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    1.
    发明专利
    未知

    公开(公告)号：AT526321T

    公开(公告)日：2011-10-15

    申请号：AT08752220

    申请日：2008-04-28

    Applicant: ADEKA CORP

    Inventor： MIHARA TAIKI ,  MURATA KIYOSHI ,  KIMIJIMA KOICHI

    IPC: C07D303/24 ,  C07C43/21 ,  C07C43/215 ,  C08F2/48 ,  C08F290/06 ,  C08G59/14 ,  C08G59/16 ,  C08G59/24

    Abstract: An novel epoxy compound is represented by the general formula (I) and has a benzo- or naphtho-cycloalkane skeleton: wherein, X, Y, and Z each independently represent an alkyl group having 1 to 10 carbon atoms and optionally substituted with a halogen atom, an aryl group having 6 to 20 carbon atoms and optionally substituted with a halogen atom, an arylalkyl group having 7 to 20 carbon atoms and optionally substituted with a halogen atom, a heterocyclic group having 2 to 20 carbon atoms and optionally substituted with a halogen atom, or a halogen atom; k represents a number of 0 to 4; p represents a number of 0 to 8; r represents a number of 0 to 4; n represents 0 to 10; x represents a number of 0 to 4; y represents a number of 0 to 4; a sum of x and y is 2 to 4; and an optical isomer that exists when n is not 0 may be of any type.

    2.
    发明专利
    未知

    公开(公告)号：AT547399T

    公开(公告)日：2012-03-15

    申请号：AT10015054

    申请日：2010-11-26

    Applicant: ADEKA CORP

    Inventor： MURATA KIYOSHI ,  OISHI TAKEO ,  KIMIJIMA KOICHI

    IPC: C07C323/47 ,  C07C251/66 ,  C07C251/68 ,  C07C323/65 ,  C07C391/02 ,  C07F9/50 ,  C08F2/50

    Abstract: The invention provides a novel compound useful as a highly-sensitive photopolymerization initiator that has excellent stability, low sublimability, excellent developability, and high transmittance in the visible region and that efficiently absorbs, and is activated by, near-ultraviolet rays such as at 365 nm. Also provided are a photopolymerization initiator and a photosensitive composition using the above-described compound. Specifically, the invention provides an oxime ester compound represented by the following general formula (I), a photopolymerization initiator containing the same, and a photosensitive composition containing the photopolymerization initiator and a polymerizable compound having an ethylenically unsaturated bond: wherein, R 1 and R 2 each represent R 11 , COR 11 , CONR 12 R 13 , CN, etc.; R 11 , R 12 , and R 13 each represent a C 1-20 alkyl group, etc.; R 3 and R 4 each represent R 11 , OR 11 , COR 11 , CONR 12 R 13 , OCOR 11 , CN, a halogen atom, etc.; a and b each represent an integer of 0 to 4; X represents an oxygen atom, a sulfur atom, etc.; and R 5 represents OH, COOH, or a group represented by general formula (II).

    CURABLE COMPOSITION AND CURED ARTICLE
    5.
    发明公开
    CURABLE COMPOSITION AND CURED ARTICLE 审中-公开
    赫尔辛特艺术家HÄRTBAREZUSAMMENSETZUNG

    公开(公告)号：EP2749581A4

    公开(公告)日：2015-04-08

    申请号：EP12827045

    申请日：2012-08-24

    Applicant: ADEKA CORP

    Inventor： HIWATARI KENICHIRO ,  TOMITA ATSUO ,  SAIKI TOMOAKI ,  MURATA KIYOSHI

    IPC: C08F12/34 ,  C08F12/22 ,  C09D125/18 ,  H01L29/16

    CPC classification number: C08F112/34 ,  C08F12/22 ,  C08F228/04 ,  C08K7/18 ,  C09D125/18 ,  H01L29/1608 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: Provided are: a curable composition from which a cured article having excellent molding processability and high heat resistance as well as such a high Tg that it can be used as a molding resin for a SiC power semiconductor can be obtained; and a cured article thereof. The curable composition comprises: 100 parts by mass of a compound having at least two partial structures represented by the following Formula (1) in the molecule as a component (A); 0.5 to 3 parts by mass of a thermal radical generator as a component (B); and 0 to 50 parts by mass of other radical-reactive compound as a component (C): (wherein, ring A represents a benzene ring or a cyclohexyl ring; R 1 represents an alkylene group having 1 to 6 carbon atoms; R 2 represents an alkyl group having 1 to 4 carbon atoms; a represents a number of 0 or 1; b represents an integer of 0 to 3; and c represents a number of 1 or 2).

    Abstract translation: 提供：可以得到固化物，其具有优异的成型加工性和高耐热性的固化物，以及可以用作SiC功率半导体的模塑树脂的Tg高; 及其固化物。 可固化组合物包含：作为组分（A）的100质量份在分子中具有至少两个由下式（1）表示的部分结构的化合物; 0.5〜3质量份作为（B）成分的热自由基发生剂; 0〜50质量份作为成分（C）的其他自由基反应性化合物（其中环A表示苯环或环己基环; R 1表示碳原子数1〜6的亚烷基，R 2表示 具有1至4个碳原子的烷基; a表示0或1的数; b表示0至3的整数; c表示1或2的数）。

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