公开(公告)号：WO1996024467A1

公开(公告)日：1996-08-15

申请号：PCT/US1996000152

申请日：1996-01-11

Applicant: ADVANCED MICRO DEVICES, INC.

Inventor： ADVANCED MICRO DEVICES, INC. ,  LEE, Dawn, M. ,  VENKATKRISHNAN, Subramanian

IPC: B24B37/04

CPC classification number: B24B37/30

Abstract: Uniform planarization of a patterned semiconductor wafer is effected with a chemical-mechanical polishing apparatus containing a base plate comprising a convex surface portion.

Abstract translation: 图案化半导体晶片的均匀平坦化由含有包括凸面部分的基板的化学机械抛光装置进行。

公开(公告)号：EP0808231A1

公开(公告)日：1997-11-26

申请号：EP96902099.0

申请日：1996-01-11

Applicant: ADVANCED MICRO DEVICES INC.

Inventor： LEE, Dawn, M. ,  VENKATKRISHNAN, Subramanian

IPC: B24B37 ,  B24B41

CPC classification number: B24B37/30

Abstract: Uniform planarization of a patterned semiconductor wafer is effected with a chemical-mechanical polishing apparatus containing a base plate comprising a convex surface portion.

公开(公告)号：EP0808231B1

公开(公告)日：2000-11-02

申请号：EP96902099.9

申请日：1996-01-11

Applicant: ADVANCED MICRO DEVICES INC.

Inventor： LEE, Dawn, M. ,  VENKATKRISHNAN, Subramanian

IPC: B24B37/04

CPC classification number: B24B37/30

Abstract: Uniform planarization of a patterned semiconductor wafer is effected with a chemical-mechanical polishing apparatus containing a base plate comprising a convex surface portion.