Abstract:
PURPOSE: A flexible package for a chip-on-chip and a package-on-package technology are provided to minimize a package substrate by eliminating pads and a conductor expanding from the pads. CONSTITUTION: An application integrated circuit(10) includes a core circuit(12), memory controllers(14A, 14B), a first physical layer interface(PHY) circuit(16A) and a second PHY circuit(16B). The first PHY circuit corresponds to a first interface. A second PHY circuit corresponds to the second interface. In the first and second interfaces, the integrated circuit communicates with the outside. First controlled collapse chip connection(C4) bumps(18A, 18B) are formed on the first PHY circuit. Second C4 bumps(18C, 18D) is formed on the second PHY circuit.
Abstract:
PROBLEM TO BE SOLVED: To provide flexible packaging for chip-on-chip and package-on-package technologies. SOLUTION: A packaging solution for an application integrated circuit (IC) and one or more other ICs is provided. The packaging solution may support both chip-on-chip packaging of the application IC and other ICs, and package-on-package packaging of the application IC and the other ICs. The package substrate may include a first set of pads proximate to the application IC to support chip-on-chip connection to the other IGs. The pads may be connected to conductors that extend underneath the application IC, to connect to the application IC. If the chip-on-chip solution proves reliable, support for the package-on-package solution may be eliminated and the package substrate may be reduced in size. COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To determine supply voltage magnitudes that ensure correct operation at the given frequency across all acceptable variations in the manufacturing process and all permissible operating temperatures.SOLUTION: An integrated circuit includes a self calibration unit configured to iterate a test on a logic circuit in the integrated circuit at respectively lower requested supply voltage magnitudes until the test fails. A lowest requested supply voltage magnitude at which the test passes is used to generate a requested supply voltage magnitude for the integrated circuit. The integrated circuit includes a series connection of logic gates physically distributed over an area of the integrated circuit, and a measurement unit configured to launch a logical transition into the series and detect a corresponding transition at the output of the series. The amount of time between the launch and the detection is used to request a supply voltage magnitude for the integrated circuit.
Abstract:
In one embodiment, an integrated circuit includes a self calibration unit configured to iterate a test on a logic circuit in the integrated circuit at respectively lower supply voltage magnitudes until the test fails. A lowest supply voltage magnitude at which the test passes is used to generate a requested supply voltage magnitude for the integrated circuit. In an embodiment, an integrated circuit includes a series connection of logic gates physically distributed over an area of the integrated circuit, and a measurement unit configured to launch a logical transition into the series and detect a corresponding transition at the output of the series. The amount of time between the launch and the detection is used to request a supply voltage magnitude for the integrated circuit.
Abstract:
A~n integrated circuit includes a logic circuit, a local power manager coupled to the logic circuit, and a self calibration unit. The local power manager is configured to transmit an indication of a requested supply voltage magnitude to an external power supply. The self calibration unit is configured to execute a test on the logic circuit, and to iterate the test at respectively lower requested supply voltage magnitudes until the test fails. A lowest requested supply voltage magnitude at which the test passes is used to generate the requested supply voltage magnitude for operation of the integrated circuit. The self calibration unit is further configured to iterate the test and determine the lowest requested supply voltage magnitude in response to the logic circuit executing a different workload.
Abstract:
A delay locked loop (DLL) includes a delay line configured to provide a delayed version of a reference clock as a feedback clock. The DLL also includes a phase detector that may provide an output signal that is indicative of a change in a delay associated with the delay line. The DLL may also include a step size controller that may provide a step size indication corresponding to a first step size in response to detecting the output signal indicating a first change in delay, and to provide a step size indications corresponding to a second step size that is smaller than the first step size in response to detecting the output signal indicating a second change in delay.
Abstract:
A memory circuit is disclosed that comprises a plurality of memory cells coupled to a virtual voltage rail. The plurality of memory cells may form, for example, a sub-array of an SRAM array. A switching circuit may be coupled between the virtual voltage rail and a voltage supply node, and a comparator may be coupled to compare a voltage level present on the virtual voltage rail to a reference voltage to thereby provide an output signal based on the comparison. The switching circuit may be configured to electrically couple the virtual voltage rail to the voltage supply node depending upon the output signal. In some embodiments, the switching circuit may be implemented using either a PMOS transistor or an NMOS transistor, although other embodiments may employ other switching circuits.
Abstract:
Semiconductor device modules having two or more integrated circuit dies mounted on opposing sides of a substrate. The integrated circuit dies are mounted by use of surface mount connections, such as flip chip connections implemented using conductive bumps. 5 Systems may include one or more of the present semiconductor device modules, and in some cases may also include other modules, such as a system module. 110a 22110b 200b 20a100 130 { 130 VVVV VVu .VVV VVVVVV VVVVVV VV VVVV VVV 200bor 3 100 110b 1)3 130 110a 210a 200a 210c 200c 130 110a 130 o 0 0 0 0 0 0 o 0 0 120a 120c o 0 0 0 0 0 0 0 0 0 0 0 io o o lo o o 0 o 0~l 0 o00 01 lo o o o10 o oi o l o0 0 lo o o ol lo o o ol 0 o 10 0 0 01 10 0 0 o o 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0