公开(公告)号：CA2285788A1

公开(公告)日：2000-04-09

申请号：CA2285788

申请日：1999-10-08

Applicant: AGENCY IND SCIENCE TECHN

Inventor： OYANAGI HIROYUKI ,  NIKI SHIGERU ,  YAMADA AKIMASA ,  FONS PAUL

IPC: H01L31/04 ,  H01L31/032 ,  H01L31/18

Abstract: A method of fabricating Cu.alpha.(In x Ga1-x).beta.(Se y Si-y)Y films for solar cells includes forming an electrode on a substrate and supplying the substrate and electrode with Cu, In, Ga, Se, and S to form a Cu.alpha.(In x Ga1-x).beta.(Se y Si-y)Y film. Simultaneously with the supplying of Cu, In, Ga, Se and S, the substrate is supplied with water vapor or a gas that contains a hydroxyl group.

公开(公告)号：CA2285788C

公开(公告)日：2003-07-01

申请号：CA2285788

申请日：1999-10-08

Applicant: AGENCY IND SCIENCE TECHN

Inventor： NIKI SHIGERU ,  OYANAGI HIROYUKI ,  YAMADA AKIMASA ,  FONS PAUL

IPC: H01L31/04 ,  H01L31/032 ,  H01L31/18

Abstract: A method of fabricating Cu.alpha.(In x Ga1-x).beta.(Se y Si-y)Y films for solar cells includes forming an electrode on a substrate and supplying the substrate and electrode with Cu, In, Ga, Se, and S to form a Cu.alpha.(In x Ga1-x).beta.(Se y Si-y)Y film. Simultaneously with the supplying of Cu, In, Ga, Se and S, the substrate is supplied with water vapor or a gas that contains a hydroxyl group.

公开(公告)号：JP2000114561A

公开(公告)日：2000-04-21

申请号：JP28749498

申请日：1998-10-09

Applicant: AGENCY IND SCIENCE TECHN

Inventor： NIKI SAKAE ,  YAMADA AKIMASA ,  PAUL FONS ,  OYANAGI HIROYUKI

IPC: H01L31/04 ,  H01L31/032

Abstract: PROBLEM TO BE SOLVED: To prevent occurrence of point defects (multiple voids) or laminate defects such as crystal twin, etc., caused in thin films to improve quality as well as enable lower temperature treatment and simplification of the manufacturing method. SOLUTION: A glass substrate 2 on which a rear-surface electrode 3 is formed is disposed in a vacuum tank 7 and a Cuα(InxGa1-x)β(SeyS1-y)γ thin film 4 is formed on the rear-surface electrode 3 on the glass substrate 2 by vapor- depositing or sputtering Cu, In, Ga, Se and S from a supply source 8. At this time, steam is irradiated onto the rear-surface electrode 3 on the glass substrate 2 from a supply source 9 to supply water or hydroxy group. Anion voids generated during the formation of the thin film are filled with oxygen so that generation of anion voids and multiple voids of cation-anion are prevented and the density of the twins correlating with anion voids is reduced.

公开(公告)号：JPS61270656A

公开(公告)日：1986-11-29

申请号：JP11167685

申请日：1985-05-24

Applicant: AGENCY IND SCIENCE TECHN

Inventor： YAMADA AKIMASA

IPC: G01N9/24 ,  G01N29/02

Abstract: PURPOSE:To detect the condition of the deposit on a plate or the condition of the plate without contact by setting the incident angle of the diagonal incident acoustic wave on the plate, the frequency of the acoustic wave and the thickness of the plate, exciting the plate wave propagating in the plate and detecting the above-mentioned condition from the change of the excitation state of the plate wave. CONSTITUTION:One side face of a housing 6 is formed of the plate 5 having the parallel front and rear. A wave transmitting element 8 is so disposed that the acoustic wave We emitted therefrom is reflected by the plate 5 and arrives at a wave receiving element 9. The relations among the incident angle of the wave We on the plate 5, the frequency of the wave We and the thickness of the plate 5 are adjusted and the plate wave propagating in the plate 5 is excited. The propagation speed of the plate wave is designated as Cp, the speed of the wave We in the liquid 7 as Cl and the incident angle of the wave We as theta, then the plate wave is excited in the plate 5 if the conditions Cl=Cp.sintheta are satisfied. The change of the excitation state of the plate wave is detected by an indicator 12, by which the detection of the sticking or contacting of the liquid and solid matter in addition to the detection of the deposition and settlement of powder are made possible. The discrimination of the characteristics of the sticking material and deposit is made possible. The corroding condition of the plate 5 is inspected as well by using the plate 5 as a material to be inspected and scanning the surface thereof with the acoustic wave.