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    MAGNETIC SHIELDING IN INDUCTIVE POWER TRANSFER
    1.
    发明申请
    MAGNETIC SHIELDING IN INDUCTIVE POWER TRANSFER 审中-公开
    感应电力传输中的磁屏蔽

    公开(公告)号：WO2015148489A2

    公开(公告)日：2015-10-01

    申请号：PCT/US2015/022222

    申请日：2015-03-24

    Applicant: APPLE INC.

    Inventor： GOLKO, Albert J. ,  JOL, Eric S. ,  GRAHAM, Christopher S. ,  YAO, Stephen E. ,  BRZEZINSKI, Makiko K. ,  WAGMAN, Daniel C. ,  THOMPSON, Paul J. ,  KALYANASUNDARAM, Nagarajan

    IPC: H01F27/36

    CPC classification number: H01F38/14 ,  H01F27/365 ,  H01F2027/348

    Abstract: A first electronic device connects with an second electronic device. The first electronic device may include a first connection surface and an inductive power transfer receiving coil and a first magnetic element positioned adjacent to the first connection surface. The second electronic device may similarly include a second connection surface and an inductive power transfer transmitting coil and second magnetic element positioned adjacent to the second connection surface. In the aligned position, alignment between the electronic devices may be maintained by magnetic elements and the inductive power coils may be configured to exchange power. The magnetic elements and/or the inductive power coils may include a shield that is configured to minimize or reduce eddy currents caused in the magnetic elements by the inductive power coils.

    Abstract translation: 第一电子设备与第二电子设备连接。 第一电子设备可以包括第一连接表面和感应功率传递接收线圈以及邻近第一连接表面定位的第一磁性元件。 第二电子设备可以类似地包括第二连接表面和感应功率传递传递线圈以及邻近第二连接表面定位的第二磁性元件。 在对准位置，可以通过磁性元件来维持电子设备之间的对准，并且感应功率线圈可被配置为交换电力。 磁性元件和/或感应功率线圈可以包括被配置为最小化或减少由感应功率线圈在磁性元件中引起的涡流的屏蔽。

    PREDICTIVE CONTROL SYSTEMS AND METHODS
    2.
    发明申请
    PREDICTIVE CONTROL SYSTEMS AND METHODS 审中-公开
    预测控制系统和方法

    公开(公告)号：WO2016195775A1

    公开(公告)日：2016-12-08

    申请号：PCT/US2016/022568

    申请日：2016-03-16

    Applicant: APPLE INC.

    Inventor： KALYANASUNDARAM, Nagarajan ,  NIGEN, Jay S. ,  ISMAIL, James S. ,  TAN, Richard H.

    IPC: G06F1/20 ,  G06F1/32

    CPC classification number: G06F1/206 ,  G06F1/329 ,  G06F1/3296 ,  Y02D10/24

    Abstract: Systems and methods are disclosed for determining a current machine state of a processing device, predicting a future processing task to be performed by the processing device at a future time, and predicting a list of intervening processing tasks to be performed by a first time (e.g. a current time) and the start of the future processing task. The future processing task has an associated initial state. A feed-forward thermal prediction model determines a predicted future machine state at the time for starting the future processing task. Heat mitigation processes can be applied in advance of the starting of the future processing task, to meet the future initial machine state for starting the future processing task.

    Abstract translation: 公开了用于确定处理装置的当前机器状态的系统和方法，预测未来处理装置将来执行的未来处理任务，并预测第一次执行的中间处理任务列表（例如， 当前时间）和未来处理任务的开始。 未来的处理任务具有相关的初始状态。 前馈热预测模型确定在开始未来处理任务时的预测未来机器状态。 可以在未来的处理任务开始之前应用减热过程，以满足未来开始未来处理任务的初始机状态。

    CLADDED METAL STRUCTURES FOR DISSIPATION OF HEAT IN A PORTABLE ELECTRONIC DEVICE
    4.
    发明公开
    CLADDED METAL STRUCTURES FOR DISSIPATION OF HEAT IN A PORTABLE ELECTRONIC DEVICE 审中-公开

    公开(公告)号：EP3579674A3

    公开(公告)日：2020-03-04

    申请号：EP19176560.1

    申请日：2019-05-24

    Applicant: Apple Inc.

    Inventor： COUNTS, William A. ,  MISRA, Abhijeet ,  KALYANASUNDARAM, Nagarajan ,  YURKO, James A.

    IPC: H05K7/20 ,  G06F1/20 ,  H04M1/02

    Abstract: This application relates to an enclosure for a portable electronic device is described. The enclosure can include metal bands included along the enclosure and a support structure. The support structure can include a thermally conductive core that is capable of conducting thermal energy generated by the operational components and rails that are bound between the metal bands and the thermally conductive core, where the rails are characterized as having a rate of thermal conductivity that is less than a rate of thermal conductivity of the thermally conductive core so that the thermal energy generated by the operational component is directed away from the operational component and away from the metal bands.

    CLADDED METAL STRUCTURES FOR DISSIPATION OF HEAT IN A PORTABLE ELECTRONIC DEVICE
    5.
    发明公开
    CLADDED METAL STRUCTURES FOR DISSIPATION OF HEAT IN A PORTABLE ELECTRONIC DEVICE 审中-公开

    公开(公告)号：EP3579674A2

    公开(公告)日：2019-12-11

    申请号：EP19176560.1

    申请日：2019-05-24

    Applicant: Apple Inc.

    Inventor： COUNTS, William A. ,  MISRA, Abhijeet ,  KALYANASUNDARAM, Nagarajan ,  YURKO, James A.

    IPC: H05K7/20 ,  G06F1/20 ,  H04M1/02

    Abstract: This application relates to an enclosure for a portable electronic device is described. The enclosure can include metal bands included along the enclosure and a support structure. The support structure can include a thermally conductive core that is capable of conducting thermal energy generated by the operational components and rails that are bound between the metal bands and the thermally conductive core, where the rails are characterized as having a rate of thermal conductivity that is less than a rate of thermal conductivity of the thermally conductive core so that the thermal energy generated by the operational component is directed away from the operational component and away from the metal bands.

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