公开(公告)号：WO2019224176A1

公开(公告)日：2019-11-28

申请号：PCT/EP2019/063053

申请日：2019-05-21

Applicant: ASML NETHERLANDS B.V.

Inventor： LI, Danying ,  FAN, Chi-Hsiang ,  ELMALK, Abdalmohsen ,  ZHANG, Youping ,  CHEN, Jay, Jianhui ,  HUANG, Kui-Jun

IPC: G03F7/20

Abstract: Described herein is are method for determining a stack configuration for a substrate subjected a patterning process. The method includes obtaining (i) measurement data of a stack configuration with location information on a printed substrate, (ii) a substrate model configured to predict a stack characteristic based on a location of the substrate, and (iii) a stack map including a plurality of stack configurations based on the substrate model. The method iteratively determines values of model parameters of the substrate model based on a fitting between the measurement data and the plurality of stack configurations of the stack map; and predicts an optimum stack configuration at a particular location based on the substrate model using the values of the model parameters.