公开(公告)号：JP2010101900A

公开(公告)日：2010-05-06

申请号：JP2009278054

申请日：2009-12-07

Applicant: Analog Devices Inc ,  アナログ デバイシス, インコーポレイテッド

Inventor： KARPMAN MAURICE S ,  HABLUTZEL NICOLE ,  FARRELL PETER W ,  JUDY MICHAEL W ,  FELTON LAWRENCE E ,  LONG LEWIS

IPC: G01C19/56 ,  B81B7/00 ,  G01P9/04 ,  H01L23/04 ,  H01L23/06 ,  H01L23/50

CPC classification number: B81B7/0048 ,  H01L2224/32014 ,  H01L2924/1461 ,  H01L2924/16195 ,  H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To provide a packaged microchip with a premolded-type package. SOLUTION: A MEMS (micro electro mechanical systems) inertial sensor 10 is secured within a premolded-type package 12 formed from a low moisture permeable molding material. Consequently, such a motion detector can be produced more economically than those using ceramic packages. To those ends, the package 12 has at least one wall 13 extending from a lead frame 24 to form a cavity, and an isolator 22 within the cavity. The MEMS inertial sensor 10 has a movable structure suspended above a substrate having a bottom surface. The substrate bottom surface is secured to the isolator top surface at a contact area. The contact area is less than the surface area of the bottom surface of the substrate. Accordingly, the isolator 22 forms a space between at least a portion of the bottom substrate surface and the package 12. COPYRIGHT: (C)2010,JPO&INPIT

Abstract translation: 要解决的问题：提供具有预成型包装的封装微芯片。 解决方案：MEMS（微机电系统）惯性传感器10固定在由低透湿成型材料形成的预成型包装12内。 因此，与使用陶瓷封装的那些相比，这样的运动检测器可以比经济地生产。 在这些端部，包装12具有从引线框架24延伸以形成空腔的至少一个壁13和腔内的隔离件22。 MEMS惯性传感器10具有悬挂在具有底面的基板上方的可移动结构。 衬底底表面在接触区域处固定到隔离器顶表面。 接触面积小于基板底面的表面积。 因此，隔离器22在底部基板表面的至少一部分和封装12之间形成空间。（C）2010，JPO和INPIT

公开(公告)号：AU2002368046A1

公开(公告)日：2004-01-19

申请号：AU2002368046

申请日：2002-10-23

Applicant: ANALOG DEVICES INC

Inventor： COLLINS DAVID J ,  MARTIN JOHN R ,  WEBSTER WILLIAM A ,  FELTON LAWRENCE E ,  FARRELL PETER W ,  LUO JING

IPC: B81B7/00 ,  B81C1/00 ,  H01L23/10

公开(公告)号：AU2002368046A8

公开(公告)日：2004-01-19

申请号：AU2002368046

申请日：2002-10-23

Applicant: ANALOG DEVICES INC

Inventor： WEBSTER WILLIAM A ,  COLLINS DAVID J ,  MARTIN JOHN R ,  FARRELL PETER W ,  LUO JING ,  FELTON LAWRENCE E

IPC: B81B7/00 ,  B81C1/00 ,  H01L23/10

公开(公告)号：WO2004003965A3

公开(公告)日：2004-04-29

申请号：PCT/US0233811

申请日：2002-10-23

Applicant: ANALOG DEVICES INC

Inventor： FELTON LAWRENCE E ,  FARRELL PETER W ,  LUO JING ,  COLLINS DAVID J ,  MARTIN JOHN R ,  WEBSTER WILLIAM A

IPC: B81B7/00 ,  B81C1/00 ,  H01L23/10

CPC classification number: B81B7/0077 ,  B81C1/00896 ,  H01L23/10 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A MEMS capping method and apparatus uses a cap structure on which is formed a MEMS cavity, a cut capture cavity, and a cap wall. The cap wall is essentially the outer wall of the MEMS cavity and the inner wall of the cut capture cavity. The cap structure is bonded onto a MEMS structure such that the MEMS cavity covers protected MEMS components. The cap structure is trimmed by cutting through to the cut capture cavity from the top of the cap structure without cutting all the way through to the MEMS structure.

Abstract translation: MEMS封盖方法和装置使用其上形成有MEMS腔体，切割捕获腔体和盖壁的盖结构。 帽壁基本上是MEMS腔的外壁和切割捕获腔的内壁。 帽结构被结合到MEMS结构上，使得MEMS腔覆盖受保护的MEMS部件。 通过从帽结构的顶部切割到切割捕获空腔而不切割到MEMS结构，修剪帽结构。