公开(公告)号：DE602005020148D1

公开(公告)日：2010-05-06

申请号：DE602005020148

申请日：2005-05-31

Applicant: ANALOG DEVICES INC

Inventor： MARTIN JOHN R ,  MENA MANOLO G ,  LACSAMANA ELMER S ,  DUFFY MICHAEL P ,  WEBSTER WILLIAM A ,  FELTON LAWRENCE E ,  KARPMAN MAURICE S

IPC: B81C1/00

Abstract: A method of producing a MEMS device removes the bottom side of a device wafer after its movable structure is formed. To that end, the method provides the device wafer, which has an initial bottom side. Next, the method forms the movable structure on the device wafer, and then removes substantially the entire initial bottom side of the device wafer. Removal of the entire initial bottom side effectively forms a final bottom side.