CURABLE COMPOSITION AND CURED ARTICLE
    2.
    发明公开
    CURABLE COMPOSITION AND CURED ARTICLE 审中-公开
    赫尔辛特艺术家HÄRTBAREZUSAMMENSETZUNG

    公开(公告)号:EP2749581A4

    公开(公告)日:2015-04-08

    申请号:EP12827045

    申请日:2012-08-24

    Applicant: ADEKA CORP

    Abstract: Provided are: a curable composition from which a cured article having excellent molding processability and high heat resistance as well as such a high Tg that it can be used as a molding resin for a SiC power semiconductor can be obtained; and a cured article thereof. The curable composition comprises: 100 parts by mass of a compound having at least two partial structures represented by the following Formula (1) in the molecule as a component (A); 0.5 to 3 parts by mass of a thermal radical generator as a component (B); and 0 to 50 parts by mass of other radical-reactive compound as a component (C): (wherein, ring A represents a benzene ring or a cyclohexyl ring; R 1 represents an alkylene group having 1 to 6 carbon atoms; R 2 represents an alkyl group having 1 to 4 carbon atoms; a represents a number of 0 or 1; b represents an integer of 0 to 3; and c represents a number of 1 or 2).

    Abstract translation: 提供:可以得到固化物,其具有优异的成型加工性和高耐热性的固化物,以及可以用作SiC功率半导体的模塑树脂的Tg高; 及其固化物。 可固化组合物包含:作为组分(A)的100质量份在分子中具有至少两个由下式(1)表示的部分结构的化合物; 0.5〜3质量份作为(B)成分的热自由基发生剂; 0〜50质量份作为成分(C)的其他自由基反应性化合物(其中环A表示苯环或环己基环; R 1表示碳原子数1〜6的亚烷基,R 2表示 具有1至4个碳原子的烷基; a表示0或1的数; b表示0至3的整数; c表示1或2的数)。

    半導体装置
    3.
    发明专利
    半導体装置 审中-公开
    半导体器件

    公开(公告)号:JP2014229817A

    公开(公告)日:2014-12-08

    申请号:JP2013109798

    申请日:2013-05-24

    Abstract: 【課題】高温環境下での信頼性を向上できる半導体装置を提供する。【解決手段】このSiC GTOサイリスタ装置によれば、樹脂製被覆本体21と支持体3との間に耐熱性および耐酸化性を有する樹脂製接合部18を形成して、樹脂製被覆本体21と支持体3とが直接に接合された界面の外周部樹脂製被覆本体21と支持体3とが直接に接合された界面の外周部が露出しないように、上記界面の外周部を耐熱性および耐酸化性を有する樹脂製接合部18により覆うことによって、高温環境下での酸化による接着力の低下が抑制され、樹脂製被覆本体21が支持体3から剥離するのを防止できる。【選択図】図1

    Abstract translation: 要解决的问题:提供可以在高温环境下提高可靠性的半导体器件。解决方案:根据本发明的SiC GTO晶闸管器件,通过在树脂涂层体21之间形成具有耐热性和抗氧化性的树脂结合部18 以及支撑介质3,其覆盖树脂涂层体21和支撑介质3与具有耐热性和抗氧化性的树脂粘合部分18直接接合的边界表面的周边,以便不暴露边界表面的周边 在高温环境下由于氧化引起的粘合力劣化被抑制,并且可以防止树脂涂层体21与支撑介质3分离。

    Silicon-containing curable composition and thermally cured material therefrom
    4.
    发明专利
    Silicon-containing curable composition and thermally cured material therefrom 审中-公开
    含硅的可固化组合物和热固化材料

    公开(公告)号:JP2006283012A

    公开(公告)日:2006-10-19

    申请号:JP2006061798

    申请日:2006-03-07

    Abstract: PROBLEM TO BE SOLVED: To provide a silicon-containing curable composition, which is excellent in stability, transparency and curability, and can be used for forming a cured product excellent in various properties such as crack resistance, heat resistance, solvent resistance and alkali resistance. SOLUTION: The silicon-containing curable composition includes at least one silicon-containing polymer among component (A), component (B) and component (C). The component (A) is a silicon-containing polymer having one or more reactive groups selected from the group consisting of Si-CH=CH 2 , Si-R 1 -CH=CH 2 and Si-R 1 -OCOC(R 2 )=CH 2 and having at least one bridging structure by an Si-O-Si bond. The component (B) is a silicon-containing polymer having Si-H group and having at least one bridging structure by an Si-O-Si bond. The component (C) is a silicon-containing polymer having one or more above reactive groups and further an Si-H group and having at least one bridging structure by an Si-O-Si bond. COPYRIGHT: (C)2007,JPO&INPIT

    Abstract translation: 要解决的问题:提供稳定性,透明性和固化性优异的含硅可固化组合物,并且可用于形成各种性能如抗裂性,耐热性,耐溶剂性优异的固化产物 和耐碱性。 解决方案:含硅可固化组合物包含组分(A),组分(B)和组分(C)中的至少一种含硅聚合物。 组分(A)是具有一个或多个反应性基团的含硅聚合物,所述反应性基团选自Si-CH = CH ,Si-R 1 = CH 2 和Si-R 1 -OCOC(R SP SP 2)= CH 2 ,并且具有至少一个 通过Si-O-Si键的桥连结构。 组分(B)是具有Si-H基并通过Si-O-Si键具有至少一个桥连结构的含硅聚合物。 组分(C)是具有一个或多个上述反应性基团并且还含有Si-H基并且通过Si-O-Si键具有至少一个桥连结构的含硅聚合物。 版权所有(C)2007,JPO&INPIT

    湿気硬化性樹脂組成物及び熱伝導シート
    5.
    发明专利
    湿気硬化性樹脂組成物及び熱伝導シート 审中-公开
    水分可固化树脂组合物和热传导片

    公开(公告)号:JP2015013927A

    公开(公告)日:2015-01-22

    申请号:JP2013140203

    申请日:2013-07-03

    Abstract: 【課題】シリコーン樹脂をマトリックス樹脂とし窒化アルミニウムを分散させた熱伝導シート用の硬化性組成物、該硬化性組成物を硬化してなる熱伝導シートを提供する。【解決手段】(A)成分として前記一般式(1)で表されるシロキサン化合物、(B)成分として硬化触媒、及び(C)成分として窒化アルミニウムフィラーを含有することを特徴とする湿気硬化性樹脂組成物。(式中、R1及びR2は各々独立して炭素数1〜4のアルキル基又は炭素数6〜10のアリール基を表し、R3及びR4は各々独立して炭素数1〜4のアルキル基を表し、X1は炭素数1〜4のアルキル基、炭素数6〜10のアリール基又は炭素数1〜4のアルコキシ基を表し、aは、一般式(1)で表される化合物の質量平均分子量を2000〜100万とする数を表す。)【選択図】なし

    Abstract translation: 要解决的问题:提供一种其中使用有机硅树脂作为基质树脂和氮化铝分散的导热片的可固化组合物,并提供通过固化可固化组合物获得的导热片。解决方案:存在 提供了包含作为组分(A)的由上述通式(1)表示的硅氧烷化合物,作为组分(B)的固化催化剂和作为组分(C))的氮化铝填料的湿气固化性树脂组合物。 (其中,Rand Reach独立地表示具有1至4个碳原子的烷基或具有6至10个碳原子的芳基; Rand Reach独立地表示具有1至4个碳原子的烷基; X表示具有1至4个碳原子的烷基 原子,碳原子数为6〜10的芳基或碳原子数1〜4的烷氧基,a表示通式表示的化合物的质均分子量为2000〜1000000时的数。

    Benzotriazole compound
    6.
    发明专利
    Benzotriazole compound 有权
    苯并噻唑化合物

    公开(公告)号:JP2014077076A

    公开(公告)日:2014-05-01

    申请号:JP2012225862

    申请日:2012-10-11

    Abstract: PROBLEM TO BE SOLVED: To provide a novel benzotriazole compound with a radical reactive group which exhibits preferable water dispersibility.SOLUTION: The benzotriazole compound is represented by the specified general formula (1). (In the formula, Rand Reach independently represent a hydrogen atom or a C1-C5 alkyl group, Rrepresents a C1-C4 alkylene group, Rrepresents a direct coupling or a residue obtained by removing carboxyl groups from a C3-C10 dibasic acid, Rrepresents a hydrogen atom or a methyl group, a and c represent numbers in the range from 0 to 1000 with a+c equal to 2-1000, and b represents 0 or 1, where b is 0 if c is 0.)

    Abstract translation: 要解决的问题:提供具有自由基反应性基团的新型苯并三唑化合物,其表现出优选的水分散性。溶液:苯并三唑化合物由指定的通式(1)表示。 (在该式中,Rand Reach独立地表示氢原子或C1-C5烷基,R表示C1-C4亚烷基,R表示通过从C 3 -C 10二元酸除去羧基获得的直接偶联或残基,R表示 氢原子或甲基,a和c表示0至1000的数字,a + c等于2-1000,b表示0或1,其中如果c为0,则b为0)

    Resin additive
    7.
    发明专利
    Resin additive 有权
    树脂添加剂

    公开(公告)号:JP2007039675A

    公开(公告)日:2007-02-15

    申请号:JP2006186593

    申请日:2006-07-06

    Abstract: PROBLEM TO BE SOLVED: To provide a resin additive capable of improving mechanical characteristics and heat resistance (heat decomposition temperature) of a synthetic resin at the same time, when added thereto.
    SOLUTION: This resin additive comprises a layered polysilicate organic silyl compound as an active ingredient, wherein the compound has such a structure that a hydrogen atom in a silanol group of the layered polysilicate is substituted by an organic silyl group. Concretely, the layered polysilicate organic silyl compound having the structure which is obtained by subjecting an alkali metal ion existing between two or more layers of a layered polysilicate salt to ion exchange with a quaternary ammonium ion having a long-chain alkyl group and then reacting the ion-exchanged salt with an organic silylating agent, such as an organic silyl chloride, has good dispersibility in the resin and improves the mechanical characteristics and the heat resistance (heat decomposition temperature) at the same time.
    COPYRIGHT: (C)2007,JPO&INPIT

    Abstract translation: 待解决的问题:为了提供能够同时提高合成树脂的机械特性和耐热性(热分解温度)的树脂添加剂。 解决方案:该树脂添加剂包括层状聚硅酸酯有机甲硅烷基化合物作为活性成分,其中该化合物具有层状聚硅酸酯的硅烷醇基中的氢原子被有机甲硅烷基取代的结构。 具体地说,具有通过将存在于两层以上的层状聚硅酸盐之间的碱金属离子与具有长链烷基的季铵离子进行离子交换而得到的结构的层状聚硅酸酯有机甲硅烷基化合物, 与有机甲硅烷基化剂(如有机甲硅烷基氯)的离子交换盐在树脂中具有良好的分散性,同时提高了机械特性和耐热性(热分解温度)。 版权所有(C)2007,JPO&INPIT

    Polysiloxane compound and moisture-curable resin composition
    8.
    发明专利
    Polysiloxane compound and moisture-curable resin composition 有权
    多羟基化合物和水分可固化树脂组合物

    公开(公告)号:JP2013221135A

    公开(公告)日:2013-10-28

    申请号:JP2012095153

    申请日:2012-04-18

    Abstract: PROBLEM TO BE SOLVED: To provide a polysiloxane compound useful for a curable resin composition giving a cured product having excellent heat-resistance and adhesiveness, and a moisture-curable resin composition containing the compound.SOLUTION: There is provided a polysiloxane compound expressed by general formula (1) (in the formula, Rto Rare each independently 1-4C alkyl or 6-10C aryl; Rand Rare each independently 1-4C alkyl; Xis 1-4C alkyl, 6-10C aryl or 1-4C alkoxyl; (a) is a number to allow the compound expressed by general formula (1) to have a mass-average molecular weight of 2,000 to 1,000,000; and b is 0 or 1).

    Abstract translation: 要解决的问题:提供一种可用于具有优异耐热性和粘合性的固化产物的固化性树脂组合物的聚硅氧烷化合物和含有该化合物的湿固化性树脂组合物。溶液:提供一般表示的聚硅氧烷化合物 式(1)(式中,Rto Rare各自独立地为1-4C烷基或6-10C芳基; Rand Rare各自独立地为1-4C烷基; X为1-4C烷基,6-10C芳基或1-4C烷氧基;(a )是使通式(1)表示的化合物的质均分子量为2,000〜1,000,000,b为0或1的数。

    Optical film which has pattern of two or more color tones, manufacturing method of the optical film, color conversion filter using the optical film, and multi-color light-emitting device
    9.
    发明专利
    Optical film which has pattern of two or more color tones, manufacturing method of the optical film, color conversion filter using the optical film, and multi-color light-emitting device 审中-公开
    具有两种或多种颜色色调的图案的光学膜,光学膜的制造方法,使用光学膜的颜色转换过滤器和多色发光装置

    公开(公告)号:JP2009043562A

    公开(公告)日:2009-02-26

    申请号:JP2007207090

    申请日:2007-08-08

    Abstract: PROBLEM TO BE SOLVED: To provide an optical film superior in forming a pattern of a plurality of color tones, to provide a manufacturing method of the optical film capable of cost reduction in a short process, to provide a color conversion filter using the optical film, and to provide a multi-color light-emitting device. SOLUTION: This is the optical film containing a binder resin (A), a light activator (B) selected from a group consisting of a photo acid-generating agent and a photo base-generating agent, and a color tone variable color material (C) as essential components in which the color tone changes by acid or base, and the optical film in which two regions of which the color tones are different are formed by light irradiation against its one part. COPYRIGHT: (C)2009,JPO&INPIT

    Abstract translation: 要解决的问题:为了提供在形成多种色调的图案方面优异的光学膜,以提供能够在短时间内降低成本的光学膜的制造方法,以提供使用 该光学膜,并提供一种多色发光装置。 解决方案:这是含有粘合剂树脂(A),选自光产酸剂和光碱生成剂的光活化剂(B)和色调可变颜色的光学膜 材料(C)作为色调由酸或碱变化的必需成分,其中色调不同的两个区域的光学膜通过对其一部分的光照射而形成。 版权所有(C)2009,JPO&INPIT

    Silicon-containing compound, curable composition, and cured material
    10.
    发明专利
    Silicon-containing compound, curable composition, and cured material 有权
    含硅化合物,可固化组合物和固化材料

    公开(公告)号:JP2008266484A

    公开(公告)日:2008-11-06

    申请号:JP2007112738

    申请日:2007-04-23

    CPC classification number: C08G77/50 C08L83/14 C08L83/00

    Abstract: PROBLEM TO BE SOLVED: To provide a silicon-containing curable composition excellent in a handling property and a curing property in which an obtained cured article is excellent in heat-resistance and flexibility.
    SOLUTION: The curable composition comprises a silicon-containing compound represented by general formula (1), the compound in which Z is a hydrogen atom in general formula (1), the compound in which Z is a 2-4C alkenyl group or an alkynyl group in general formula (1), and a hydrosilylated reaction catalyst. In the formula, R
    a -R
    g are a 1-12C saturated aliphatic hydrocarbon group or a 6-12C aromatic hydrocarbon group (however, R
    e and R
    f do not simultaneously become the 1-12C saturated aliphatic hydrocarbon group), Y is a 2-4C alkylene group, Z is a hydrogen atom or a 2-4C alkenyl group or an alkynyl group, K is an integer of 2-7, T is an integer of 1-7, and P is an integer of 0-3. M and N are N:M=1:1 to 1:100, are the number in which total of all Ms and all Ns becomes 15 or higher, and are the number in which a mass average molecular weight of the compound is made to 3,000-1,000,000.
    COPYRIGHT: (C)2009,JPO&INPIT

    Abstract translation: 要解决的问题:提供一种处理性能和固化性能优异的含硫可固化组合物,其中获得的固化物具有优异的耐热性和柔软性。 解决方案:可固化组合物包含通式(1)表示的含硅化合物,其中Z为通式(1)中的氢原子的化合物,其中Z为2-4C烯基的化合物 或通式(1)中的炔基和氢化硅烷化反应催化剂。 在该式中,R 16是具有1-12个碳原子的饱和脂族烃基或6-12个碳芳族烃基(然而,R“ SP>和R f 不同时成为1-12C饱和脂族烃基),Y为2-4C亚烷基,Z为氢原子或2-4C烯基或炔基 组,K为2-7的整数,T为1-7的整数,P为0-3的整数。 M和N为N:M = 1:1至1:100,是所有Ms和全部Ns的总和变为15或更高的数,并且是化合物的质均分子量为 3,000-1,000,000。 版权所有(C)2009,JPO&INPIT

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