MECHANISMS THAT TRANSFER LIGHT BETWEEN LAYERS OF MULTI-CHIP PHOTONIC ASSEMBLIES

    公开(公告)号:EP4155789A1

    公开(公告)日:2023-03-29

    申请号:EP22195436.5

    申请日:2022-09-13

    Applicant: Apple Inc.

    Abstract: There is provided a multi-chip photonic assembly, comprising: a first photonic integrated circuit (410) including a first waveguide (413) having: a first region that occupies a first horizontal plane and has a first vertical dimension; and a second region (414) that has a second vertical dimension that is larger than the first vertical dimension, the second region comprising a first adiabatic taper; and a second photonic integrated circuit (420), including a second waveguide (423), stacked vertically over the first photonic integrated circuit, the second waveguide (423) having: a third region that occupies a second horizontal plane and has a third vertical dimension; and a fourth region (424) that has a fourth vertical dimension that is larger than the third vertical dimension, the fourth region comprising a second adiabatic taper; wherein: the second region (414) is positioned in the second horizontal plane; and the second region (414) and the fourth region (424) change a mode of light (450) travelling between the first photonic integrated circuit (410) and the second photonic integrated circuit (420).

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