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公开(公告)号：EP3570557A1
公开(公告)日：2019-11-20
申请号：EP19170264.6
申请日：2016-09-22
Applicant: Apple Inc.
Inventor： MCPEAK, James L. , CHANDRAMOHAN, Chandrahas Aralaguppe , ZÖRKENDÖRFER, Rico L. , PANECKI, Lee M. , KASAR, Darshan R. , WAGMAN, Daniel C. , RICH, Zachary C.
Abstract: A case for a pair of earbuds includes a housing having cavities to receive the pair of earbuds and charging circuitry that is configured to initiate charging of the pair of earbuds when an earbud detector detects that the earbuds are inserted within the cavities.
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公开(公告)号：WO2020069374A1
公开(公告)日：2020-04-02
申请号：PCT/US2019/053547
申请日：2019-09-27
Applicant: APPLE INC.
Inventor： MCINTOSH, Sean T. , DELLA ROSA, Jason C. , PARKER, Samuel G. , COUSINS, Benjamin A. , HUWE, Ethan L. , STANLEY, Craig M. , TWEHUES, Brian R. , GHAHRI SARABI, Mohammad Soroush , GRINKER, Scott C. , ANDERSEN, Esge , SIAHAAN, Edward , JUHNKE, Ethan W. , ZHANG, Mei , HUA, Thanh P. , JI, Qigen , ZHU, Hao , SANG, Haochuan , CHAWAN, Arun D. , PANECKI, Lee M. , LEBLANC, Jason J. , WU, Meiting
Abstract: Embodiments describe an eartip including an eartip body having an attachment end and an interfacing end opposite from the attachment end. The eartip body can include an inner eartip body having a sidewall extending between the interfacing end and the attachment end, the sidewall defining a channel and having a first thickness near the attachment end and a second thickness different from the first thickness at the interfacing end. The eartip can also include an attachment structure coupled to the inner eartip body at the attachment end, the attachment structure having an inner surface and an outer surface. The attachment structure can include an upper region interfacing with the sidewall and defining discrete through-holes, a lower region below the upper region where the inner surface defines a plurality of recesses positioned around the lower region, and a mesh extending across the channel and into the upper region.
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公开(公告)号：WO2019195288A1
公开(公告)日：2019-10-10
申请号：PCT/US2019/025384
申请日：2019-04-02
Applicant: APPLE INC.
Inventor： SIAHAAN, Edward , BLOOM, Daniel R. , PANECKI, Lee M. , QIAN, Phillip , SHAFFER, Benjamin A. , STRINGER, Christopher J. , WHANG, Eugene A. , NARAJOWSKI, David H. , OSHITA, Scott Y. , HATFIELD, Dustin A. , SEGRAVES, Zachary G. , DOCHERTY, Sean J.
IPC: H04R5/033
Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that include earpad assemblies that improve acoustic isolation are discussed. User convenience features that include automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.
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公开(公告)号：WO2019100081A3
公开(公告)日：2019-05-23
申请号：PCT/US2018/062143
申请日：2018-11-20
Applicant: APPLE INC.
Inventor： SIAHAAN, Edward , BLOOM, Daniel R. , LEBLANC, Jason J. , LI, Tian Shi , PANECKI, Lee M. , QIAN, Phillip , SHENG, Audrey L. , WHANG, Eugene Antony , KOLE, Jared M. , DOCHERTY, Sean J. , ILKORUR, Onur I. , HELLWIG, Alex C. , HEWITT, Oliver M. , KUBOYAMA, Yuta , ERICKSON, Christopher S. , KADETOTAD, Sneha , CORONA APARICIO, Edwin J. , MINERBI, Mike B. , TIKANDER, Miikka O. , SHAFFER, Benjamin A. , WRIGHT, Derek W. , ANDERSEN, Esge B. , ANANTHARAMAN, Rajesh , MATTINGLEY, Jacob E. , LIN, Tsu-Hui , ZUPKE, Robert D. , HATFIELD, Dustin A. , PATEL, Axit H.
Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that include earpad assemblies that improve acoustic isolation are discussed. User convenience features that include automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.
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公开(公告)号：WO2019100081A4
公开(公告)日：2019-05-23
申请号：PCT/US2018/062143
申请日：2018-11-20
Applicant: APPLE INC.
Inventor： SIAHAAN, Edward , BLOOM, Daniel R. , LEBLANC, Jason J. , LI, Tian Shi , PANECKI, Lee M. , QIAN, Phillip , SHENG, Audrey L. , WHANG, Eugene Antony , KOLE, Jared M. , DOCHERTY, Sean J. , ILKORUR, Onur I. , HELLWIG, Alex C. , HEWITT, Oliver M. , KUBOYAMA, Yuta , ERICKSON, Christopher S. , KADETOTAD, Sneha , CORONA APARICIO, Edwin J. , MINERBI, Mike B. , TIKANDER, Miikka O. , SHAFFER, Benjamin A. , WRIGHT, Derek W. , ANDERSEN, Esge B. , ANANTHARAMAN, Rajesh , MATTINGLEY, Jacob E. , LIN, Tsu-Hui , ZUPKE, Robert D. , HATFIELD, Dustin A. , PATEL, Axit H.
Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that include earpad assemblies that improve acoustic isolation are discussed. User convenience features that include automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.
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Patent Agency Ranking
公开(公告)号：WO2019100081A2
公开(公告)日：2019-05-23
申请号：PCT/US2018/062143
申请日：2018-11-20
Applicant: APPLE INC.
Inventor： SIAHAAN, Edward , BLOOM, Daniel R. , LEBLANC, Jason J. , LI, Tian Shi , PANECKI, Lee M. , QIAN, Phillip , SHENG, Audrey L. , WHANG, Eugene Antony , KOLE, Jared M.
CPC classification number: H04R5/0335 , H04R1/1033 , H04R1/1058 , H04R1/1066
Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that include earpad assemblies that improve acoustic isolation are discussed. User convenience features that include automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.
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公开(公告)号：WO2017058675A2
公开(公告)日：2017-04-06
申请号：PCT/US2016/053580
申请日：2016-09-23
Applicant: APPLE INC.
Inventor： ZORKENDORFER, Rico L. , PANECKI, Lee M. , KASAR, Darshan R. , WAGMAN, Daniel C. , RICH, Zachary C. , MCPEAK, James L. , CHANDRAMOHAN, Chandrahas Aralaguppe , WATSON, Robert Doran , COFFMAN, Patrick L. , BRINSFIELD, Jason W.
IPC: H04R1/10
CPC classification number: H04R1/1041 , A45C11/00 , A45C11/24 , A45C13/005 , A45C13/02 , A45C13/1069 , A45C2011/001 , A45C2013/026 , B65D25/02 , B65D43/16 , F16B2001/0035 , H01R13/521 , H02J7/0044 , H02J7/0047 , H02J7/025 , H02J7/027 , H02J2007/0096 , H04B1/385 , H04B1/3888 , H04B5/0037 , H04M1/6033 , H04R1/02 , H04R1/1016 , H04R1/1025 , H04R1/1058 , H04R1/1075 , H04R1/2826 , H04R1/2857 , H04R1/345 , H04R5/033 , H04R9/025 , H04R9/06 , H04R2201/105 , H04R2420/07 , H04R2460/03 , H04R2460/09 , H04R2460/17
Abstract: A case for a pair of earbuds includes a housing having cavities to receive the pair of earbuds and charging circuitry that is configured to initiate charging of the pair of earbuds when an earbud detector detects that the earbuds are inserted within the cavities.
Abstract translation: 用于一对耳塞的壳体包括具有用于接收一对耳塞的空腔的壳体和充电电路，其被配置为当耳塞检测器检测到耳塞插入空腔内时开始对该对耳塞进行充电。
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公开(公告)号：EP3777236A1
公开(公告)日：2021-02-17
申请号：EP19717705.8
申请日：2019-04-02
Applicant: Apple Inc.
Inventor： SIAHAAN, Edward , BLOOM, Daniel R. , PANECKI, Lee M. , QIAN, Phillip , SHAFFER, Benjamin A. , STRINGER, Christopher J. , WHANG, Eugene A. , NARAJOWSKI, David H. , OSHITA, Scott Y. , HATFIELD, Dustin A. , SEGRAVES, Zachary G. , DOCHERTY, Sean J.
IPC: H04R5/033
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公开(公告)号：EP3153056B1
公开(公告)日：2018-12-05
申请号：EP16190180.6
申请日：2016-09-22
Applicant: Apple Inc.
Inventor： ALBONICO, Marcus , YANG, Shannon X. , PANECKI, Lee M. , CHAWAN, Arun D. , LeBLANC, Jason J.
CPC classification number: H04R1/1041 , A45C11/00 , A45C11/24 , A45C13/005 , A45C13/02 , A45C13/1069 , A45C2011/001 , A45C2013/026 , B65D25/02 , B65D43/16 , F16B2001/0035 , H01R13/521 , H02J7/0044 , H02J7/0047 , H02J7/025 , H02J7/027 , H02J2007/0096 , H04B1/385 , H04B1/3888 , H04B5/0037 , H04M1/6033 , H04R1/02 , H04R1/1016 , H04R1/1025 , H04R1/1058 , H04R1/1075 , H04R1/2826 , H04R1/2857 , H04R1/345 , H04R5/033 , H04R9/025 , H04R9/06 , H04R2201/105 , H04R2420/07 , H04R2460/03 , H04R2460/09 , H04R2460/17
Abstract: A case for a pair of wireless earbuds includes a lid and a lid sensor configured to generate a detect signal when the lid is moved from a closed position to an open position. The case further includes circuitry configured to, in response to receiving the detect signal, send a signal to the wireless earbuds to turn them on and to initiate a pairing sequence between the wireless earbuds and an electronic device.
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公开(公告)号：EP4258688A2
公开(公告)日：2023-10-11
申请号：EP23157342.9
申请日：2023-02-17
Applicant: Apple Inc.
Inventor： COUSINS, Benjamin A. , OWENS, Travis , JAIN, Karan , PANECKI, Lee M. , ZHANG, Mei , CANNING, Julia
Abstract: An earphone comprising: a device housing that defines an interior cavity within the device housing; an acoustic port formed through a wall of the device housing; an audio driver disposed within the device housing and aligned to emit sound through the acoustic port; a user input region disposed along an exterior surface of the device housing; a flex circuit disposed within the interior cavity, the flex circuit including a first portion bonded at a first location to an inner surface of the device housing directly beneath the user-input region, a second portion bonded at a second location to an inner surface of the device housing spaced apart from the first location, and a third portion extending between the first and second portions; a force pixel disposed within the interior cavity and mounted to the first portion of the flex circuit below the user input region; a plurality of touch pixels disposed within the interior cavity between the force pixel and the user input region; sensor control circuitry disposed within the interior cavity and mounted to the second portion of the flex circuit; and a wireless antenna disposed within the interior cavity defined by the device housing.
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