分的热自由基发生剂; 0〜50质量份作为成分（C）的其他自由基反应性化合物（其中环A表示苯环或环己基环; R 1表示碳原子数1〜6的亚烷基，R 2表示 具有1至4个碳原子的烷基; a表示0或1的数; b表示0至3的整数; c表示1或2的数）。

Patent Agency Ranking