公开(公告)号：WO2023088623A1

公开(公告)日：2023-05-25

申请号：PCT/EP2022/078928

申请日：2022-10-18

Applicant: ASML NETHERLANDS B.V.

Inventor： JIN, Shengcheng ,  PU, Lingling ,  YU, Liangjiang

IPC: G06T3/00 ,  G06T5/00 ,  G06T7/00 ,  H01J37/26

Abstract: Apparatuses, systems, and methods for providing beams for defect detection and defect location identification associated with a sample of charged particle beam systems. In some embodiments, a method may include obtaining an image of a sample; determining defect characteristics from the image; generating an updated image based on the determined defect characteristics and the image; and aligning the updated image with a reference image.

公开(公告)号：WO2022229312A1

公开(公告)日：2022-11-03

申请号：PCT/EP2022/061319

申请日：2022-04-28

Applicant: ASML NETHERLANDS B.V.

Inventor： WANG, Jingchun ,  YE, Chuang ,  JIN, Shengcheng

IPC: G03F7/20 ,  G06K9/00

Abstract: Apparatuses, systems, and methods for grouping a plurality of patterns extracted from image data are disclosed. In some embodiments, the method for grouping the patterns comprises receiving the image data including the plurality of patterns that represent features to be formed on a portion of a wafer. The method also comprises separating the plurality of patterns after Fourier Transform into multiple sets of patterns. The method further comprises performing, to a respective set of patterns, a hierarchical clustering to obtain a plurality of subsets of patterns by recursively evaluating features related to similarity between patterns within the respective set of patterns.

公开(公告)号：WO2021204739A1

公开(公告)日：2021-10-14

申请号：PCT/EP2021/058831

申请日：2021-04-06

Applicant: ASML NETHERLANDS B.V.

Inventor： JIN, Shengcheng ,  ZHANG, Haili ,  CHEN, Zhichao

IPC: G03F7/20 ,  H01J37/28 ,  G01N21/956 ,  G06T7/00

Abstract: An improved apparatus and method for facilitating inspection of a wafer are disclosed. An improved method for facilitating inspection of a wafer comprises identifying a plurality of repeating patterns from reference image data associated with a layout design of the wafer. The method also comprises determining a pattern feature of one of the identified plurality of repeating patterns based on a change of a first characteristic of the reference image data. The method further comprises causing a first area of the wafer corresponding to the determined pattern feature to be evaluated.

公开(公告)号：WO2018134286A1

公开(公告)日：2018-07-26

申请号：PCT/EP2018/051162

申请日：2018-01-18

Applicant: ASML NETHERLANDS B.V. ,  HERMES MICROVISION, INC.

Inventor： FANG, Wei ,  ZHANG, Haili ,  CHEN, Zhichao ,  JIN, Shengcheng

IPC: G03F7/20 ,  G05B19/418 ,  G06T7/00 ,  G01N21/956

Abstract: A defect pattern grouping method is disclosed. The defect pattern grouping method comprises obtaining a first polygon that represents a first defect from an image of a sample, comparing the first polygon with a set of one or more representative polygons of a defect-pattern collection, and grouping the first polygon with any one or more representative polygons identified based on the comparison.

公开(公告)号：EP4555474A1

公开(公告)日：2025-05-21

申请号：EP23745408.7

申请日：2023-07-06

Applicant: ASML Netherlands B.V.

Inventor： JIN, Shengcheng ,  ZHANG, Datong ,  ZHU, Xuechen ,  JEN, Chih-Yu ,  TANG, Liang ,  YEH, Hsiang Ting

IPC: G06T7/00