公开(公告)号：US20220157487A1

公开(公告)日：2022-05-19

申请号：US17591755

申请日：2022-02-03

Applicant: AGC INC.

Inventor： Wataru KASAI ,  Tomoya HOSODA ,  Atsumi MITSUNAGA ,  Tatsuya TERADA ,  Sota YUKI

IPC: H01B3/30 ,  B32B15/08 ,  B32B15/20 ,  B32B37/24 ,  B32B7/025 ,  H01B1/02 ,  H01B3/44

Abstract: To provide a film which is excellent in heat resistance, which is less likely to be warped and which has high adhesion, a method for producing it, and a metal-clad laminate and a coated metal conductor, using the film.
The film of the present invention comprises an aromatic polyimide base film, and a layer containing a polymer having units based on tetrafluoroethylene and units based on a perfluoro(alkyl vinyl ether) and an aromatic polymer, formed on each side of the base film.

公开(公告)号：US20190144700A1

公开(公告)日：2019-05-16

申请号：US16249020

申请日：2019-01-16

Applicant: AGC Inc.

Inventor： Tomoya HOSODA ,  Tatsuya Terada ,  Shigeki Kobayashi ,  Atsumi Yamabe

IPC: C09D127/18 ,  C08F214/26 ,  C09D5/00 ,  H05K3/06 ,  H05K3/28 ,  H05K1/03

Abstract: To provide a liquid composition whereby a resin powder can be uniformly dispersed in a resin or the like without being scattered, and a method for producing a film, a laminate or the like by using the liquid composition. The liquid composition comprises a liquid medium and a resin powder dispersed in the liquid medium, and characterized in that the average particle size of the resin powder is from 0.3 to 6 μm, the volume-based cumulative 90% diameter of the resin powder is at most 8 μm, and the resin powder is a resin containing a fluorinated copolymer having a specific functional group. And, the method is a method for producing a film, a laminate or the like by using the liquid composition.

公开(公告)号：US20190100635A1

公开(公告)日：2019-04-04

申请号：US16207769

申请日：2018-12-03

Applicant: AGC INC.

Inventor： Tomoya HOSODA ,  Tatsuya TERADA

IPC: C08J5/24 ,  B32B27/30 ,  B32B15/08 ,  H05K1/03 ,  C08L101/04

Abstract: To provide a method for producing a liquid composition, whereby agglomeration of the resin powder is suppressed even at a low viscosity and it is possible to obtain a uniformly dispersed liquid composition, and a method for producing a film, etc. by using the method for producing a liquid composition. The method for producing a liquid composition comprises heat-treating a mixture comprising a resin powder having an average particle size of from 0.02 to 200 μm made from a powder material containing a fluorinated polymer having a specific functional group, a binder component having a reactive group reactive with the functional group of the resin powder, and a liquid medium capable of dissolving the binder component, to obtain a liquid composition, of which the viscosity change rate to the viscosity before heating is from 5 to 200%. Further, the method for producing a film, etc. uses the liquid composition obtained by the method for producing a liquid composition.

公开(公告)号：US20210040252A1

公开(公告)日：2021-02-11

申请号：US17070132

申请日：2020-10-14

Applicant: AGC Inc.

Inventor： Tomoya HOSODA ,  Wataru KASAI ,  Toru SASAKI ,  Masatoshi ABE

IPC: C08F214/26 ,  B32B27/30 ,  C09J135/00 ,  C09J7/35 ,  C09J7/25 ,  H05K3/38 ,  C09J127/18 ,  B32B7/12 ,  B32B15/08 ,  B32B37/06 ,  C09J5/06 ,  C23F1/00 ,  H05K1/03 ,  H05K3/06

Abstract: A material for a printed circuit board, which is a film composed of a fluorinated resin layer, where the fluorinated resin layer contains a composition containing a fluorinated copolymer having at least one functional group selected from a carbonyl group-containing group, a hydroxy group, an epoxy group and an isocyanate group, has a melt flow rate of at most 15 g/10 min measured at 372° C. under a load of 49N, and has a storage elastic modulus of at least 650 MPa.

公开(公告)号：US20200157301A1

公开(公告)日：2020-05-21

申请号：US16751301

申请日：2020-01-24

Applicant: AGC Inc.

Inventor： Norio OZAWA ,  Tomoya HOSODA ,  Takashi SATO

IPC: C08J5/24 ,  B29C70/34 ,  C08L77/02 ,  B32B27/34 ,  B32B27/12 ,  B29K307/04

Abstract: To provide a resin composition, wherein the resin composition is excellent in impregnation into a reinforcing fiber sheet as it contains a polyamide having a low viscosity number; wherein the resin composition can be molded into a film, a fiber, etc., even though it contains a polyamide having a low viscosity number; and wherein the resin composition can produce a fiber-reinforced molded product having excellent impact resistance; a molded product and a method for its production; and a fiber-reinforced molded product having excellent impact resistance and a method for its production.A resin composition comprising: a polyamide having a viscosity number of from 100 to 170 determined by a method specified in ISO 307: 2007; and a melt-processable fluororesin having at least one type of a functional group selected from the group consisting of a carbonyl group-containing group, a hydroxy group, an epoxy group and an isocyanate group, and having a melting point of from 100 to 325° C.

公开(公告)号：US20220118742A1

公开(公告)日：2022-04-21

申请号：US17562167

申请日：2021-12-27

Applicant: AGC Inc.

Inventor： Wataru KASAI ,  Yuya HORIGUCHI ,  Seigo KOTERA ,  Tomoya HOSODA

IPC: B32B15/082 ,  B32B27/32 ,  B32B27/30 ,  C08J5/18

Abstract: As an exemplary configuration, a long film is configured by thermomeltable polymers including a first unit based on tetrafluoroethylene and a second unit based on perfluoro (alkyl vinyl ether), including spherulites of the thermomeltable polymers, wherein radius of each spherulite is 10 μm or less. As another exemplary configuration, a long film is configured by tetrafluoroethylene polymers having a melt flow rate within a range of 5 to 40 g/10 min. The long film is heated at 180° C. for 30 minutes so as to measure the thermal expansion rate, and when letting thermal expansion rate in a first direction, which extends at a 45-degree angle to a melt flow direction be A, and thermal expansion rate in a second direction orthogonal to the first direction be B, A and B are respectively within the range of −2 to +1%, and |A−B| is 1% or less.

公开(公告)号：US20210024702A1

公开(公告)日：2021-01-28

申请号：US17066853

申请日：2020-10-09

Applicant: AGC Inc.

Inventor： Atsumi YAMABE ,  Tomoya HOSODA ,  Wataru KASAI

IPC: C08J3/07 ,  C08J5/18 ,  C08L27/18 ,  C08L27/20 ,  C08L27/16 ,  B32B27/08 ,  B32B27/16 ,  B32B27/30 ,  B32B27/32 ,  B32B5/02

Abstract: To provide a dispersion, a laminate, a film and an impregnated woven fabric.
A powder dispersion comprising powder I of polymer I having units based on tetrafluoroethylene and an oxygen-containing polar group, powder II of polymer II containing units based on a fluoroolefin, a dispersing agent, and a liquid dispersion medium, wherein the ratio of the mass content of the polymer I to the mass content of the polymer II is at most 0.7, or such a power dispersion wherein the dispersing agent is a fluorinated surfactant having a hydroxy group. A laminate, a film, and an impregnated woven fabric produced by using such a powder dispersion.

公开(公告)号：US20190141833A1

公开(公告)日：2019-05-09

申请号：US16238586

申请日：2019-01-03

Applicant: AGC Inc.

Inventor： Tomoya HOSODA ,  Tatsuya TERADA

IPC: H05K1/03 ,  H05K1/02 ,  H05K1/11 ,  H05K3/42

CPC classification number: H05K1/0373 ,  H01P3/00 ,  H01Q1/38 ,  H05K1/024 ,  H05K1/0393 ,  H05K1/115 ,  H05K3/422 ,  H05K3/427 ,  H05K2201/015 ,  H05K2201/0154 ,  H05K2201/0212 ,  H05K2203/072 ,  H05K2203/0776 ,  H05K2203/0779 ,  H05K2203/095

Abstract: To provide a wiring substrate having excellent transmission characteristics, of which initial failure of a plating layer formed on an inner wall surface of a hole is suppressed regardless of the type of the pre-treatment applied to the inner wall surface of the hole, and of which the plating layer has favorable heat resistance, and a process for producing it.A wiring substrate 10 comprising an electrical insulator layer 20, a first conductor layer 32 formed on a first surface of the electrical insulator layer 20, a second conductor layer 34 formed on a second surface of the electrical insulator layer 20, and a plating layer 42 provided on an inner wall surface of a hole 40 which opens from the first conductor layer 32 through the second conductor layer 34; wherein the electrical insulator layer 20 has a heat resistant resin layer 22 containing a heat resistant resin and a resin powder; the resin powder is formed from a resin material containing a melt-formable fluororesin having a functional group such as a carbonyl group-containing group; the content of the resin powder is from 5 to 70 mass % to the heat resistant resin layer 22; and the electrical insulator layer 20 has a dielectric constant of from 2.0 to 3.5.

公开(公告)号：US20190112403A1

公开(公告)日：2019-04-18

申请号：US16200996

申请日：2018-11-27

Applicant: AGC Inc.

Inventor： Masatoshi ABE ,  Takashi SATO ,  Tomoya HOSODA ,  Takuya NAKAO

IPC: C08F214/26 ,  C08J5/18 ,  H01B13/14 ,  H01B3/44

Abstract: A process for producing a fluororesin in which a low-boiling component is reduced, by subjecting a melt-formable fluororesin to melt-kneading treatment by a twin screw extruder 10, wherein the twin screw extruder 10 has at least one melting zone, a set temperature of a most upstream first melting zone Z1 among melting zones is the melting point of the fluororesin +25 to 100° C., a vacuum degree at a vent port of the vacuum vent 14 is at most −0.07 MPa [gage], and a melt mass-flow rate α2 (g/10 min) of the fluororesin after the melt-kneading treatment at a specific temperature under a specific load, to a melt mass-flow rate α1 (g/10 min) of the fluororesin before the melt-kneading treatment at the same temperature under the same specific load satisfy α1

公开(公告)号：US20200338872A1

公开(公告)日：2020-10-29

申请号：US16924299

申请日：2020-07-09

Applicant: AGC Inc.

Inventor： Norio OZAWA ,  Tomoya HOSODA ,  Takashi SATO

IPC: B32B27/08 ,  B32B5/26 ,  B32B27/34 ,  B32B5/02 ,  C08J5/24

Abstract: The purpose of the present invention is to provide a laminate being excellent in chemical resistance, wear resistance, vibration absorption properties and flame resistance, and having high mechanical strength; and a method for its production. A laminate 1 comprises a fiber-reinforced resin layer 20 which comprises a reinforcing fiber base material and a resin component containing at least 50 vol % of a specific fluororesin, wherein the ratio of the reinforcing fiber base material to the total volume of the reinforcing fiber base material and the resin component is from 0.30 to 0.70, and a specific substrate 10, wherein at least one outermost layer is the fiber-reinforced resin layer 20, and the ratio of the total thickness of the fiber-reinforced resin layer 20 to the total thickness of the substrate 10 is from 1/99 to 30/70.