Abstract:
Various structures and methods are disclosed for packaging a biometric sensor, such as a capacitive biometric sensor. Embodiments incorporate various placements of the biometric sensor, structure surrounding a biometric sensor, connection structures (electrical, physical, or both), and techniques for enhanced sensor imaging, sensor retention, and guiding a user's finger to a proper location above a biometric sensor. For example, A biometric sensor assembly can include an aperture formed in a trim with a cap disposed in the aperture. A biometric sensor may be positioned below the cap and a switch positioned below the biometric sensor.
Abstract:
An enclosure and a method for forming an enclosure are disclosed. The enclosure may be formed from metal, such as aluminum, and further include a non-metal portion allowing for transmission and receipt of electromagnetic waves. The non-metal portion may be interlocked to the enclosure and in particular, to a region within the enclosure including a first material having a relatively high strength and stiffness compared to the non-metal portion. Interlocking means may include forming dovetail cuts into the enclosure to receive the non-metal portion, a hole or cavity drilled into the enclosure which includes internal threads, and a rod inserted into the first material to provide a tension to the non-metal portion. Methods of assembling internal components using anodization are also disclosed.
Abstract:
An electronic device having multiple housing components interlocked together by a molded material is disclosed. In order to provide interlocking surfaces for the molded material, the housing components can include various geometries designed to receive and retain the molded material such that the housing components are secured with one another. For example, a first housing part can undergo several material removal operations to form multiple ribs, each with through holes. When the molded material extends along the ribs and into the through holes, the molded material cures and interlocks with the first housing part. A second housing part can include several stepped indentions that receive the molded material. Also, a third housing part can include a dovetail indention to receive the molded material such that the first and second housing parts interlock with the third housing part. The indentions can provide retention in three dimensions to protect against decoupling.
Abstract:
Sensor assemblies for electronic devices are described. According to some embodiments, the sensor assemblies include solid-state sensors, such as capacitive sensors, piezoelectric sensors or piezoresistive sensors. The sensor assemblies can include a number of features that provide a compact profile, making them well suited for integration into small spaces of electronic device enclosures. The sensor assemblies can also include features that isolate movement of various parts of the sensor assemblies, allowing for accurate detection of a sensing event. According to some embodiments, the sensor assemblies are coupled to haptic actuators, speaker, or both, which mimic the feel of a mechanical button and enhance a user's experience.
Abstract:
An input device can be integrated within an electronic device and/or operably connected to an electronic device through a wired or wireless connection. The input device can include one or more force sensors positioned below a cover element of the input device or an input surface of the electronic device. The input device can include other components and/or functionality, such as a biometric sensor and/or a switch element.
Abstract:
An electronic device may include a biometric sensing device that has a sensing area, and a substrate positioned above the sensing area and/or the biometric sensing device. The substrate can include vias that are formed through at least a portion of the substrate. The vias can be positioned at least above the sensing area of the biometric sensing device. The vias may be filled with a conductive material or a dielectric material. Alternatively, some vias can be filled with a conductive material while other vias are filled with a non-conductive or dielectric material.
Abstract:
Systems, methods, and devices are disclosed for applying concealment of components of an electronic device 10. In one embodiment, an electronic device 10 may include a component, e.g., 20, 32, 24, that is disposed behind a window 24 configured to selectively become transparent or opaque, such as a polymer- dispersed liquid crystal PDLC window. The component includes an image capture device 20, a strobe flash 32, a biometric sensor 34, a light sensor, a proximity sensor, or a solar panel, or a combination thereof. Additionally, the electronic device 10 includes data processing circuitry 12 configured to determine when an event requesting that the component be exposed occurs. Furthermore, the electronic device 10 includes a window controller 22 that may control the window 24 to become transparent, to expose the component upon the occurrence of the event requesting that the component be exposed.
Abstract:
An electronic device having liquid-resistant modifications that prevent liquid ingress into an opening (or openings) in an enclosure of the electronic device is disclosed. For example, the electronic device may include a coating formed from a liquid-resistant material that is applied internally to the enclosure. The electronic device may further include a frame that carries a protective transparent layer designed to cover a display assembly. In order to secure the frame with the enclosure, the electronic device may include an adhesive assembly disposed over an outer perimeter of the coating. The adhesive assembly may include several adhesive parts initially separate from one another. However, with the adhesive parts between the frame and the enclosure, the adhesive parts can be compressed by the frame and the enclosure, causing the adhesive parts to expand and engage each other. As a result, the coating and the adhesive parts provide a seal against liquid.
Abstract:
Systems and methods for forming button assemblies for electronic devices are disclosed. According to some embodiments, the button assemblies include one or more sound improvement features to improve the sound that the button assemblies make when pressed by users of the electronic devices. According to some embodiments, the button assemblies include shims that provide proper alignment of the various components of the button assemblies and to accommodate any tolerance stack up of the various components of the button assemblies. The shims can include alignment features to prevent the shims from shifting within the button assemblies. According to some embodiments, thicknesses of the shims are customized to accommodate varying tolerance stack ups of the components of the button assemblies. In some embodiments, the button assemblies include a combination of sound improvement features and shims.
Abstract:
The embodiments discussed herein relate to electrical switches. Specifically, the embodiments include a pivoting switch that translates a rotational movement of a portion of the pivoting switch into a linear movement for toggling a button. The pivoting switch can include a pin that extends into a bracket in order to define and limit a rotational movement of the pivoting switch. The pivoting switch can further include a switch cavity that can force a knob of the button to move with the pivoting switch. The embodiments can further include an electrical switch having a welded cover plate. The welded cover plate can include arms that extend across and are welded to one or more surfaces of the electrical switch. The welded cover plate provides a more secure retaining mechanism for the electrical switch in order to reduce bending of certain portions of the electrical switch when the electrical switch is toggled.