公开(公告)号：WO02074686A3

公开(公告)日：2003-02-06

申请号：PCT/US0151501

申请日：2001-12-05

Applicant: ANALOG DEVICES INC

Inventor： SPOONER TIMOTHY R ,  COURAGE DAVID S ,  HARNEY KIERAN P ,  FELTON LAWRENCE E ,  LUO JING ,  WORKMAN BRAD ,  MARTIN JOHN R

IPC: B81B7/00 ,  B81C1/00 ,  H01L21/68

CPC classification number: H01L21/6836 ,  B81C1/00888 ,  B81C1/00896 ,  H01L2221/68327

Abstract: A wafer cap protects micro electromechanical system ("MEMS") structures during a dicing of a MEMS wafer to produce individual MEMS dies. A MEMS wafer is prepared having a plurality of MEMS structure sites thereon. Upon the MEMS wafer, the wafer cap is mounted to produce a laminated MEMS wafer. The wafer cap is recessed in areas corresponding to locations of the MEMS structure sites on the MEMS wafer. The capped MEMS wafer can be diced into a plurality of MEMS dies without causing damage to or contaminating the MEMS die.

Abstract translation: 在MEMS晶片的切割期间，晶片盖保护微机电系统（“MEMS”）结构以产生单独的MEMS管芯。 制备具有多个MEMS结构位置的MEMS晶片。 在MEMS晶片上，安装晶片盖以产生层压的MEMS晶片。 晶片盖凹入与MEMS晶片上的MEMS结构位置的位置对应的区域中。 封装的MEMS晶片可以切割成多个MEMS管芯，而不会损坏或污染MEMS管芯。