DETERMINING HOT SPOT RANKING BASED ON WAFER MEASUREMENT

    公开(公告)号:WO2020064544A1

    公开(公告)日:2020-04-02

    申请号:PCT/EP2019/075326

    申请日:2019-09-20

    Abstract: A method of hot spot ranking for a patterning process. The method includes obtaining (i) a set of hot spots of a patterning process, (ii) measured values of parameters of the patterning process corresponding to the set of hot spots, and (ii) simulated values of the parameters of the patterning process corresponding to the set of hot spots; determining a measurement feedback based on the measured values and the simulated values of the parameters of the patterning process; and determining, via simulation of a process model of the patterning process, a ranking of a hot spot within the set of hot spots, generated by the simulation, based on the measurement feedback.

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