公开(公告)号：EP4006972A3

公开(公告)日：2022-12-28

申请号：EP22150527.4

申请日：2014-07-29

Applicant: Apple Inc.

Inventor： ZERBE, Jared L. ,  FANG, Emerson S. ,  ZHAI, Jun ,  SEARLES, Shawn

IPC: H01L25/16 ,  H01L23/64 ,  H01G4/228 ,  H01G4/232 ,  H01L49/02 ,  H01L23/13 ,  H01L25/18 ,  H01L25/065

Abstract: A semiconductor device package is described that includes a power consuming device (such as an SOC device). The power consuming device (120) may include one or more current consuming elements. A passive device (100) may be coupled (110) to the power consuming device. The passive device includes a plurality of passive elements formed on a semiconductor substrate. The passive elements are arranged in an array of structures (102) on the semiconductor substrate. The power consuming device and the passive device are coupled using one or more terminals (110). The passive device and power consuming device coupling may be configured in such a way that the power consuming device determines functionally the way the passive device elements will be used.

公开(公告)号：EP3461293A1

公开(公告)日：2019-04-03

申请号：EP17743453.7

申请日：2017-07-14

Applicant: Apple Inc.

Inventor： MATHEW, Binu K. ,  NG, Julia C. ,  ZERBE, Jared L.

IPC: G06N99/00

公开(公告)号：EP3031081A2

公开(公告)日：2016-06-15

申请号：EP14758191.2

申请日：2014-07-29

Applicant: Apple Inc.

Inventor： ZERBE, Jared L. ,  FANG, Emerson S. ,  ZHAI, Jun ,  SEARLES, Shawn

IPC: H01L25/16 ,  H01L23/64 ,  H01G4/228 ,  H01L23/13 ,  H01L25/18 ,  H01L25/065

CPC classification number: H01L27/101 ,  H01G4/228 ,  H01L23/13 ,  H01L23/481 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/50 ,  H01L23/642 ,  H01L24/14 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/16 ,  H01L25/18 ,  H01L28/40 ,  H01L2224/0401 ,  H01L2224/13025 ,  H01L2224/1403 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/16265 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/00014 ,  H01L2924/1033 ,  H01L2924/12042 ,  H01L2924/1205 ,  H01L2924/1427 ,  H01L2924/1432 ,  H01L2924/1434 ,  H01L2924/1436 ,  H01L2924/15153 ,  H01L2924/15159 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/157 ,  H01L2924/19011 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19103 ,  H01L2924/19104 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A semiconductor device package is described that includes a power consuming device (such as an SOC device). The power consuming device may include one or more current consuming elements. A passive device may be coupled to the power consuming device. The passive device may include a plurality of passive elements formed on a semiconductor substrate. The passive elements may be arranged in an array of structures on the semiconductor substrate. The power consuming device and the passive device may be coupled using one or more terminals. The passive device and power consuming device coupling may be configured in such a way that the power consuming device determines functionally the way the passive device elements will be used.

Abstract translation: 描述了包括电力消耗装置（诸如SOC装置）的半导体器件封装。 功耗设备可以包括一个或多个电流消耗元件。 无源设备可以耦合到功率消耗设备。 无源器件可以包括形成在半导体衬底上的多个无源元件。 无源元件可以布置在半导体衬底上的结构阵列中。 功率消耗装置和无源装置可以使用一个或多个终端来耦合。 无源器件和功率消耗器件耦合可以被配置成使得功率消耗器件功能地确定无源器件元件将被使用的方式。

公开(公告)号：WO2015020836A3

公开(公告)日：2015-02-12

申请号：PCT/US2014/048603

申请日：2014-07-29

Applicant: APPLE INC.

Inventor： ZERBE, Jared L. ,  FANG, Emerson S. ,  ZHAI, Jun ,  SEARLES, Shawn

IPC: H01L25/16 ,  H01L23/64 ,  H01G4/228 ,  H01L23/13 ,  H01L25/18 ,  H01L25/065

Abstract: A semiconductor device package is described that includes a power consuming device (such as an SOC device). The power consuming device (120) may include one or more current consuming elements. A passive device (100) may be coupled (110) to the power consuming device. The passive device may include a plurality of passive elements formed on a semiconductor substrate. The passive elements may be arranged in an array of structures (102) on the semiconductor substrate. The power consuming device and the passive device may be coupled using one or more terminals (110). The passive device and power consuming device coupling may be configured in such a way that the power consuming device determines functionally the way the passive device elements will be used.

公开(公告)号：WO2018017423A1

公开(公告)日：2018-01-25

申请号：PCT/US2017/042215

申请日：2017-07-14

Applicant: APPLE INC.

Inventor： MATHEW, Binu K. ,  NG, Julia C. ,  ZERBE, Jared L.

IPC: G06N99/00

CPC classification number: G06N20/00 ,  G06N5/04

Abstract: Systems and methods are disclosed for a server generating a plurality of proxy prediction models for each of a plurality of applications for use by client devices. Providing a prediction model based on a data distribution that more closely matches the user private data of the actual user of the client device, as opposed to a generic model, can improve the accuracy of predictions and improve the benefits to the user of the client device. The plurality of prediction models are generated by a server and provided to a plurality of clients. For a particular application, a client device can use previously collected private user data to select one of the plurality of prediction models for the application as being a closest matching prediction model to use for a particular user.

Abstract translation: 公开了系统和方法，用于服务器为多个客户端设备使用的多个应用中的每一个产生多个代理预测模型。 基于更接近匹配客户端设备的实际用户的用户私人数据的数据分布提供预测模型，与通用模型相反，可以提高预测的准确性并改善客户端设备的用户的益处 。 多个预测模型由服务器生成并提供给多个客户端。 对于特定的应用，客户端设备可以使用先前收集的私人用户数据来选择用于该应用的多个预测模型中的一个，作为用于特定用户的最接近的匹配预测模型。

公开(公告)号：EP4006972A2

公开(公告)日：2022-06-01

申请号：EP22150527.4

申请日：2014-07-29

Applicant: Apple Inc.

Inventor： ZERBE, Jared L. ,  FANG, Emerson S. ,  ZHAI, Jun ,  SEARLES, Shawn

IPC: H01L25/16 ,  H01L23/64 ,  H01G4/228 ,  H01L23/13 ,  H01L25/18 ,  H01L25/065

Abstract: A semiconductor device package is described that includes a power consuming device (such as an SOC device). The power consuming device (120) may include one or more current consuming elements. A passive device (100) may be coupled (110) to the power consuming device. The passive device includes a plurality of passive elements formed on a semiconductor substrate. The passive elements are arranged in an array of structures (102) on the semiconductor substrate. The power consuming device and the passive device are coupled using one or more terminals (110). The passive device and power consuming device coupling may be configured in such a way that the power consuming device determines functionally the way the passive device elements will be used.