CLATHRATE COMPOUND, EPOXY RESIN CURING AGENT, AND CURABLE RESIN COMPOSITION

    公开(公告)号:US20240409681A1

    公开(公告)日:2024-12-12

    申请号:US18698296

    申请日:2022-10-17

    Abstract: A clathrate compound obtained by mixing an imidazole compound (A) and a polyhydric phenol compound (B), wherein the clathrate compound has an average particle size (X) of 7 μm or less, and a maximum particle size (Y) of 40 μm or less. The imidazole compound (A) is preferably at least one selected from compounds represented by the following formula (1), where R1, R2, R3, and R4 each independently represent a hydrogen atom, an alkyl group that has 1 to 20 carbon atoms and may have a substituent, or an aryl group that has 6 to 20 carbon atoms and may have a substituent, and the substituent is at least one selected from a halogen atom, a hydroxy group, and a nitrile group.

    CURABLE RESIN COMPOSITION
    2.
    发明申请

    公开(公告)号:US20220185946A1

    公开(公告)日:2022-06-16

    申请号:US17436498

    申请日:2020-03-27

    Abstract: Disclosed is a curable resin composition that has excellent curability by irradiation of light and heating and that is suitable for such applications as liquid encapsulants, liquid adhesives, adhesives for camera modules, and liquid crystal sealants. The curable resin composition contains (A) an aromatic epoxy resin having an allyl group, (B) a thiol-based curing agent, (C) a photoradical initiator, and (D) a thermally latent curing agent. Preferably, (A) the compound having an allyl group and an epoxy group is an aromatic epoxy resin having an allyl group. Preferably, the thiol-based curing agent, which is component (B), is in liquid form at 25° C.

Patent Agency Ranking