公开(公告)号：WO2019100081A3

公开(公告)日：2019-05-23

申请号：PCT/US2018/062143

申请日：2018-11-20

Applicant: APPLE INC.

Inventor： SIAHAAN, Edward ,  BLOOM, Daniel R. ,  LEBLANC, Jason J. ,  LI, Tian Shi ,  PANECKI, Lee M. ,  QIAN, Phillip ,  SHENG, Audrey L. ,  WHANG, Eugene Antony ,  KOLE, Jared M. ,  DOCHERTY, Sean J. ,  ILKORUR, Onur I. ,  HELLWIG, Alex C. ,  HEWITT, Oliver M. ,  KUBOYAMA, Yuta ,  ERICKSON, Christopher S. ,  KADETOTAD, Sneha ,  CORONA APARICIO, Edwin J. ,  MINERBI, Mike B. ,  TIKANDER, Miikka O. ,  SHAFFER, Benjamin A. ,  WRIGHT, Derek W. ,  ANDERSEN, Esge B. ,  ANANTHARAMAN, Rajesh ,  MATTINGLEY, Jacob E. ,  LIN, Tsu-Hui ,  ZUPKE, Robert D. ,  HATFIELD, Dustin A. ,  PATEL, Axit H.

IPC: H04R1/10 ,  H04R5/033

Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that include earpad assemblies that improve acoustic isolation are discussed. User convenience features that include automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.

公开(公告)号：WO2019100081A4

公开(公告)日：2019-05-23

申请号：PCT/US2018/062143

申请日：2018-11-20

Applicant: APPLE INC.

Inventor： SIAHAAN, Edward ,  BLOOM, Daniel R. ,  LEBLANC, Jason J. ,  LI, Tian Shi ,  PANECKI, Lee M. ,  QIAN, Phillip ,  SHENG, Audrey L. ,  WHANG, Eugene Antony ,  KOLE, Jared M. ,  DOCHERTY, Sean J. ,  ILKORUR, Onur I. ,  HELLWIG, Alex C. ,  HEWITT, Oliver M. ,  KUBOYAMA, Yuta ,  ERICKSON, Christopher S. ,  KADETOTAD, Sneha ,  CORONA APARICIO, Edwin J. ,  MINERBI, Mike B. ,  TIKANDER, Miikka O. ,  SHAFFER, Benjamin A. ,  WRIGHT, Derek W. ,  ANDERSEN, Esge B. ,  ANANTHARAMAN, Rajesh ,  MATTINGLEY, Jacob E. ,  LIN, Tsu-Hui ,  ZUPKE, Robert D. ,  HATFIELD, Dustin A. ,  PATEL, Axit H.

IPC: H04R1/10 ,  H04R5/033

Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that include earpad assemblies that improve acoustic isolation are discussed. User convenience features that include automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.