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公开(公告)号：US20200048420A1
公开(公告)日：2020-02-13
申请号：US16660895
申请日：2019-10-23
Applicant: AGC Inc.
Inventor： Tomoya HOSODA , Tatsuya TERADA , Atsumi YAMABE , Nobutaka KIDERA , Wataru KASAI
Abstract: The purpose of the present invention is to provide a fluororesin film or fluororesin laminate excellent in heat resistance and excellent in interlayer adhesion to an object to be laminated, such as a prepreg, a method for producing a hot pressed laminate using said film or laminate, and a method for producing a printed circuit board. The fluororesin film contains a fluororesin having a melting point of from 260 to 380° C., and has an arithmetic average roughness Ra of at least 3.0 nm when inside of 1 μm2 of at least one surface thereof in the thickness direction is measured by an atomic force microscope. The laminate 1 has a layer A10 containing said fluororesin and a layer B12 made of another substrate, wherein the layer A10 has an arithmetic average roughness Ra of at least 3.0 nm when inside of 1 μm2 of a second surface 10b thereof is measured by an atomic force microscope.
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公开(公告)号：US20190141833A1
公开(公告)日：2019-05-09
申请号：US16238586
申请日：2019-01-03
Applicant: AGC Inc.
Inventor： Tomoya HOSODA , Tatsuya TERADA
CPC classification number: H05K1/0373 , H01P3/00 , H01Q1/38 , H05K1/024 , H05K1/0393 , H05K1/115 , H05K3/422 , H05K3/427 , H05K2201/015 , H05K2201/0154 , H05K2201/0212 , H05K2203/072 , H05K2203/0776 , H05K2203/0779 , H05K2203/095
Abstract: To provide a wiring substrate having excellent transmission characteristics, of which initial failure of a plating layer formed on an inner wall surface of a hole is suppressed regardless of the type of the pre-treatment applied to the inner wall surface of the hole, and of which the plating layer has favorable heat resistance, and a process for producing it.A wiring substrate 10 comprising an electrical insulator layer 20, a first conductor layer 32 formed on a first surface of the electrical insulator layer 20, a second conductor layer 34 formed on a second surface of the electrical insulator layer 20, and a plating layer 42 provided on an inner wall surface of a hole 40 which opens from the first conductor layer 32 through the second conductor layer 34; wherein the electrical insulator layer 20 has a heat resistant resin layer 22 containing a heat resistant resin and a resin powder; the resin powder is formed from a resin material containing a melt-formable fluororesin having a functional group such as a carbonyl group-containing group; the content of the resin powder is from 5 to 70 mass % to the heat resistant resin layer 22; and the electrical insulator layer 20 has a dielectric constant of from 2.0 to 3.5.
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公开(公告)号：US20220157487A1
公开(公告)日：2022-05-19
申请号：US17591755
申请日：2022-02-03
Applicant: AGC INC.
Inventor： Wataru KASAI , Tomoya HOSODA , Atsumi MITSUNAGA , Tatsuya TERADA , Sota YUKI
Abstract: To provide a film which is excellent in heat resistance, which is less likely to be warped and which has high adhesion, a method for producing it, and a metal-clad laminate and a coated metal conductor, using the film.
The film of the present invention comprises an aromatic polyimide base film, and a layer containing a polymer having units based on tetrafluoroethylene and units based on a perfluoro(alkyl vinyl ether) and an aromatic polymer, formed on each side of the base film.-
公开(公告)号：US20190100635A1
公开(公告)日：2019-04-04
申请号：US16207769
申请日：2018-12-03
Applicant: AGC INC.
Inventor： Tomoya HOSODA , Tatsuya TERADA
IPC: C08J5/24 , B32B27/30 , B32B15/08 , H05K1/03 , C08L101/04
Abstract: To provide a method for producing a liquid composition, whereby agglomeration of the resin powder is suppressed even at a low viscosity and it is possible to obtain a uniformly dispersed liquid composition, and a method for producing a film, etc. by using the method for producing a liquid composition. The method for producing a liquid composition comprises heat-treating a mixture comprising a resin powder having an average particle size of from 0.02 to 200 μm made from a powder material containing a fluorinated polymer having a specific functional group, a binder component having a reactive group reactive with the functional group of the resin powder, and a liquid medium capable of dissolving the binder component, to obtain a liquid composition, of which the viscosity change rate to the viscosity before heating is from 5 to 200%. Further, the method for producing a film, etc. uses the liquid composition obtained by the method for producing a liquid composition.
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