Adjustable resolution interference lithography system
    1.
    发明专利
    Adjustable resolution interference lithography system 有权
    可调分辨率干涉光刻系统

    公开(公告)号:JP2006066919A

    公开(公告)日:2006-03-09

    申请号:JP2005246663

    申请日:2005-08-26

    Abstract: PROBLEM TO BE SOLVED: To provide a system provided with an adjustable resolution which is free of the complexity of matching an interference lithography system in common use.
    SOLUTION: There are provided a laser that outputs a laser beam 106, a beam splitter 103 for dividing the laser beam 106 into a plurality of beams 107, and a prism 101 that forms interference fringes on a substrate by using the plurality of beams, wherein the resolution of a lithography system can be adjusted without exchanging each optical components, in an optical path of the lithography system.
    COPYRIGHT: (C)2006,JPO&NCIPI

    Abstract translation: 要解决的问题:提供一种具有可调分辨率的系统,其在常见的使用中没有匹配干涉光刻系统的复杂性。 解决方案:提供了一种激光器,其输出激光束106,用于将激光束106分成多个光束107的分束器103以及通过使用多个激光束106在基板上形成干涉条纹的棱镜101 光束,其中可以调整光刻系统的分辨率而不在光刻系统的光路中交换每个光学部件。 版权所有(C)2006,JPO&NCIPI

    Adjustable resolution interference lithography system
    2.
    发明专利
    Adjustable resolution interference lithography system 有权
    可调分辨率干涉光刻系统

    公开(公告)号:JP2009076937A

    公开(公告)日:2009-04-09

    申请号:JP2008323797

    申请日:2008-12-19

    Abstract: PROBLEM TO BE SOLVED: To provide a system not involving the complication of adjustment of a conventional interference lithography system but having an adjustable solution.
    SOLUTION: The system includes a laser which outputs a laser beam 106, a beam splitter 103 which splits the laser beam 106 into a plurality of beams 107, and a prism 101 which forms interference fringes on a substrate using the plurality of beams 107. The resolution of the lithography system can be adjusted without replacing any optical component on a light path of the lithography system.
    COPYRIGHT: (C)2009,JPO&INPIT

    Abstract translation: 要解决的问题:提供一种不涉及常规干涉光刻系统的调整的复杂性但具有可调整解决方案的系统。 解决方案:该系统包括输出激光束106的激光器,将激光束106分成多个光束107的分束器103以及使用多个光束在基板上形成干涉条纹的棱镜101 可以调节光刻系统的分辨率而不替换光刻系统的光路上的任何光学部件。 版权所有(C)2009,JPO&INPIT

    3.
    发明专利
    未知

    公开(公告)号:DE69732011T2

    公开(公告)日:2005-05-19

    申请号:DE69732011

    申请日:1997-10-02

    Abstract: An alignment system for use in semiconductor manufacturing that matches pairs of like edges of alignment marks. Grating type alignment marks are illuminated by a predetermined illumination pattern with the reflected and/or scattered electromagnetic radiation collected by a detector. Like edges are selected from the collected electromagnetic radiation and matched. A signal analyzer analyses the matched like edges and obtains alignment information. The matching of like edges results in relatively process insensitive detection of wafer alignment marks. The distance between like edges is substantially less effected by wafer processing. Wafer alignment marks can thereby be more accurately detected, resulting in improved positioning and alignment accuracies. This improves and advances the technology use to manufacture semiconductor devices.

    LITHOGRAPHIC APPARATUS AND METHOD.

    公开(公告)号:NL2012204A

    公开(公告)日:2014-12-18

    申请号:NL2012204

    申请日:2014-02-05

    Abstract: A lithographic apparatus is provided. The lithographic apparatus includes a reticle and an electrostatic clamp configured to releasably hold the reticle. The electrostatic clamp includes a first substrate having opposing first and second surfaces, a plurality of burls located on the first surface and configured to contact the reticle, a second substrate having opposing first and second surfaces. The first surface of the second substrate is coupled to the second surface of the first substrate. A plurality of cooling elements are located between the first surface of the second substrate and the second surface of the first substrate. The cooling elements are configured to cause electrons to travel from the second surface of the first substrate to the first surface of the second substrate. Each cooling element is substantially aligned with a respective burl.

    6.
    发明专利
    未知

    公开(公告)号:DE69732011D1

    公开(公告)日:2005-01-27

    申请号:DE69732011

    申请日:1997-10-02

    Abstract: An alignment system for use in semiconductor manufacturing that matches pairs of like edges of alignment marks. Grating type alignment marks are illuminated by a predetermined illumination pattern with the reflected and/or scattered electromagnetic radiation collected by a detector. Like edges are selected from the collected electromagnetic radiation and matched. A signal analyzer analyses the matched like edges and obtains alignment information. The matching of like edges results in relatively process insensitive detection of wafer alignment marks. The distance between like edges is substantially less effected by wafer processing. Wafer alignment marks can thereby be more accurately detected, resulting in improved positioning and alignment accuracies. This improves and advances the technology use to manufacture semiconductor devices.

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