公开(公告)号：EP3384530A1

公开(公告)日：2018-10-10

申请号：EP17707450.7

申请日：2017-02-10

Applicant: Apple Inc.

Inventor： HU, Hsin-Hua ,  PEDDER, James E. ,  BITA, Ion ,  CHOI, Jaein ,  TANG, Hairong ,  HSU, Chin Wei ,  CHALASANI, Sandeep ,  CHEN, Chih-Lei ,  ONO, Shinya ,  KANG, Sunggu ,  HUANG, Jung Yen ,  TSAI, Lun

IPC: H01L25/075 ,  H01L25/16 ,  H01L23/00

CPC classification number: H01L25/0753 ,  H01L23/3157 ,  H01L23/3192 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L25/16 ,  H01L25/167 ,  H01L2224/10145 ,  H01L2224/11002 ,  H01L2224/11464 ,  H01L2224/1147 ,  H01L2224/13007 ,  H01L2224/13021 ,  H01L2224/13022 ,  H01L2224/13083 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/1601 ,  H01L2224/16112 ,  H01L2224/16238 ,  H01L2224/81193 ,  H01L2224/81815 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2924/3841 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2224/03 ,  H01L2224/11

Abstract: Micro LED and microdriver chip integration schemes are described. In an embodiment a microdriver chip includes a plurality of trenches formed in a bottom surface of the microdriver chip, with each trench surrounding a conductive stud extending below a bottom surface of the microdriver chip body. Integration schemes are additionally described for providing electrical connection to conductive terminal contacts and micro LEDs bonded to a display substrate and adjacent to a microdriver chip.

公开(公告)号：EP3308373A1

公开(公告)日：2018-04-18

申请号：EP16729707.6

申请日：2016-05-27

Applicant: Apple Inc.

Inventor： NAUTA, Tore ,  BAE, Hopil ,  SAKARIYA, Kapil V. ,  JEN, Henry C. ,  KANG, Sunggu ,  BAROUGHI, Mahadi Farrokh ,  HATANAKA, Shingo ,  LU, Xiang ,  PEDDER, James E. ,  CHOUDHARY, Saif ,  BITA, Ion ,  AKYOL, Hasan

IPC: G09G3/20 ,  G09G3/32 ,  H01L27/32

CPC classification number: G09G3/2088 ,  G09G3/2014 ,  G09G3/32 ,  G09G2300/0413 ,  G09G2300/0426 ,  G09G2300/0804 ,  G09G2300/0857 ,  G09G2310/027 ,  G09G2310/0272 ,  G09G2310/0291 ,  G09G2310/08 ,  G09G2330/08

Abstract: Display panel redundancy schemes and methods of operation are described. In an embodiment, and display panel includes an array of drivers (e.g. microdrivers), each of which including multiple portions to independently receive control and pixel bits. In an embodiment, each driver portion is to control a group of redundant emission elements.

公开(公告)号：WO2019147589A1

公开(公告)日：2019-08-01

申请号：PCT/US2019/014595

申请日：2019-01-22

Applicant: APPLE INC.

Inventor： SIZOV, Dmitry S. ,  BITA, Ion ,  DROLET, Jean-Jacques P. ,  LEONARD, John T. ,  STECKEL, Jonathan S. ,  LAWRENCE, Nathaniel T. ,  XIN, Xiaobin ,  BOSE, Ranojoy

IPC: H01L25/075 ,  H01L33/00 ,  H01L33/60 ,  H01L33/54 ,  H01L33/38 ,  H01L33/40 ,  H01L33/50

Abstract: Light emitting structures and methods of fabrication are described. In an embodiment, LED coupons are transferred to a carrier substrate and then patterned to LED mesa structures. Patterning may be performed on heterogeneous groups of LED coupons with a common mask set. The LED mesa structure are then transferred in bulk to a display substrate. In an embodiment, a light emitting structure includes an arrangement of LEDs with different thickness, and corresponding bottom contacts with different thicknesses bonded to a display substrate.