公开(公告)号：WO2019195288A1

公开(公告)日：2019-10-10

申请号：PCT/US2019/025384

申请日：2019-04-02

Applicant: APPLE INC.

Inventor： SIAHAAN, Edward ,  BLOOM, Daniel R. ,  PANECKI, Lee M. ,  QIAN, Phillip ,  SHAFFER, Benjamin A. ,  STRINGER, Christopher J. ,  WHANG, Eugene A. ,  NARAJOWSKI, David H. ,  OSHITA, Scott Y. ,  HATFIELD, Dustin A. ,  SEGRAVES, Zachary G. ,  DOCHERTY, Sean J.

IPC: H04R5/033

Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that include earpad assemblies that improve acoustic isolation are discussed. User convenience features that include automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.

公开(公告)号：WO2019100081A3

公开(公告)日：2019-05-23

申请号：PCT/US2018/062143

申请日：2018-11-20

Applicant: APPLE INC.

Inventor： SIAHAAN, Edward ,  BLOOM, Daniel R. ,  LEBLANC, Jason J. ,  LI, Tian Shi ,  PANECKI, Lee M. ,  QIAN, Phillip ,  SHENG, Audrey L. ,  WHANG, Eugene Antony ,  KOLE, Jared M. ,  DOCHERTY, Sean J. ,  ILKORUR, Onur I. ,  HELLWIG, Alex C. ,  HEWITT, Oliver M. ,  KUBOYAMA, Yuta ,  ERICKSON, Christopher S. ,  KADETOTAD, Sneha ,  CORONA APARICIO, Edwin J. ,  MINERBI, Mike B. ,  TIKANDER, Miikka O. ,  SHAFFER, Benjamin A. ,  WRIGHT, Derek W. ,  ANDERSEN, Esge B. ,  ANANTHARAMAN, Rajesh ,  MATTINGLEY, Jacob E. ,  LIN, Tsu-Hui ,  ZUPKE, Robert D. ,  HATFIELD, Dustin A. ,  PATEL, Axit H.

IPC: H04R1/10 ,  H04R5/033

Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that include earpad assemblies that improve acoustic isolation are discussed. User convenience features that include automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.

公开(公告)号：WO2022060382A1

公开(公告)日：2022-03-24

申请号：PCT/US2020/052447

申请日：2020-09-24

Applicant: APPLE INC.

Inventor： SOOHOO, Eric T. ,  AMINI, Mahmoud R. ,  BLOOM, Daniel R. ,  MCINTOSH, Sean T. ,  SHI LI, Tian ,  KOLE, Jared ,  LEBLANC, Jason ,  ELY, Colin M. ,  CAMERON, Peter ,  KINNEY, Michael ,  JOL, Eric ,  SIAHAAN, Edward ,  ZUPKE, Robert ,  GUPTA, Rohan ,  FRANCIS, Jordon J.

IPC: H01R24/60 ,  H01R13/6595 ,  H01R13/633 ,  H01R13/631 ,  H01R13/66 ,  H01R12/71

Abstract: Connector inserts and connector receptacles that have a small form factor and where when a connector insert and connector receptacle are mated, the connector insert can rotate and articulate relative to an electronic device housing the connector receptacle. The connector receptacle can be connected to components in the electronic device through a flexible circuit board having an amount of slack or excess length to allow the connector receptacle and the connector insert to rotate relative to the connected components. A bearing supporting the connector receptacle can articulate about an axis to allow the connector receptacle and connector insert to articulate relative to the connected components. The bearing can further support a locking mechanism to lock the connector insert in place in the connector receptacle.

公开(公告)号：WO2019100081A4

公开(公告)日：2019-05-23

申请号：PCT/US2018/062143

申请日：2018-11-20

Applicant: APPLE INC.

Inventor： SIAHAAN, Edward ,  BLOOM, Daniel R. ,  LEBLANC, Jason J. ,  LI, Tian Shi ,  PANECKI, Lee M. ,  QIAN, Phillip ,  SHENG, Audrey L. ,  WHANG, Eugene Antony ,  KOLE, Jared M. ,  DOCHERTY, Sean J. ,  ILKORUR, Onur I. ,  HELLWIG, Alex C. ,  HEWITT, Oliver M. ,  KUBOYAMA, Yuta ,  ERICKSON, Christopher S. ,  KADETOTAD, Sneha ,  CORONA APARICIO, Edwin J. ,  MINERBI, Mike B. ,  TIKANDER, Miikka O. ,  SHAFFER, Benjamin A. ,  WRIGHT, Derek W. ,  ANDERSEN, Esge B. ,  ANANTHARAMAN, Rajesh ,  MATTINGLEY, Jacob E. ,  LIN, Tsu-Hui ,  ZUPKE, Robert D. ,  HATFIELD, Dustin A. ,  PATEL, Axit H.

IPC: H04R1/10 ,  H04R5/033

Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that include earpad assemblies that improve acoustic isolation are discussed. User convenience features that include automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.

公开(公告)号：WO2019100081A2

公开(公告)日：2019-05-23

申请号：PCT/US2018/062143

申请日：2018-11-20

Applicant: APPLE INC.

Inventor： SIAHAAN, Edward ,  BLOOM, Daniel R. ,  LEBLANC, Jason J. ,  LI, Tian Shi ,  PANECKI, Lee M. ,  QIAN, Phillip ,  SHENG, Audrey L. ,  WHANG, Eugene Antony ,  KOLE, Jared M.

IPC: H04R1/10 ,  H04R5/033

CPC classification number: H04R5/0335 ,  H04R1/1033 ,  H04R1/1058 ,  H04R1/1066

Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that include earpad assemblies that improve acoustic isolation are discussed. User convenience features that include automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.

公开(公告)号：EP3971680A3

公开(公告)日：2022-06-08

申请号：EP21196766.6

申请日：2021-09-15

Applicant: Apple Inc.

Inventor： BLOOM, Daniel R. ,  WOJESKI, Chelsea E. ,  SIAHAAN, Edward ,  MORRIS, Nathan ,  HALEY, Ryan S. ,  LI, Tian Shi ,  RISTOSKI, Toni

IPC: G06F1/16

Abstract: There is provided an electronic device (200) comprising: a radio-frequency (RF) component; and an enclosure at least partially surrounding the RF component and comprising: a housing (210) formed from a metal material and defining: an exterior surface (206); a first surface (208b) extending inward from a first portion (206b) of the exterior surface, and a second surface (208f) facing the first surface and extending inward from a second portion (206f) of the exterior surface; and a window (214b) formed from an RF-transmissive material, positioned over the RF component, and adhered to the first and the second surfaces (208b, 208f), the RF-transmissive material (214b) including a thermoset composite material comprising nano-sized silica particles dispersed within a thermoset matrix.

公开(公告)号：EP3685593A2

公开(公告)日：2020-07-29

申请号：EP18815488.4

申请日：2018-11-20

Applicant: Apple Inc.

Inventor： SIAHAAN, Edward ,  BLOOM, Daniel R. ,  LEBLANC, Jason J. ,  LI, Tian Shi ,  PANECKI, Lee M. ,  QIAN, Phillip ,  SHENG, Audrey L. ,  WHANG, Eugene Antony ,  KOLE, Jared M. ,  SHAFFER, Benjamin A. ,  TIKANDER, Miikka O. ,  WRIGHT, Derek W. ,  MINERBI, Mike B. ,  ANDERSEN, Esge B. ,  CORONA APARICIO, Edwin J. ,  ANANTHARAMAN, Rajesh ,  KADETOTAD, Sneha ,  MATTINGLEY, Jacob E. ,  ERICKSON, Christopher, S. ,  LIN, Tsu-Hui ,  KUBOYAMA, Yuta ,  ZUPKE, Robert D. ,  HEWITT, Oliver M. ,  HATFIELD, Dustin A. ,  HELLWIG, Alex C. ,  PATEL, Axit H. ,  ILKORUR, Onur I. ,  DOCHERTY, Sean J.

IPC: H04R1/10 ,  H04R5/033

公开(公告)号：EP3565274A1

公开(公告)日：2019-11-06

申请号：EP19178742.3

申请日：2017-09-22

Applicant: Apple Inc.

Inventor： SMITH, William K. ,  DE IULIIS, Daniele ,  LECLERC, Michael E. ,  STRINGER, Christopher J. ,  TAN, Sung-Ho ,  DEGNER, Brett, W. ,  LAURENT, Kristopher P. ,  BLOOM, Daniel R. ,  NARAJOWSKY, David H. ,  DIEBEL, Markus

IPC: H04R5/033 ,  H04R1/10

Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that reduce the size of headphones and allow for small form-factor storage configurations are discussed. User convenience features that include synchronizing earpiece stem positions and automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.

公开(公告)号：EP4447321A3

公开(公告)日：2024-12-11

申请号：EP24196681.1

申请日：2020-09-25

Applicant: Apple Inc.

Inventor： CORONA APARICIO, Edwin J. ,  BLOOM, Daniel R. ,  LEBLANC, Jason Joseph

IPC: H01H25/06 ,  H04R1/10

Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that enhance user comfort and improve user control of the headphones are discussed. Various sensor configurations and electronic component positions are also discussed. User convenience features that include detachable cushions and automatically detecting the donning and doffing of headphones are also discussed.

公开(公告)号：EP3972282A1

公开(公告)日：2022-03-23

申请号：EP20198264.2

申请日：2020-09-25

Applicant: Apple Inc.

Inventor： BLOOM, Daniel R.

IPC: H04R1/10 ,  H04R5/033

Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that enhance user comfort and improve user control of the headphones are discussed. Various sensor configurations and electronic component positions are also discussed. User convenience features that include detachable cushions and automatically detecting the donning and doffing of headphones are also discussed.