Abstract:
PROBLEM TO BE SOLVED: To provide a method, a system and an apparatus for reducing reaction loads between components, vibration of a support mechanism, and relative movement, in a lithography system. SOLUTION: The lithography system consists of a non-isolated structure and an isolated structure which is supported by the non-isolated structure. The isolated structure is provided with a movable stage supported by the isolated structure; a linear motor including a first linear motor element and a second linear motor element, in which the first linear motor element is coupled to the movable stage; a plurality of flexure plates for mounting the second linear motor element on the isolated structure; and a flexure rod coupled between the non-isolated structure and the second linear motor element. COPYRIGHT: (C)2004,JPO
Abstract:
PROBLEM TO BE SOLVED: To provide a method for Y-direction position correction of masked object shifts caused by Z-direction offset and oblique lighting. SOLUTION: In a reflective lithographic projection apparatus, shifts of a mask pattern image in the scanning direction, which are caused by changes in the position of the mask pattern surface along the optical axis, are corrected by shifting the relative position(s) of the mask and/or a substrate in the scanning direction. Rotating the relative position(s) of the mask and/or the substrate around the optical axis can correct image rotation errors. After installing the mask in the lithographic projection apparatus, changes in the position of the mask pattern surface along the optical axis can be determined by using an interferometer. These changes can be mapped and stored to be used for controlling the lithographic projection apparatus. COPYRIGHT: (C)2005,JPO&NCIPI
Abstract:
POSITION CORRECTION IN Y OF MASK OBJECT SHIFT DUE TO Z OFFSET AND NON- PERPENDICULAR ILLUMINATION In a reflective lithographic projection apparatus, shifts in the image of a pattern of a mask in the scanning direction caused by variations in the position of the pattern surface of the mask along the optical axis are corrected by shifting of the relative position of the mask and/or the substrate in the scanning direction. Correction of the image rotation error may also be accomplished by rotation of the relative positions of the mask and/or the substrate about the optical axis. Variations in the position of the pattern surface of the mask along the optical axis may be determined by interferometers upon installation of the mask to the lithographic projection apparatus. The variations may be mapped and stored to provide control of the lithographic projection apparatus.