Abstract:
A method to determine the usefulness of an alignment mark of a first pattern in transferring a second pattern to a substrate relative to the first pattern already present on the substrate includes measuring the position of the alignment mark, modeling the position of the alignment mark, determining the model error between measured and modeled position, measuring a corresponding overlay error between first and second pattern and comparing the model error with the overlay error to determine the usefulness of the alignment mark. Subsequently this information can be used when processing next substrates thereby improving the overlay for these substrates. A lithographic apparatus and/or overlay measurement system may be operated in accordance with the method.
Abstract:
A substrate is provided with device structures and metrology structures (800). The device structures include materials exhibiting inelastic scattering of excitation radiation of one or more wavelengths. The device structures include structures small enough in one or more dimensions that the characteristics of the inelastic scattering are influenced significantly by quantum confinement. The metrology structures (800) include device-like structures (800b) similar in composition and dimensions to the device features, and calibration structures (800a). The calibration structures are similar to the device features in composition but different in at least one dimension. Using an inspection apparatus and method implementing Raman spectroscopy, the dimensions of the device-like structures can be measured by comparing spectral features of radiation scattered inelastically from the device-like structure and the calibration structure.
Abstract:
Position and curvature information of a patterning device (200) may be determined directly from the patterning device and controlled based on the determined information. In one embodiment, a lithographic apparatus that uses a patterning device to expose a substrate (W) comprises a position determining system that is operative to determine a relative position of the patterning device with respect to a predetermined reference frame. The patterning device may be configured for creating a patterned radiation beam from a radiation beam incident on a major surface of the patterning device. The patterning device may have a side surface (220, 222) having an edge in common with the major surface. The position determining system may include an interferometer (224a-c) that is operative to transmit light (226a-c) to the side surface and to receive the transmitted light after the transmitted light has been reflected at the side surface such that the position determining system being operative to determine a quantity representative of the relative position of the patterning device from the received reflected transmitted light..