Abstract:
An electronic device can include a housing forming an aperture within an exterior surface of the housing. An electronic component can be disposed within the housing and include a receptacle coupled to the electronic component. The housing and the receptacle can form an electrical port. The electronic device can further include a first engagement feature and a cable having a first plug connector and a second plug connector. The first plug connector can include a boot, a plug, and a second engagement feature. The boot is receivable within the aperture formed within the exterior surface of the housing. The plug is receivable within the receptacle to electrically couple the electronic device with the cable. The second engagement feature can interconnect or otherwise engage the first engagement feature to retain the cable to the electronic device.
Abstract:
A thermal management system for an electromagnetic induction-power transfer system. The system may include a charging apparatus including a housing that defines an interface surface. An accessory or induction-power consuming apparatus may be positioned proximate to the interface surface. The housing of the charging apparatus may include a power source and a power-transferring coil coupled to the power source and positioned below the interface surface. A thermal mass may be positioned within the housing and spaced apart from the interface surface. The housing may include a thermal path that is configured to conduct heat from the interface surface to the thermal mass.
Abstract:
An inductor coil for an inductive energy transfer system includes multiple layers of a single wire having windings that are interlaced within at least two of the multiple layers such that both an input end and an output end of the wire enter and exit the coil on a same side of the coil. The input end and the output end of the wire may abut one another at the location where the input and output wires enter and exit the inductor coil. The wire can include one or more bundles of strands and the strands in each bundle are twisted around an axis extending along a length of the wire, and when there are at least two bundles, the bundles may be twisted around the axis. At least one edge of the inductor coil can be formed into a variety of shapes, such as in a curved shape.
Abstract:
A first and second electronic device each including a connection surface and a magnetic element. The first and second devices may be in contact along the respective connection surfaces. The magnetic elements may be configured to align the first and second devices by moving either or both of the first and second devices relative to each other to achieve an aligned position. The magnetic element may also be operative to resist disconnection of first and second electronic devices when in the aligned position.
Abstract:
A first component (105) is coupled to a second component (102) by one or more joints (103;107). Magnetic force between at least a first magnetic (106) and second magnetic unit (104) preloads the joint by placing the joint in compression. The first and second magnetic units (106; 104) may be respectively coupled to the first and second components (105; 102). The magnetic force acts as a retentive force between coupled components and/or the joint and operates to resist one or more tensile and/or other opposing forces. In some cases, the first magnetic unit may be a shield, such as a direct current shield, that protects one or more components from a magnetic field of the second magnetic unit.
Abstract:
A first electronic device connects with an second electronic device. The first electronic device may include a first connection surface and an inductive power transfer receiving coil and a first magnetic element positioned adjacent to the first connection surface. The second electronic device may similarly include a second connection surface and an inductive power transfer transmitting coil and second magnetic element positioned adjacent to the second connection surface. In the aligned position, alignment between the electronic devices may be maintained by magnetic elements and the inductive power coils may be configured to exchange power. The magnetic elements and/or the inductive power coils may include a shield that is configured to minimize or reduce eddy currents caused in the magnetic elements by the inductive power coils.
Abstract:
A first and second electronic device each including a connection surface and a magnetic element. The first and second devices may be in contact along the respective connection surfaces. The magnetic elements may be configured to align the first and second devices by moving either or both of the first and second devices relative to each other to achieve an aligned position. The magnetic element may also be operative to resist disconnection of first and second electronic devices when in the aligned position.
Abstract:
A first and second electronic device each including a connection surface and a magnetic element. The first and second devices may be in contact along the respective connection surfaces. The magnetic elements may be configured to align the first and second devices by moving either or both of the first and second devices relative to each other to achieve an aligned position. The magnetic element may also be operative to resist disconnection of first and second electronic devices when in the aligned position.
Abstract:
A first electronic device connects with an second electronic device. The first electronic device may include a first connection surface and an inductive power transfer receiving coil and a first magnetic element positioned adjacent to the first connection surface. The second electronic device may similarly include a second connection surface and an inductive power transfer transmitting coil and second magnetic element positioned adjacent to the second connection surface. In the aligned position, alignment between the electronic devices may be maintained by magnetic elements and the inductive power coils may be configured to exchange power. The magnetic elements and/or the inductive power coils may include a shield that is configured to minimize or reduce eddy currents caused in the magnetic elements by the inductive power coils.