公开(公告)号：WO2023034684A1

公开(公告)日：2023-03-09

申请号：PCT/US2022/074965

申请日：2022-08-15

Applicant: APPLE INC.

Inventor： CHEN, Wei ,  ZHAO, Jie-Hua ,  ZHAI, Jun

IPC: H01L25/065 ,  H01L25/18 ,  H01L23/498 ,  H01L23/053 ,  H01L23/00

Abstract: Modules and methods of assembly are described. A module includes a lid mounted on a module substrate and covering a component. A stiffener structure may optionally be mounted between the lid and module substrate. A recess can be formed in any of an outer wall bottom surface of the lid, and top or bottom surface of the stiffener structure such that an adhesive layer at least partially fills the recess.

公开(公告)号：WO2021201990A1

公开(公告)日：2021-10-07

申请号：PCT/US2021/017445

申请日：2021-02-10

Applicant: APPLE INC.

Inventor： CHEN, Wei ,  ZHAO, Jie-Hua ,  ZHAI, Jun ,  CHANG, Po-Hao ,  LIN, Hsien-Che ,  KE, Ying-Chieh ,  HU, Kunzhong

IPC: H01L23/04 ,  H01L23/16 ,  H01L23/367 ,  H01L25/065 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/83385 ,  H01L2224/92125 ,  H01L23/24 ,  H01L23/3675 ,  H01L23/42 ,  H01L23/562 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L24/83 ,  H01L24/92 ,  H01L25/0655 ,  H01L25/18 ,  H01L2924/15311 ,  H01L2924/1615 ,  H01L2924/16151 ,  H01L2924/16153 ,  H01L2924/16251 ,  H01L2924/164 ,  H01L2924/19105 ,  H01L2924/3511

Abstract: Multiple chip module (MCM) structures are described. In an embodiment, a module includes a first and second components on the top side of a module substrate, a stiffener structure mounted on the top side of the module substrate, and a lid mounted on the stiffener structure and covering the first component and the second component. The stiffener is joined to the lid within a trench formed in a roof of the lid.

公开(公告)号：WO2014052273A1

公开(公告)日：2014-04-03

申请号：PCT/US2013/061316

申请日：2013-09-24

Applicant: APPLE INC.

Inventor： ZHAO, Jie-Hua ,  YANG, Yizhang ,  ZHAI, Jun ,  CHUNG, Chih-Ming

IPC: H01L25/10 ,  H01L25/00

CPC classification number: H01L25/50 ,  H01L23/3128 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18161 ,  H01L2924/3511 ,  H01L2924/37001 ,  Y02P80/30 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A PoP (package-on-package) package includes a bottom package coupled to a top package. Terminals on the top of the bottom package are coupled to terminals on the bottom of the top package with an electrically insulating material located between the upper surface of the bottom package and the lower surface of the top package. The bottom package and the top package are coupled during a process that applies force to bring the packages together while heating the packages.

Abstract translation: PoP（封装封装）封装包括一个耦合到顶部封装的底部封装。 底部封装顶部的端子通过位于底部封装的上表面和顶部封装的下表面之间的电绝缘材料耦合到顶部封装的底部上的端子。 底部包装和顶部包装在加工包装的过程中被联接，该过程中施加力以使包装在一起。

公开(公告)号：WO2019199472A1

公开(公告)日：2019-10-17

申请号：PCT/US2019/024647

申请日：2019-03-28

Applicant: APPLE INC.

Inventor： DABRAL, Sanjay ,  KILIC, Bahattin ,  ZHAO, Jie-Hua ,  HU, Kunzhong ,  RYU, Suk-Kyu

IPC: H01L23/00 ,  H01L25/065 ,  G06F13/40 ,  G06F15/78

Abstract: Multi-chip systems (100) and structures for modular scaling are described. In some embodiments an interfacing bar (150) is utilized to couple adjacent chips (102, 104). For example, a communication bar (150) may utilized to coupled logic chips (104), and memory bar (150) may be utilized to couple multiple memory chips (102) to a logic chip (104).

公开(公告)号：EP4235777A3

公开(公告)日：2024-02-28

申请号：EP23177407.6

申请日：2021-02-10

Applicant: Apple Inc.

Inventor： CHEN, Wei ,  ZHAO, Jie-Hua ,  ZHAI, Jun ,  CHANG, CHANG ,  LIN, Hsien-Che ,  KE, Ying-Chieh ,  HU, Kunzhong

IPC: H01L23/04 ,  H01L23/16 ,  H01L23/367 ,  H01L25/065 ,  H01L23/42 ,  H01L25/03

Abstract: Multiple chip module (MCM) structures are described. In an embodiment, a module includes a first and second components on the top side of a module substrate, a stiffener structure mounted on the top side of the module substrate, and a lid mounted on the stiffener structure and covering the first component and the second component. The stiffener is joined to the lid within a trench formed in a roof of the lid.

公开(公告)号：EP4235777A2

公开(公告)日：2023-08-30

申请号：EP23177407.6

申请日：2021-02-10

Applicant: Apple Inc.

Inventor： CHEN, Wei ,  ZHAO, Jie-Hua ,  ZHAI, Jun ,  CHANG, CHANG ,  LIN, Hsien-Che ,  KE, Ying-Chieh ,  HU, Kunzhong

IPC: H01L25/065

Abstract: Multiple chip module (MCM) structures are described. In an embodiment, a module includes a first and second components on the top side of a module substrate, a stiffener structure mounted on the top side of the module substrate, and a lid mounted on the stiffener structure and covering the first component and the second component. The stiffener is joined to the lid within a trench formed in a roof of the lid.

公开(公告)号：EP4128332A1

公开(公告)日：2023-02-08

申请号：EP21711077.4

申请日：2021-02-10

Applicant: Apple Inc.

Inventor： CHEN, Wei ,  ZHAO, Jie-Hua ,  ZHAI, Jun ,  CHANG, Po-Hao ,  LIN, Hsien-Che ,  KE, Ying-Chieh ,  HU, Kunzhong

IPC: H01L23/04 ,  H01L23/16 ,  H01L23/367 ,  H01L25/065