公开(公告)号：AU2002326700A1

公开(公告)日：2003-03-24

申请号：AU2002326700

申请日：2002-08-19

Applicant: ADVANCED MICRO DEVICES INC

Inventor： DING DIONG-HING ,  ONG OOI-TONG ,  ALCID EDWARD S ,  CHAN CHEON-SENG ,  MASTER RAJ N

IPC: H01L21/673 ,  H05K3/34 ,  H01L21/00

公开(公告)号：WO03023820A8

公开(公告)日：2004-05-27

申请号：PCT/US0226451

申请日：2002-08-19

Applicant: ADVANCED MICRO DEVICES INC

Inventor： MASTER RAJ N ,  ALCID EDWARD S ,  DING DIONG-HING ,  CHAN CHEON-SENG ,  ONG OOI-TONG

IPC: H01L21/673 ,  H05K3/34 ,  H01L21/00

CPC classification number: H05K3/3478 ,  H05K2201/09945 ,  H05K2203/0113 ,  H05K2203/0338 ,  H05K2203/041 ,  H05K2203/082

Abstract: A boat (10) onto which solder balls (16) or columns are loaded for an attach process can be used in a universal attach line has a number of attach stations (32-44) to accommodate different types of attach processes. Depending on the process and the desired configuration and form factor of the array of solder balls (16) or columns, a template (14a, 14b) is selected that covers some of the holes (12) in the universal boat (10), and exposes other holes (12). The holes (12) are configured and sized to hold solder balls (16) in the holes (12) such that the solder balls (16) protrude above the top surface of the boat (10) by a predetermined height. This prevents damage to the solder balls (16) while ensuring that the solder balls (16) protrude enough to accommodate imperfectly flat packages that are placed on the array of solder balls (16) held in the boat (10). Vacuum applied through the holes (12) help to securely hold the balls (16) in place, and a substrate (18) is placed onto the solder balls (16). Once loaded with balls (16) or columns, the boat (10) is transported to only the appropriate attach stations in the universal attach line, where the different attach operations for a given attach process, such as high temperature ball attach, eutectic ball attach, or column attach, are performed. Also provided is a method of fabricating laminate assemblies that determines the ideal weight (W) of underfill to be dispensed, based on the size of the semiconductor die (144) and the gap (142) between the die (144) and the laminate substrate. Underfill (150) is dispensed in a single step in an amount between 1.1W and 1.3W to form fillets (52, 54) that cover at least 15% of the height of the semiconductor die (144) on all four sides of the die. The amount of underfill (150) ensures that the fillet coverage imbalance is 30% or less for each of the pairs of opposing sides of the die (144), thereby improving solder joint reliability.

Abstract translation: 可以在通用连接线中使用装载有焊球（16）或列的船（10），其具有多个附接站（32-44）以适应不同类型的附接过程。 根据工艺和焊球（16）或列阵列的期望配置和形状因素，选择覆盖通用船（10）中的一些孔（12）的模板（14a，14b），以及 露出其他孔（12）。 孔（12）的构造和尺寸被设计成将焊球（16）保持在孔（12）中，使得焊球（16）突出在船（10）的顶表面上预定高度。 这防止了焊球（16）的损坏，同时确保焊球（16）足够突出以容纳放置在保持在舟皿（10）中的焊球（16）阵列上的不完全平坦的封装。 通过孔（12）施加的真空有助于将球（16）牢固地保持就位，并且将衬底（18）放置在焊球（16）上。 一旦装载了球（16）或列，船只（10）只能被传送到通用连接线中的适当的附属站，在给定的附着过程中，例如高温球附着，共晶球附着 或列附加。 还提供了一种制造叠层组件的方法，其基于半导体管芯（144）的尺寸和模具（144）和层叠基板之间的间隙（142）确定待分配的底部填充物的理想重量（W） 。 底部填充物（150）以1.1W和1.3W之间的量分散在单个步骤中以形成在模具的所有四个侧面上覆盖半导体管芯（144）的至少15％的高度的圆角（52,54） 。 底部填充物（150）的量确保了模具（144）的每对相对侧中的每一对的圆角覆盖不平衡为30％以下，从而提高焊点可靠性。