Abstract:
PURPOSE: A method for manufacturing a device and a lithography apparatus are provided to reduce the unbalance of the intensity of radiated ray by regulating the phases of diffracted radiation ray. CONSTITUTION: Radiation ray beam is used for illuminating the mask pattern of an alternating phase shift mask in order to obtain diffracted radiation ray beam(DB). The mask pattern is formed on a substrate using a projection system. The phases of the diffracted radiation ray beam are regulated using an optical phase regulator.
Abstract:
PROBLEM TO BE SOLVED: To provide a method for increasing a depth of focus of a lithographic apparatus. SOLUTION: The method includes: a step of forming a diffracted beam of radiation by radiating a patterning device pattern with a radiation beam; illuminating a phase modulation element with the diffracted beams of radiation; and a step of transforming a phase-wavefront of a portion of the diffracted beams of radiation into a first phase-wavefront having a first focal plane for the lithographic apparatus, and a second phase-wavefront having a second focal plane for the lithographic apparatus, wherein the transforming step includes: a step of subjecting a phase of a first portion of a first diffracted beam of radiation and a phase of a corresponding first portion of a second diffracted beam of radiation to a phase change which results in an at least partial formation of the first phase-wavefront; and subjecting a phase of a second portion of the first diffracted beam of radiation and a phase of a corresponding second portion of the second diffracted beam of radiation to a phase change which results in an at least partial formation of the second phase-wavefront. COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a method of manufacturing a device that acquires the aberration of the projection system of a lithographic projector, in terms of Zernike expansion. SOLUTION: The field distribution of displacement errors and the focal plane distortion of a projected image are calculated based on Zernike aberration which quantifies the relation between a Zernike aberration components and the error of the image and a sensitivity coefficient. Then the compensation applied to the lithographic projector for minimizing the error of the image is determined by executing calculation and applied to the projector. The compensation increases one component of the aberration of the projector in order to lower the effects of the other aberrations, and consequently, the quality of the image as a whole is improved.
Abstract:
PROBLEM TO BE SOLVED: To improve image characteristics in lithographic equipment.SOLUTION: A lithographic equipment includes a phase adjuster that adjusts the phase of a light wave crossing an optical device of the phase adjuster while exposing a pattern onto a substrate. In one embodiment, the optical device is a thermally controllable optical device in a projection system of the lithographic equipment. In use, the pattern is illuminated in illumination mode containing off-axis radiation beam. This beam is diffracted with zeroth and first-order diffraction beams slanted inversely and asymmetrically relative to an optical axis. An area the first-order diffraction beam crosses the optical device is characterized. The image characteristics of the pattern is optimized by calculating the optical phase of a preferable first-order diffraction beam relative to the optical phase of the zeroth diffraction beam. The phase adjuster is controlled so as to apply the preferable optical phase to the first-order diffraction beam.
Abstract:
PROBLEM TO BE SOLVED: To form a pattern on a substrate regularly and uniformly as much as possible in spacer lithographic processing. SOLUTION: A lithographic method includes steps of: exposing a first material layer to a radiation beam whose focal characteristic is controlled so as to control a sidewall angle of sidewalls in order to form a first pattern feature having the sidewalls on the first material layer; forming a second material layer for forming coating on the sidewalls of the first pattern on the first pattern; removing a part of the second layer to leave the coating of the second layer on the sidewalls of the first pattern; removing the first pattern formed on a first layer to leave at least a part of the second layer forming the coating on the sidewalls of the first pattern on the substrate; and forming a second pattern feature on a position adjacent to the sidewall position of the first pattern feature in which a part of the second layer is removed. COPYRIGHT: (C)2011,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a method of acquiring information at least indicative of a focal property of a lithographic apparatus. SOLUTION: The method includes steps of: illuminating a patterning device pattern with a radiation beam having a symmetric illumination mode, the patterning device pattern having a first pattern feature that substantially diffracts radiation, and a second pattern feature that does not substantially diffract radiation; introducing an asymmetry relative to an optical axis, in the substantially diffracted radiation element, through illuminating the phase modulation element with radiation emanating from the patterning device pattern; forming a receiving element pattern on the receiving element by illuminating a radiation beam receiving element with radiation emanating from the phase modulation element, the receiving element pattern having first and second features related to the first and second patterns respectively; acquiring positional information regarding relative positions of the first and second features; and determining information at least indicative of the focal property of the lithographic apparatus from the acquired positional information. COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a method of optimizing a method for double patterning. SOLUTION: This optimization method records control variables such as a control dose and a focal point, in each of processes in a double patterning lithographic process, and measures characteristics of intermediate features such as a critical dimension and a sidewall angle in a double patterning process. Then, the final feature is modeled, and a disturbance between a measured value and a model is measured, and the values of the control variables are optimized. COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a technique capable of forming a feature of a critical dimension smaller than a limit of a single exposure step. SOLUTION: A multiple-exposure lithographic process in which a developed resist pattern derived from a first exposure is present within a second resist layer that is exposed in a second exposure of the multiple-exposure lithographic process. A second mask pattern used in a second exposure process includes at least one localized adjustment to at least one feature thereof to compensate for scattering effects of the developed resist pattern that is present when the second exposure is performed. COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To reduce a CD error (an obtained limit dimension of a minimum feature printed by lithography) by optical proximity effect. SOLUTION: A lithographic apparatus includes a phase adjuster to adjust a phase of an optical wave traversing an optical element of the phase adjuster during exposure of a pattern on a substrate. In an embodiment, an optical element is a heat controllable optical element in a projection system of the lithographic apparatus. In use, a pattern is illuminated with an illumination mode including an off-axis radiation beam. This beam is diffracted into a number of first-order diffracted beams, one is associated with a first pitch in the pattern along a first direction, another is associated with a second pitch along a different, second direction in the pattern. An area is identified where the first-order diffracted beam associated with the first pitch traverses the optical element. An image characteristic of an image of the pattern is optimized by calculating a desired optical phase of this first-order diffracted beam in relation to the optical phase of the other first-order diffracted beam. The phase adjuster is controlled to apply the desired optical phase to the first-order diffracted beam. COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a mask which eliminates or reduces the occurrence of phase offset undesirable for patterned radiation.SOLUTION: A lithographic mask includes a substrate which allows radiation having a specific wavelength to substantially transmit therethrough. The substrate includes a radiation absorption material with a specific pattern. The pattern is configured to impart a further pattern to the cross section of the radiation beam having a specific wavelength. The thickness of the absorption material is substantially equal to the value of the specific wavelength divided by the refractive index of the absorption material.