Abstract:
A system that includes a regulator unit is disclosed. The regulator unit includes first and second phase units whose outputs are coupled to through first and second coupled inductors, respectively, to a power supply node of a circuit block. The first phase unit may be configured to discharge, for a first period of time, the power supply node through the first inductor in response to determining a sense current is greater than a demand current. The operation of the second phase unit may follow that of the first phase unit after a second period of time has elapsed.
Abstract:
A system (100) that includes a regulator circuit (101) is disclosed. The regulator circuit includes first (201a) and second (201b) phase units whose outputs are coupled to a power supply node (204) of a circuit block, via respective coupled inductors (211a, 211b). The first phase unit (201a) may initiate a charge cycle of the power supply node in response to assertion of a clock signal (208a) and generate a compensated current using currents measure (507, 508) through both inductors and the clock signal (208a). In response to a determination that the compensated current is greater than a demand current (210) generated using a voltage level of the power supply node and a reference voltage, the first phase unit may halt the charge cycle.
Abstract:
A method and apparatus for monitoring instantaneous load current is disclosed. In one embodiment, an integrated circuit includes a voltage regulator and at least one functional unit implemented thereon. The voltage regulator includes a supply circuit configured to provide a voltage to the functional unit, and a sense circuit configured to determine an amount of current provided to the functional unit by the supply circuit. The sense circuit may determine the instantaneous load current being provided to the functional unit. An indication circuit is configured to provide, to the functional unit, an indication of the amount of current supplied thereto by the supply circuit.
Abstract:
A method and apparatus for augmenting an external voltage regulator with a shunt integrated voltage regulator is disclosed. In one embodiment, an integrated circuit (IC) includes a load circuit coupled to a supply voltage node. The supply voltage node is electrically coupled to receive a supply voltage from an external voltage regulator. The IC also includes a shunt integrated voltage regulator coupled to the supply voltage node and implemented on the same IC die as the load circuit. If the supply voltage falls below a specified value (e.g., to increased current demand), the integrated voltage regulator may begin supplying current to the load. This may cause the supply voltage to return to within its specified range of the specified value, while allowing the external voltage regulator sufficient time to respond to the increased current demand. Thus, voltage droops on the supply voltage node may be minimized.
Abstract:
A semiconductor device package is described that includes a power consuming device (such as an SOC device). The power consuming device (120) may include one or more current consuming elements. A passive device (100) may be coupled (110) to the power consuming device. The passive device may include a plurality of passive elements formed on a semiconductor substrate. The passive elements may be arranged in an array of structures (102) on the semiconductor substrate. The power consuming device and the passive device may be coupled using one or more terminals (110). The passive device and power consuming device coupling may be configured in such a way that the power consuming device determines functionally the way the passive device elements will be used.
Abstract:
A semiconductor device package is described that includes a power consuming device (such as an SOC device). The power consuming device (120) may include one or more current consuming elements. A passive device (100) may be coupled (110) to the power consuming device. The passive device includes a plurality of passive elements formed on a semiconductor substrate. The passive elements are arranged in an array of structures (102) on the semiconductor substrate. The power consuming device and the passive device are coupled using one or more terminals (110). The passive device and power consuming device coupling may be configured in such a way that the power consuming device determines functionally the way the passive device elements will be used.
Abstract:
A semiconductor device package is described that includes a power consuming device (such as an SOC device). The power consuming device may include one or more current consuming elements. A passive device may be coupled to the power consuming device. The passive device may include a plurality of passive elements formed on a semiconductor substrate. The passive elements may be arranged in an array of structures on the semiconductor substrate. The power consuming device and the passive device may be coupled using one or more terminals. The passive device and power consuming device coupling may be configured in such a way that the power consuming device determines functionally the way the passive device elements will be used.
Abstract:
A power management circuit included in a computer system regulates a voltage level of a power supply node used by other circuits in the computer system. The power management circuit includes a control circuit and multiple phase circuits coupled to the regulated power supply node via corresponding inductors. The control circuit selectively activates particular ones of the multiple phase circuits allowing them source respective currents to the regulated power supply node. The control circuit also selectively activates particular ones of other phase circuits that are external to the power management circuit and coupled to the regulated power supply node via their own corresponding inductors. Once activated, the external phase circuits source respective currents to the regulated power supply node via their corresponding inductors.
Abstract:
An inductor is disclosed, including a first wire, a non-conductive material, and a shell. The non-conductive material may cover the first wire, with a portion of each end of the first wire uncovered. The shell may include a top portion and a bottom portion and include at least one magnetized layer and at least one gap between the first portion and the second portion. The shell may also surround a portion of the non-conductive material.