公开(公告)号：AU2003270331A1

公开(公告)日：2004-03-29

申请号：AU2003270331

申请日：2003-09-04

Applicant: ANALOG DEVICES INC

Inventor： HARNEY KIERAN P ,  LONG LEWIS

IPC: G01P9/04 ,  B81B3/00 ,  B81B7/00 ,  G01C19/56 ,  G01P15/08 ,  H01L21/58 ,  H01L23/00 ,  H01L23/08 ,  H01L23/16

Abstract: A packaged microchip has a stress sensitive microchip having a microchip coefficient of thermal expansion, a package having a package coefficient of thermal expansion, and an isolator having an isolator coefficient of thermal expansion. The isolator is connected between the stress sensitive microchip and the package. The microchip coefficient of thermal expansion illustratively is closer to the isolator coefficient of thermal expansion than it is to the package coefficient of thermal expansion.

公开(公告)号：WO2008089328A9

公开(公告)日：2008-09-25

申请号：PCT/US2008051310

申请日：2008-01-17

Applicant: ANALOG DEVICES INC ,  ZHANG XIN ,  JUDY MICHAEL W ,  HARNEY KIERAN P ,  WEIGOLD JASON W

Inventor： ZHANG XIN ,  JUDY MICHAEL W ,  HARNEY KIERAN P ,  WEIGOLD JASON W

IPC: H04R19/00

CPC classification number: H04R19/005 ,  B81B3/0027 ,  B81B2201/0257 ,  H04R7/20 ,  H04R2307/207

Abstract: A microphone has a movable diaphragm having a rest position, a stationary portion, and a set of springs movably coupling the diaphragm and the stationary portion. The diaphragm and stationary portion are spaced a first distance when the diaphragm is in the rest position. When not in the rest position, however, the diaphragm and stationary portion are capable of being spaced a second distance, which is greater than the first distance. Despite the change in distance, the diaphragm still is capable of returning the space from the second distance to the first distance when the diaphragm returns to the rest position.

Abstract translation: 麦克风具有可移动隔膜，其具有静止位置，静止部分以及可移动地联接隔膜和固定部分的一组弹簧。 当隔膜处于静止位置时，隔膜和固定部分间隔开第一距离。 然而，当不处于静止位置时，隔膜和静止部分能够间隔第二距离，第二距离大于第一距离。 尽管距离的变化，当隔膜返回到静止位置时，隔膜仍然能够将空间从第二距离返回到第一距离。

公开(公告)号：WO2008067431A3

公开(公告)日：2008-07-17

申请号：PCT/US2007085860

申请日：2007-11-29

Applicant: ANALOG DEVICES INC ,  ROBERTS CARL M ,  HARNEY KIERAN P ,  GRUSBY ALVIN ,  GOIDA THOMAS ,  SENGUPTA DIPAK ,  SULLIVAN RICHARD J

Inventor： ROBERTS CARL M ,  HARNEY KIERAN P ,  GRUSBY ALVIN ,  GOIDA THOMAS ,  SENGUPTA DIPAK ,  SULLIVAN RICHARD J

IPC: H04R19/04 ,  B81C1/00

CPC classification number: H04R19/005 ,  B81B2201/0257 ,  B81B2207/012 ,  B81C1/00269 ,  B81C2203/0109 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/3025 ,  H04R19/04 ,  H04R2499/11 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A microphone system has a base with at least one electrical port for electrically communicating with an external device. The system also has a solid metal lid coupled to the base to form an internal chamber, and a silicon microphone secured to the lid within the chamber. The lid has an aperture for receiving an audible signal, while the microphone is electrically connected to the electrical port of the base.

Abstract translation: 麦克风系统具有带有至少一个用于与外部装置进行电通信的电端口的基座。 该系统还具有连接到基座以形成内室的固体金属盖，以及固定在室内的盖上的硅麦克风。 盖具有用于接收可听信号的孔，而麦克风电连接到基座的电端口。

公开(公告)号：WO2007024958A3

公开(公告)日：2007-06-28

申请号：PCT/US2006032931

申请日：2006-08-23

Applicant: ANALOG DEVICES INC ,  WEIGOLD JASON W ,  ELKO GARY ,  HARNEY KIERAN P

Inventor： WEIGOLD JASON W ,  ELKO GARY ,  HARNEY KIERAN P

IPC: H04R3/00 ,  H04M1/03 ,  H04R1/24

CPC classification number: H04R3/005 ,  H04M1/035 ,  H04M1/19 ,  H04M1/6008 ,  H04R1/245 ,  H04R2410/05

Abstract: A microphone system has a base coupled with first and second microphone apparatuses. The first microphone apparatus is capable of producing a first output signal having a noise component, while the second microphone apparatus is capable of producing a second output signal. The system also has combining logic operatively coupled with the first microphone apparatus and the second microphone apparatus. The combining logic uses the second output signal to remove at least a portion of the noise component from the first output signal.

Abstract translation: 麦克风系统具有与第一和第二麦克风装置耦合的基座。 第一麦克风装置能够产生具有噪声分量的第一输出信号，而第二麦克风装置能够产生第二输出信号。 该系统还具有与第一麦克风装置和第二麦克风装置可操作地耦合的组合逻辑。 组合逻辑使用第二输出信号来从第一输出信号中去除至少一部分噪声分量。

公开(公告)号：WO02074686A3

公开(公告)日：2003-02-06

申请号：PCT/US0151501

申请日：2001-12-05

Applicant: ANALOG DEVICES INC

Inventor： SPOONER TIMOTHY R ,  COURAGE DAVID S ,  HARNEY KIERAN P ,  FELTON LAWRENCE E ,  LUO JING ,  WORKMAN BRAD ,  MARTIN JOHN R

IPC: B81B7/00 ,  B81C1/00 ,  H01L21/68

CPC classification number: H01L21/6836 ,  B81C1/00888 ,  B81C1/00896 ,  H01L2221/68327

Abstract: A wafer cap protects micro electromechanical system ("MEMS") structures during a dicing of a MEMS wafer to produce individual MEMS dies. A MEMS wafer is prepared having a plurality of MEMS structure sites thereon. Upon the MEMS wafer, the wafer cap is mounted to produce a laminated MEMS wafer. The wafer cap is recessed in areas corresponding to locations of the MEMS structure sites on the MEMS wafer. The capped MEMS wafer can be diced into a plurality of MEMS dies without causing damage to or contaminating the MEMS die.

Abstract translation: 在MEMS晶片的切割期间，晶片盖保护微机电系统（“MEMS”）结构以产生单独的MEMS管芯。 制备具有多个MEMS结构位置的MEMS晶片。 在MEMS晶片上，安装晶片盖以产生层压的MEMS晶片。 晶片盖凹入与MEMS晶片上的MEMS结构位置的位置对应的区域中。 封装的MEMS晶片可以切割成多个MEMS管芯，而不会损坏或污染MEMS管芯。

公开(公告)号：WO2008014324A2

公开(公告)日：2008-01-31

申请号：PCT/US2007074328

申请日：2007-07-25

Applicant: ANALOG DEVICES INC ,  HARNEY KIERAN P ,  WEIGOLD JASON ,  ELKO GARY

Inventor： HARNEY KIERAN P ,  WEIGOLD JASON ,  ELKO GARY

IPC: H04R1/22 ,  H04R3/00

CPC classification number: H04R3/005 ,  H04R1/245 ,  H04R2410/05

Abstract: A microphone system has a primary microphone for producing a primary signal, a secondary microphone for producing a secondary signal, and a selector operatively coupled with both the primary microphone and the secondary microphone. The system also has an output for delivering an output audible signal principally produced by one of the to microphones. The selector selectively permits either 1) at least a portion of the primary signal and/ or 2) at least a portion of the secondary signal to be forwarded to the output as a function of the noise in the primary signal.

Abstract translation: 麦克风系统具有用于产生主信号的主麦克风，用于产生辅助信号的次麦克风，以及可操作地与主麦克风和次麦克风耦合的选择器。 该系统还具有用于传送主要由麦克风之一产生的输出可听信号的输出。 选择器选择性地允许1）主信号的至少一部分和/或2）辅助信号的至少一部分作为主信号中的噪声的函数被转发到输出。

公开(公告)号：WO2007022249A3

公开(公告)日：2007-05-18

申请号：PCT/US2006031958

申请日：2006-08-16

Applicant: ANALOG DEVICES INC ,  HARNEY KIERAN P ,  MARTIN JOHN R ,  FELTON LAWRENCE E

Inventor： HARNEY KIERAN P ,  MARTIN JOHN R ,  FELTON LAWRENCE E

IPC: B81B7/00

CPC classification number: B81B7/0064 ,  B81B2201/0257 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/73265 ,  H01L2924/10253 ,  H01L2924/1461 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An apparatus has a leadframe based package base having a leadframe and a lid coupled with the package base. The lid and package base form a chamber for at least partially containing a microphone. The lid is electrically coupled with a given portion of the leadframe in the package base.

Abstract translation: 一种装置具有基于引线框架的封装基座，其具有引线框架和与封装基座耦合的盖子。 盖子和包装底座形成用于至少部分地容纳麦克风的腔室。 盖子与封装基座中的引线框架的给定部分电耦合。

公开(公告)号：WO2007022179A3

公开(公告)日：2007-05-18

申请号：PCT/US2006031825

申请日：2006-08-16

Applicant: ANALOG DEVICES INC ,  HARNEY KIERAN P ,  MARTIN JOHN R ,  FELTON LAWRENCE E

Inventor： HARNEY KIERAN P ,  MARTIN JOHN R ,  FELTON LAWRENCE E

IPC: B81B7/00

CPC classification number: B81B7/007 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014

Abstract: A package for a micro-electromechanical (MEMS) device is described. A premolded leadframe base has opposing top and bottom surfaces. Each surface is defined by a topology having at least one electrically conductive portion and at least one electrically non-conductive portion, and the topology of the top surface differs from the topology of the bottom surface.

Abstract translation: 描述了用于微机电（MEMS）装置的封装。 预制的引线框架底座具有相对的顶部和底部表面。 每个表面由具有至少一个导电部分和至少一个非导电部分的拓扑结构限定，并且顶表面的拓扑与底表面的拓扑不同。

公开(公告)号：WO2005026040A3

公开(公告)日：2005-07-07

申请号：PCT/US2004029133

申请日：2004-09-08

Applicant: ANALOG DEVICES INC ,  FELTON LAWRENCE E ,  HARNEY KIERAN P ,  ROBERTS CARL M

Inventor： FELTON LAWRENCE E ,  HARNEY KIERAN P ,  ROBERTS CARL M

IPC: B81B7/00 ,  G01P1/02 ,  G01P15/08

CPC classification number: B81B7/007 ,  B81B2201/0235 ,  G01P1/023 ,  G01P15/0802 ,  Y10T29/49007

Abstract: A sensor has a die (with a working portion), a cap coupled with the die to at least partially cover the working portion, and a conductive pathway extending through the cap to the working portion. The pathway provides an electrical interface to the working portion.

Abstract translation: 传感器具有模具（具有工作部分），与模具耦合以至少部分地覆盖工作部分的帽以及延伸穿过帽部到工作部分的导电通路。 该通道为工作部分提供电接口。

公开(公告)号：WO2004074168A3

公开(公告)日：2005-04-14

申请号：PCT/US2004005189

申请日：2004-02-20

Applicant: ANALOG DEVICES INC ,  LONG LEWIS ,  HARNEY KIERAN P

Inventor： LONG LEWIS ,  HARNEY KIERAN P

IPC: G01P9/04 ,  B81B20060101 ,  B81B3/00 ,  B81B7/00 ,  G01C19/56 ,  G01P15/08 ,  H01L21/58 ,  H01L23/00 ,  H01L23/08 ,  H01L23/13 ,  H01L23/16

CPC classification number: B81B7/0048 ,  H01L23/16 ,  H01L23/562 ,  H01L24/32 ,  H01L24/48 ,  H01L24/83 ,  H01L2224/2919 ,  H01L2224/32014 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15312 ,  H01L2924/16152 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2224/45099

Abstract: A packaged microchip has an isolator (24) that minimizes stress transmission from its package (12) to its microchip (16). To that end, the packaged microchip includes a stress sensitive microchip having a bottom surface with a bottom surface area, and a package having an integral isolator (12). The isolator (24) has a top surface (28) with a top surface area that is smaller than the bottom surface area of the microchip (16). The microchip bottom surface (30) is coupled to the top surface (28) of the isolator (24).

Abstract translation: 封装的微芯片具有最小化从其封装（12）到其微芯片（16）的应力传递的隔离器（24）。 为此，封装的微芯片包括具有底表面积的底表面的应力敏感微芯片和具有整体隔离器（12）的封装。 隔离器（24）具有顶表面（28），其顶表面积小于微芯片（16）的底表面积。 微芯片底表面（30）联接到隔离器（24）的顶表面（28）。