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公开(公告)号：US20230103165A1
公开(公告)日：2023-03-30
申请号：US18071444
申请日：2022-11-29
Applicant: Applied Materials, Inc.
Inventor： Yaoling Pan , Patrick John Tae , Michael D. Willwerth , Leonard Tedeschi , Kiyki-Shiy N. Shang , Mikhail V. Taraboukhine , Charles R. Hardy , Sivasankar Nagarajan
Abstract: Capacitive sensors and capacitive sensing data integration for plasma chamber condition monitoring are described. In an example, a plasma chamber monitoring system includes a plurality of capacitive sensors, a capacitance digital converter, and an applied process server coupled to the capacitance digital converter, the applied process server including a system software. The capacitance digital converter includes an isolation interface coupled to the plurality of capacitive sensors, a power supply coupled to the isolation interface, a field-programmable gate-array firmware coupled to the isolation interface, and an application-specific integrated circuit coupled to the field-programmable gate-array firmware.
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公开(公告)号：US11545346B2
公开(公告)日：2023-01-03
申请号：US16812081
申请日：2020-03-06
Applicant: Applied Materials, Inc.
Inventor： Yaoling Pan , Patrick John Tae , Michael D. Willwerth , Leonard Tedeschi , Kiyki-Shiy N. Shang , Mikhail V. Taraboukhine , Charles R. Hardy , Sivasankar Nagarajan
Abstract: Capacitive sensors and capacitive sensing data integration for plasma chamber condition monitoring are described. In an example, a plasma chamber monitoring system includes a plurality of capacitive sensors, a capacitance digital converter, and an applied process server coupled to the capacitance digital converter, the applied process server including a system software. The capacitance digital converter includes an isolation interface coupled to the plurality of capacitive sensors, a power supply coupled to the isolation interface, a field-programmable gate-array firmware coupled to the isolation interface, and an application-specific integrated circuit coupled to the field-programmable gate-array firmware.
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公开(公告)号：US20210280400A1
公开(公告)日：2021-09-09
申请号：US16812081
申请日：2020-03-06
Applicant: Applied Materials, Inc.
Inventor： Yaoling Pan , Patrick John Tae , Michael D. Willwerth , Leonard Tedeschi , Kiyki-Shiy N. Shang , Mikhail V. Taraboukhine , Charles R. Hardy , Sivasankar Nagarajan
Abstract: Capacitive sensors and capacitive sensing data integration for plasma chamber condition monitoring are described. In an example, a plasma chamber monitoring system includes a plurality of capacitive sensors, a capacitance digital converter, and an applied process server coupled to the capacitance digital converter, the applied process server including a system software. The capacitance digital converter includes an isolation interface coupled to the plurality of capacitive sensors, a power supply coupled to the isolation interface, a field-programmable gate-array firmware coupled to the isolation interface, and an application-specific integrated circuit coupled to the field-programmable gate-array firmware.
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公开(公告)号：US20230343568A2
公开(公告)日：2023-10-26
申请号：US18071444
申请日：2022-11-29
Applicant: Applied Materials, Inc.
Inventor： Yaoling Pan , Patrick John Tae , Michael D. Willwerth , Leonard Tedeschi , Kiyki-Shiy N. Shang , Mikhail V. Taraboukhine , Charles R. Hardy , Sivasankar Nagarajan
CPC classification number: H01J37/32935 , H01J37/32807 , H01J37/32926 , G01N27/228 , H01J37/32853 , H01J2237/24592 , H01J2237/24495 , H01J2237/24564
Abstract: Capacitive sensors and capacitive sensing data integration for plasma chamber condition monitoring are described. In an example, a plasma chamber monitoring system includes a plurality of capacitive sensors, a capacitance digital converter, and an applied process server coupled to the capacitance digital converter, the applied process server including a system software. The capacitance digital converter includes an isolation interface coupled to the plurality of capacitive sensors, a power supply coupled to the isolation interface, a field-programmable gate-array firmware coupled to the isolation interface, and an application-specific integrated circuit coupled to the field-programmable gate-array firmware.
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5.发明授权公开(公告)号：US11781214B2
公开(公告)日：2023-10-10
申请号：US16526268
申请日：2019-07-30
Applicant: APPLIED MATERIALS, INC.
Inventor： Patrick Tae , Yaoling Pan , Leonard M. Tedeschi
CPC classification number: C23C14/52 , C23C14/545 , C23C16/52 , G01N27/22 , H01J37/32935
Abstract: Methods and apparatus for a processing chamber are provided herein. The apparatus includes, for example, an inner volume defined in the processing chamber; a first sensor assembly coupled to a surface located in the inner volume of the processing chamber and including a first electrode configuration configured to measure an electrical characteristic associated with a film deposited within the inner volume of the processing chamber; and a second sensor assembly coupled to the surface located in the inner volume of the processing chamber in relative proximity to the first sensor assembly and including a second electrode configuration, different from the first electrode configuration, configured to measure the same electrical characteristic as the first electrode configuration.
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Patent Agency Ranking
公开(公告)号：US11551905B2
公开(公告)日：2023-01-10
申请号：US15925739
申请日：2018-03-19
Applicant: APPLIED MATERIALS, INC.
Inventor： Yaoling Pan , Vijaykumar Krithivasan , Shimin Mao , Kelvin Chan , Michael D. Willwerth , Anantha Subramani , Ashish Goel , Chih-shun Lu , Philip Allan Kraus , Patrick John Tae , Leonard Tedeschi
IPC: H01J37/244 , H01L21/67 , H01L41/047 , H01L41/053 , H01L41/29 , H01L41/04 , H01J37/32 , H01L41/31
Abstract: Embodiments described herein include a resonant process monitor and methods of forming such a resonant process monitor. In an embodiment, the resonant process monitor includes a frame that has a first opening and a second opening. In an embodiment, a resonant body seals the first opening of the frame. In an embodiment, a first electrode on a first surface of the resonant body contacts the frame and a second electrode is on a second surface of the resonant body. Embodiments also include a back plate that seals the second opening of the frame. In an embodiment the back plate is mechanically coupled to the frame, and the resonant body, the back plate, and interior surfaces of the frame define a cavity.
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公开(公告)号：US11415538B2
公开(公告)日：2022-08-16
申请号：US16812071
申请日：2020-03-06
Applicant: Applied Materials, Inc.
Inventor： Yaoling Pan , Patrick John Tae , Leonard Tedeschi , Michael D. Willwerth , Daniel Thomas McCormick
Abstract: Embodiments disclosed herein include a sensor assembly. In an embodiment, the sensor assembly comprises a sensor module and a housing assembly. In an embodiment, the sensor module comprises a substrate, a capacitor with a first electrode and a second electrode on the substrate, and a capacitive-to-digital converter (CDC) electrically coupled to the first electrode and the second electrode. In an embodiment, the housing assembly is attached to the sensor module and comprises a shaft, wherein the shaft is hollow, and a cap over a first end of the shaft, wherein the cap has an opening to expose the capacitor.
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8.发明授权公开(公告)号：US12123090B2
公开(公告)日：2024-10-22
申请号：US18368285
申请日：2023-09-14
Applicant: Applied Materials, Inc.
Inventor： Patrick Tae , Yaoling Pan , Leonard M Tedeschi
CPC classification number: C23C14/52 , C23C14/545 , C23C16/52 , G01N27/22 , H01J37/32935
Abstract: Methods and apparatus for a processing chamber are provided herein. The apparatus includes, for example, an inner volume defined in the processing chamber; a first sensor assembly coupled to a surface located in the inner volume of the processing chamber and including a first electrode configuration configured to measure an electrical characteristic associated with a film deposited within the inner volume of the processing chamber; and a second sensor assembly coupled to the surface located in the inner volume of the processing chamber in relative proximity to the first sensor assembly and including a second electrode configuration, different from the first electrode configuration, configured to measure the same electrical characteristic as the first electrode configuration.
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公开(公告)号：US12009236B2
公开(公告)日：2024-06-11
申请号：US16391262
申请日：2019-04-22
Applicant: Applied Materials, Inc.
Inventor： Yaoling Pan , Patrick John Tae , Michael D. Willwerth , Leonard M. Tedeschi , Daniel Sang Byun , Philip Allan Kraus , Phillip A. Criminale , Changhun Lee , Rajinder Dhindsa , Andreas Schmid , Denis M. Koosau
IPC: H01L21/67 , H01J37/32 , H01L21/66 , H03K17/955
CPC classification number: H01L21/67259 , H01J37/32477 , H01J37/3288 , H01L22/12 , H03K17/955 , H01J2237/022
Abstract: The present disclosure generally relates to a method and apparatus for determining a metric related to erosion of a ring assembly used in an etching within a plasma processing chamber. In one example, the apparatus is configured to obtain a metric indicative of erosion on an edge ring disposed on a substrate support assembly in a plasma processing chamber. A sensor obtains the metric for the edge ring. The metric correlates to the quantity of erosion in the edge ring. In another example, the ring sensor may be arranged outside of a periphery of a substrate support assembly. The metric may be acquired by the ring sensor through a plasma screen.
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公开(公告)号：US11959868B2
公开(公告)日：2024-04-16
申请号：US17166967
申请日：2021-02-03
Applicant: Applied Materials, Inc.
Inventor： Xiaopu Li , Kallol Bera , Yaoling Pan , Kelvin Chan , Amir Bayati , Philip Allan Kraus , Kenric T. Choi , William John Durand
CPC classification number: G01N27/22 , C23C16/45544 , C23C16/45561 , C23C16/52 , G01N33/0027 , H01L21/67017 , H01L21/67253
Abstract: Embodiments disclosed herein include gas concentration sensors, and methods of using such gas concentration sensors. In an embodiment, a gas concentration sensor comprises a first electrode. In an embodiment the first electrode comprises first fingers. In an embodiment, the gas concentration sensor further comprises a second electrode. In an embodiment, the second electrode comprises second fingers that are interdigitated with the first fingers.
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