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公开(公告)号:US20220404711A1
公开(公告)日:2022-12-22
申请号:US17763698
申请日:2020-09-22
Applicant: ASML NETHERLANDS B.V.
Inventor: Ning GU , Liping REN , Kui-Jun HUANG , Jian WU
Abstract: A method for monitoring performance of a manufacturing process is described. The method includes receiving one or more input signals that convey information related to geometry of a substrate generated by the manufacturing process; and determining, with a prediction model, variation in the manufacturing process based on the one or more input signals. A method for predicting substrate geometry associated with a manufacturing process is also described. The method includes receiving input information including geometry information and manufacturing process information for a substrate; and predicting, using a machine learning prediction model, output substrate geometry based on the input information. The method may further include tuning the predicted output substrate geometry. The tuning includes comparing the output substrate geometry to corresponding physical substrate measurements and/or predictions from a different non-machine learning prediction model, generating a loss function based on the comparison, and optimizing the loss function.
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公开(公告)号:US20190339211A1
公开(公告)日:2019-11-07
申请号:US16465161
申请日:2017-11-23
Applicant: ASML NETHERLANDS B.V.
Inventor: Ralph Timotheus HUIJGEN , Marc Jurian KEA , Marcel Theodorus Maria VAN KESSEL , Masashi ISHIBASHI , Chi-Hsiang FAN , Hakki Ergün CEKLI , Youping ZHANG , Maurits VAN DER SCHAAR , Liping REN
IPC: G01N21/956 , G03F7/20 , H01L21/66 , G03F9/00
Abstract: A method, system and program for determining a position of a feature referenced to a substrate. The method includes measuring a position of the feature, receiving an intended placement of the feature and determining an estimate of a placement error based on knowledge of a relative position of a first reference feature referenced to a first layer on a substrate with respect to a second reference feature referenced to a second layer on a substrate. The updated position may be used to position the layer of the substrate having the feature, or another layer of the substrate, or another layer of another substrate.
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公开(公告)号:US20250053097A1
公开(公告)日:2025-02-13
申请号:US18716806
申请日:2022-11-22
Applicant: ASML NETHERLANDS B.V.
Inventor: Kui-Jun HUANG , Liping REN
IPC: G03F7/00
Abstract: A correction to an error of overlay measurement which accounts for target structure asymmetry using a neural network is described. According to embodiments, an overlay measurement accuracy can be improved by accounting for multiple and/or asymmetric perturbations in the target structure. A trained neural network is described which generates a correction value for overlay measurement based on a measure of asymmetry. Based on an as-measured overlay measurement, which may not account for target structure asymmetry, and the correction value, a true overlay measurement is determined-which can exhibit improved accuracy and reduced uncertainty versus uncorrected values.
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