Abstract:
A reference circuit for overerase correction in a flash memory includes a reference flash memory cell biased in a substantially similar manner to that of an overerased flash memory cell. The leakage current for the reference flash memory cell is preset to a tolerable level of leakage current for a maximum operating temperature of the flash memory and the reference flash memory cell tracks the temperature characteristics of the overerased flash memory cell, to avoid costly overcorrection at high temperatures.
Abstract:
A charge pump circuit utilizing accumulation capacitors for use in EEPROM devices so as to internally pump up an external power source voltage includes a plurality of MOS transistors (T101, T102; T201, T202) and accumulation capacitors (N2, P2). The plurality of MOS transistors are connected in series between a first input voltage terminal and a higher voltage output terminal. The first input voltage terminal receives the external power source voltage. The accumulation capacitor has a first plate and a second plate. Each of the first plates of the accumulation capacitors is connected between adjacent ones of the plurality of MOS transistors. Each of the second plates of the accumulation capacitors is connected to a second input terminal for receiving a clock signal. As a result, the pump circuit can be operated effectively so as to produce a significant reduction in power consumption.
Abstract:
A low supply voltage negative charge pump for generating a relatively high negative voltage to control gates of selected memory cells via wordlines in an array of flash EEPROM memory cells during flash erasure includes charge pump means (210) formed of a plurality of charge pump stages (201-206) and coupling capacitor means (C201-C212) for delivering clock signals to the plurality of charge pump stages. Each of the plurality of charge pump stages is formed of an N-channel intrinsic pass transistor (N1-N6), an N-channel intrinsic initialization transistor (MD1-MD6), and an N-channel intrinsic precharge transistor (MX3-MX7, MX1) which are disposed in separate p-wells so as to reduce body effect. As a result, the negative charge pump is operable using a supply voltage of +3 volts or lower.
Abstract:
There is provided an improved method for tightening the distribution of control gate threshold voltages of erase cells in flash EEPROM devices. A relatively low positive voltage is applied to the source regions of the EEPROM devices during an entire erase cycle. The magnitude of a negative constant voltage applied to control gates of the EEPROM devices is lowered to a predetermined voltage level during the entire erase cycle so as to obtain a tighter threshold voltage distribution. The value of a load resistor coupled between the low positive voltage and source regions is reduced simultaneously to a predetermined value so as to compensate for the increased erase time caused by the lowering of the magnitude of the negative constant voltage. As a result, an improved threshold voltage VT distribution after erase is obtained without sacrificing any reduction in the erase speed.
Abstract:
A voltage booster circuit includes a driver circuit (117) for generating a 3-state output for driving wordlines via row decoder circuits in an array of flash EEPROM memory cells during read and programming modes of operation. The driver circuit effectively disconnects a large booster capacitor (115) in order to allow a small charge pump (114) to further pump up the wordline voltage during programming. As a result, the booster pump has improved efficiency since there is achieved a significant reduction in power consumption.
Abstract:
A low supply voltage negative charge pump for generating a relatively high negative voltage to control gates of selected memory cells via wordlines in an array of flash EEPROM memory cells during flash erasure includes charge pump means (210) formed of a plurality of charge pump stages (201-206) and coupling capacitor means (C201-C212) for delivering clock signals to the plurality of charge pump stages. Each of the plurality of charge pump stages is formed of an N-channel intrinsic pass transistor (N1-N6), an N-channel intrinsic initialization transistor (MD1-MD6), and an N-channel intrinsic precharge transistor (MX3-MX7, MX1) which are disposed in separate p-wells so as to reduce body effect. As a result, the negative charge pump is operable using a supply voltage of +3 volts or lower.
Abstract:
A low supply voltage negative charge pump for generating a relatively high negative voltage to control gates of selected memory cells via wordlines in an array of flash EEPROM memory cells during flash erasure includes charge pump means (210) formed of a plurality of charge pump stages (201-206) and coupling capacitor means (C201-C212) for delivering clock signals to the plurality of charge pump stages. Each of the plurality of charge pump stages is formed of an N-channel intrinsic pass transistor (N1-N6), an N-channel intrinsic initialization transistor (MD1-MD6), and an N-channel intrinsic precharge transistor (MX3-MX7, MX1) which are disposed in separate p-wells so as to reduce body effect. As a result, the negative charge pump is operable using a supply voltage of +3 volts or lower.
Abstract:
A voltage booster circuit includes a driver circuit (117) for generating a 3-state output for driving wordlines via row decoder circuits in an array of flash EEPROM memory cells during read and programming modes of operation. The driver circuit effectively disconnects a large booster capacitor (115) in order to allow a small charge pump (114) to further pump up the wordline voltage during programming. As a result, the booster pump has improved efficiency since there is achieved a significant reduction in power consumption.