公开(公告)号：EP2230889A4

公开(公告)日：2013-06-12

申请号：EP08792292

申请日：2008-08-07

Applicant: AIN CO LTD

Inventor： TAKEUCHI KOJI ,  MATSUDA MASAMI ,  ONO KAORU ,  HOSODA MAKOTO

IPC: H05K1/05 ,  H01L23/12 ,  H01L23/36 ,  H01L33/00 ,  H05K1/02

CPC classification number: H05K1/056 ,  H01L2924/0002 ,  H05K1/0274 ,  H05K2201/0162 ,  H05K2201/0209 ,  H05K2201/0281 ,  H05K2201/10106 ,  H05K2201/2054 ,  Y10T428/24917 ,  Y10T428/249994 ,  Y10T428/25 ,  Y10T428/252 ,  Y10T428/254 ,  Y10T428/31663 ,  H01L2924/00

Abstract: The present invention provides a wiring board giving good heat dissipation over a long period of use. The present invention also provides a method for producing a wiring board, including coating a surface of a metal substrate 2, which is made of an aluminium plate, with a composition 3 containing a substance having a polysiloxane structure and inorganic particles having insulating and heat-dissipating properties ( Fig. 1(B) ), curing the composition 3, then bonding a copper foil 4 to the cured composition 3A ( Fig. 1(C) ), and partially removing the copper foil 4, thereby forming a wiring layer 5 ( Fig. 1(D) ).